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Three-Dimensional Integrated Circuit (3D Ic/Chip) & Through-Silicon Via (Tsv) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology, Products and Applications - Product Image Special Offer Sale Banner

Three-Dimensional Integrated Circuit (3D Ic/Chip) & Through-Silicon Via (Tsv) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology, Products and Applications

  • ID: 2103503
  • April 2012
  • Region: Global
  • 195 Pages
  • Markets and Markets
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FEATURED COMPANIES

  • Ibm Corp
  • Micron Technology Inc
  • Qualcomm Incorporated
  • St Microelectronics
  • Tezzaron Semiconductor
  • Xilinx Incorporated
  • MORE

3D IC/Chip & TSV Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, LED, Sensor, MEMS, Power & Analog Components) & Applications (Mobile Devices, Processors, ICT, Networking, Automotive, Defense)

The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.

Improved performance, reduced timing, and form factor motivation serve as key drivers for adoption of 3D IC and TSV interconnect solutions. On the other hand, thermal and testing issues and high cost involved largely restrain the growth of the market. In terms of revenue generation, Asia is observed to hold the highest share of around 40%, followed by North America with 35%.

Amongst the different end-products that utilize READ MORE >

Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Ibm Corp
  • Micron Technology Inc
  • Qualcomm Incorporated
  • St Microelectronics
  • Tezzaron Semiconductor
  • Xilinx Incorporated
  • MORE

1 Introduction

1.1 Key Take-Aways

1.2 Report Description

1.3 Markets Covered

1.4 Stakeholders

1.5 Research Methodology

1.5.1 Market Size

1.5.2 Key Data Points Taken From Secondary Sources

1.5.3 Key Data Points Taken From Primary Sources

1.5.4 Assumptions

1.5.5 List Of Companies Covered During Primaries

2 Executive Summary



3 Market Overview

3.1 Market Definition

3.2 Global Three Dimensional Integrated Circuit (3D Ic) Market

3.3 Global Tsv Interconnect Market

3.4 History & Evolution

3.5 Allied Industry Segments To 3D Ic Market

3.5.1 Electronic Design Automation (Eda) Vendors

3.5.2 Foundry Vendors

3.5.3 Fabless Vendors

3.5.4 Integrated Device Manufacturers

3.6 Global 3D Ic Market Estimates And Forecasts

3.7 Global 3D Ic Market Dynamics

3.7.1 Drivers

3.7.1.1 Reduction In Timing

3.7.1.2 Improved Performance

3.7.1.3 Form Factor Motivation

3.7.2 Restraints

3.7.2.1 Cost

3.7.2.2 Thermal Issues

3.7.2.3 Testing Issues

3.7.3 Opportunities

3.7.3.1 Need For Advanced Architecture In Electronic Products

3.7.3.2 Opportunity For Reactive Ion Etching (Rie) Equipment Manufacturers

3.8 Burning Issues

3.8.1 Supply Chain Issues

3.9 Winning Imperatives

3.9.1 Standardization

3.10 Value Chain Analysis

3.10.1 Value Chain Analysis Based On Industry Segments

3.10.2 Value Chain Analysis Based On 3D Ic Design Flow



4 3D Ic Market Classification

4.1 Classification Of 3D Ic Market By Technology

4.1.1 3D Ic Market Segmentation By Substrate

4.1.1.1 Silicon On Insulator (Soi)

4.1.1.2 Bulk Silicon

4.1.2 3D Ic Market Segmentation By Bonding Technique

4.1.2.1 Die To Die

4.1.2.2 Die To Wafer

4.1.2.3 Wafer To Wafer

4.1.2.4 Direct Bonding

4.1.2.5 Adhesive Bonding

4.1.2.6 Metallic Bonding

4.1.3 3D Ic & Tsv Interconnects Market Segmentation By Process Realization

4.1.3.1 Via First

4.1.3.2 Via Middle

4.1.3.3 Via Last

4.2 3D Ic Market Segmentation By Fabrication Technology

4.2.1 Beam Recrystallization

4.2.1.1 Restraint

4.2.1.1.1 Need For High Temperature

4.2.2 Wafer Bonding

4.2.2.1 Drivers

4.2.2.1.1 Identical Electrical Properties

4.2.2.1.2 Reduced Complexity

4.2.3 Silicon Epitaxial Growth

4.2.3.1 Restraint

4.2.3.1.1 Degradation In Quality

4.2.4 Solid Phase Crystallization

4.2.4.1 Drivers

4.2.4.1.1 Compatibility With Conventional Processing Environments

4.2.4.1.2 Absence Of Thermal Issues



5 Product Market

5.1 Memories

5.2 Light Emitting Diodes

5.3 Sensors

5.4 Power And Analog Components

5.5 Microelectromechnical Systems (Mems)

5.6 Others

5.7 Future Applications



6 Application Market

6.1 Consumer Electronics Sector

6.1.1 Mobile Devices

6.1.2 Processors In Computers And Laptops

6.2 Information And Communication Technology Sector

6.2.1 Communications

6.2.2 Information Technology & Networking

6.3 Automotive Sector

6.3.1 Automotive Sensors

6.3.2 Automotive Body Electronics

6.4 Military, Aerospace And Defense

6.5 Other Sectors



7 Geographic Analysis

7.1 North America

7.2 Europe

7.3 Asia

7.4 Rest Of The World



8 Competitive Landscape

8.1 Overview

8.2 Market Players And Market Revenue Analysis

8.3 3D Ic And Tsv Interconnect Market Analysis

8.4 Collaborations, Partnerships, Joint Ventures And Agreements

8.5 Mergers & Acquisitions

8.6 New Product Development



9 Company Profiles

9.1 Amkor Technology

9.1.1 Overview

9.1.2 Products & Services

9.1.3 Financials

9.1.4 Strategy

9.1.5 Developments

9.2 Elpida Memory Inc

9.2.1 Overview

9.2.2 Products & Services

9.2.3 Financials

9.2.4 Strategy

9.2.5 Developments

9.3 Ibm Corp

9.3.1 Overview

9.3.2 Products & Services

9.3.3 Financials

9.3.4 Strategy

9.3.5 Developments

9.4 Intel Corporation

9.4.1 Overview

9.4.2 Products & Services

9.4.3 Financials

9.4.4 Strategy

9.4.5 Developments

9.5 Micron Technology Inc

9.5.1 Overview

9.5.2 Products & Services

9.5.3 Financials

9.5.4 Strategy

9.5.5 Developments

9.6 Monolithic 3D Inc

9.6.1 Overview

9.6.2 Products & Services

9.6.3 Financials

9.6.4 Strategy

9.6.5 Developments

9.7 Nec Electronics Corporation

9.7.1 Overview

9.7.2 Products & Services

9.7.3 Financials

9.7.4 Strategy

9.7.5 Developments

9.8 Qualcomm Incorporated

9.8.1 Overview

9.8.2 Products & Services

9.8.3 Financials

9.8.4 Strategy

9.8.5 Developments

9.9 Renesas Electronics Corporation

9.9.1 Overview

9.9.2 Products & Services

9.9.3 Financials

9.9.4 Strategy

9.9.5 Developments

9.10 Samsung Electronics Co Ltd

9.10.1 Overview

9.10.2 Products & Services

9.10.3 Financials

9.10.4 Strategy

9.10.5 Developments

9.11 Sony

9.11.1 Overview

9.11.2 Products & Services

9.11.3 Financials

9.11.4 Strategy

9.11.5 Developments

9.12 Statschip Pac

9.12.1 Overview

9.12.2 Products & Services

9.12.3 Financials

9.12.4 Strategy

9.12.5 Developments

9.13 St Microelectronics

9.13.1 Overview

9.13.2 Products & Services

9.13.3 Financials

9.13.4 Strategy

9.13.5 Developments

9.14 Taiwan Semiconductor Manufacturing Company Limited

9.14.1 Overview

9.14.2 Products & Services

9.14.3 Financials

9.14.4 Strategy

9.14.5 Developments

9.15 Texas Instruments Incorporated

9.15.1 Overview

9.15.2 Products & Services

9.15.3 Financials

9.15.4 Strategy

9.15.5 Developments

9.16 Tezzaron Semiconductor

9.16.1 Overview

9.16.2 Products & Services

9.16.3 Financials

9.16.4 Strategy

9.16.5 Developments

9.17 Toshiba Corporation

9.17.1 Overview

9.17.2 Products & Services

9.17.3 Financials

9.17.4 Strategy

9.17.5 Developments

9.18 United Microelectronics Corporation

9.18.1 Overview

9.18.2 Products & Services

9.18.3 Financials

9.18.4 Strategy

9.18.5 Developments

9.19 Xilinx Incorporated

9.19.1 Overview

9.19.2 Products & Services

9.19.3 Financials

9.19.4 Strategy

9.19.5 Developments

9.20 Ziptronix, Inc

9.20.1 Overview

9.20.2 Products & Services

9.20.3 Financials

9.20.4 Strategy

9.20.5 Developments







List Of Tables



Table 1 3D Ic Market Revenue, By Geography, 2009 – 2016 ($Billion)

Table 2 Global 3D Ic Market Revenue, By Products, 2009 – 2016 ($Billion)

Table 3 Global 3D Ic Market, By Applications, 2009 – 2016 ($Billion)

Table 4 Global 3D Ic Market Revenue ($Billion) & Volume (Billion Units), 2009 - 2016

Table 5 Ic Ip Market Revenue, By Segment, 2012 – 2017 ($Million)

Table 6 Ic Ip Market Volume, By Segment 2012 – 2017 (Million Units)

Table 7 Global Ic Ip Market Revenue, By Application 2012 – 2017 ($Million)

Table 8 Global Ic Ip Market Revenue, By Geography, 2012 – 2017 ($Million)

Table 9 3D Ic Market Revenue, By Geography, 2009 – 2016 ($Billion)

Table 10 Global 3D Ic Market Revenue, By Product Types, 2009 – 2016 ($Billion)

Table 11 Global 3D Ic Market, By Application Sectors, 2009 – 2016 ($Billion)

Table 12 Global Soi Wafers Market, By Type, 2008 – 2015 ($Million)

Table 13 Global Thick Film Soi Wafers Market Revenue, By Product, 2008 – 2015 ($Million)

Table 14 Global Thin Film Soi Wafers Market Revenue, By Applications, 2008 – 2015 ($Million)

Table 15 Comparative Study Of Bonding Techniques

Table 16 Via First Approach – Advantages & Disadvantages

Table 17 3D Ic Market Revenue For Memories, By Geography, 2009 – 2016 ($Billion)

Table 18 Global Led Chips Market, By Applications, 2007 – 2014 ($Million)

Table 19 3D Ic Market Revenue For Leds, By Geography, 2009 – 2016 ($Billion)

Table 20 Global Sensors Market For Consumer Electronics, By Sensor Types, 2008 – 2015 ($Million)

Table 21 Automotive Sensor Market Revenue, By Applications, 2010 – 2016 ($Billion)

Table 22 3D Ic Market Revenue For Sensors, By Geography, 2009 – 2016 ($Billion)

Table 23 3D Ic Market Revenue For Power And Analog Components, By Geography, 2009 – 2016 ($Billion)

Table 24 3D Ic Market Revenue For Mems, By Geography, 2009 – 2016 ($Billion)

Table 25 3D Ic Market For Other Products, By Geography, 2009 – 2016 ($Billion)

Table 26 Future Potential Applications For 3D Ics

Table 27 Global Mobile Handset Market Revenue, By Types, 2008 – 2015 ($Million)

Table 28 Global Sensors Market, By Applications Under Consumer Electronics Sector, 2008 – 2015 ($Million)

Table 29 3D Ic Market Revenue In Consumer Electronics Sector, By Geography, 2009 – 2016 ($Billion)

Table 30 3D Ic Market Revenue In Information And Communication Technologies Sector, By Geography, 2009 – 2016 ($Billion)

Table 31 3D Ic Market Revenue In Automotive Sector, By Geography, 2009 – 2016 ($Billion)

Table 32 Global Automotive Sensors Market Revenue, By Product Types, 2010 – 2016 ($Billion)

Table 33 3D Ic Market Revenue In Military, Aerospace & Defense Sector, By Geography, 2009 – 2016 ($Billion)

Table 34 3D Ic Market Revenue In Other Application Sectors, By Geography, 2009 – 2016 ($Billion)

Table 35 North America: 3D Ic Market Revenue, By Products, 2009 – 2016 ($Billion)

Table 36 North America: 3D Ic Market Revenue, By Applications, 2009 – 2016 ($Billion)

Table 37 Europe: 3D Ic Market Revenue, By Products, 2009 – 2016 ($Billion)

Table 38 Europe: 3D Ic Market, By Applications, 2009 – 2016 ($Billion)

Table 39 Asia: 3D Ic Market Revenue, By Products, 2009 – 2016 ($Billion)

Table 40 Asian 3D Ic Market Revenue, By Applications, 2009 – 2016 ($Billion)

Table 41 Rest Of The World: 3D Ic Market Revenue, By Products, 2009 – 2016 ($Billion)

Table 42 Rest Of The World 3D Ic Market, By Applications, 2009 – 2016 ($Billion)

Table 43 3D Ic And Tsv Interconnect Market – Key Player Revenue ($Billion)

Table 44 3D Ic And Tsv Inteconnect Market – Key Players' Revenue Analysis, 2011 ($Billion)

Table 45 Colaborations/Partnerships/Agreements/Joint Ventures, 2009 – 2011

Table 46 Mergers And Acquisitions, 2009 - 2011

Table 47 New Products, 2009 - 2011

Table 48 Amkor Technology - Financials, 2010 - 2011 ($Million)

Table 49 Elpida Memory Inc. Financials, 2009 - 2010 ($Million)

Table 50 Ibm - Financials, 2010 - 2011 ($Million)

Table 51 Intel Corporation: Market Revenue, 2009 – 2010 ($Million)

Table 52 Intel Corporation: Market Revenue, By Segment, 2011 ($Billion)

Table 53 Micron Technology – Financials, 2010 - 2011 ($Million)

Table 54 Micron Technology - Net Sales From Different Product Categories, 2010 - 2011 ($Million)

Table 55 Nec Corporation: Market Revenue, 2010-2011 ($Million)

Table 56 Nec Corporation: Market Revenue, By Segment, 2011 ($Billion)

Table 57 Qualcomm Inc: Market Revenue, By Segments, 2010 – 2011 ($Million)

Table 58 Renesas Electronics: Market Revenue, By Segments, 2011 ($Million)

Table 59 Samsung Electronics: Market Revenue, 2009-2010 ($Million)

Table 60 Sony: Market Revenue, 2010-2011 ($Billion)

Table 61 Sony: Proportion Of Sales By Business Segment, 2011

Table 62 Statschippac Ltd: Market Revenue, 2010-2011 ($Million)

Table 63 Stmicroelectronics: Market Revenue, By Segment, 2009 – 2010 ($Million)

Table 64 Stmicroelectronics: Market Revenue, By Geography, 2009 – 2010 ($Million)

Table 65 Tsmc: Market Revenue, By Segments (Unconsolidated), 2009 – 2010 ($Thousands)

Table 66 Texas Instruments: Market Revenue, By Segments, 2009 – 2010 ($Million)

Table 67 Toshiba: Market Revenue, 2010 – 2011 ($Billion)

Table 68 Umc: Market Revenue, 2010 – 2011 ($Million)

Table 69 Xilinx: Market Revenue, 2010 – 2011 ($Thousands)

Table 70 Xilinx: % Of Total Net Revenues, By End Markets, 2010 – 2011







List Of Figures



Figure 1 3D Ic And Tsv Interconnect Market Segmentation

Figure 2 Ic Ip Market Revenue ($Million) & Volume (Million Units), 2011 – 2016

Figure 3 History And Evolution Of 3D Ic And Tsv Interconnect

Figure 4 Allied Industry Segments To 3D Ic & Tsv Interconnect Markets – Market Share Analysis

Figure 5 Fabless Ic Vendors – Market Share Analysis

Figure 6 3D Ics And Tsv Interconnects Market Drivers – Impact Assessment

Figure 7 3D Ics And Tsv Interconnects Market Restraints – Impact Assessment

Figure 8 3D Ics And Tsv Interconnects Market Opportunities – Impact Assessment

Figure 9 3D Ic – Standards And Organizations

Figure 10 Value Chain Analysis Based On Industry Segments

Figure 11 Value Chain Analysis Based On 3D Ic Design Flow

Figure 12 2D Vs 3D Technologies For Flash Memories – Cost Analysis

Figure 13 Market Assessment Chart For Led Driver Ics

Figure 14 3D Ic And Tsv Interconnect Market – Future Potential Applications

Note: Product cover images may vary from those shown

. Amkor Technology



. Elpida Memory Inc



- Ibm Corp



- Intel Corporation

- Micron Technology Inc



- Monolithic D Inc



- Nec Electronics Corporation



- Qualcomm Incorporated



- Renesas Electronics Corporation



- Samsung Electronics Co Ltd



- Sony



- Statschip Pac



- St Microelectronics



- Taiwan Semiconductor Manufacturing Company Limited



- Texas Instruments Incorporated



- Tezzaron Semiconductor



- Toshiba Corporation



- United Microelectronics Corporation



- Xilinx Incorporated



- Ziptronix, Inc

Note: Product cover images may vary from those shown
Note: Product cover images may vary from those shown

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