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Micropackaging for the Next Generation of Optical and Electrical Components
Optoelectronics Industry Development Association, Jan 2007, Pages: 70
Examines optical packaging technology for next generation fiber optic components with an eye towards lower cost and higher volume
In August 2006, the Optoelectronics Industry Development Association (OIDA) held a one day forum on micropackaging. OIDA held this Forum in conjunction with the 100 Gbit Ethernet Forum with the objective of focusing on the issues presented by next gen-eration components for communication systems. Historically, the telecommunications sector invested heavily in new communications technology at the component and semi-conductor level. Industry stratification over the last 10 to 15 years, however, changed the business model, research activity, and funding levels. At the same time, the requirement for higher data rates and smaller components that are more intelligent has evolved.
Optical components are ubiquitous. Applications that use them include DVD players, audio devices, cell phones, re-writable drives, projection displays, and communication devices. This report concentrates on the role of micropackaging for the communications industry. This topic is highly relevant to the 100 Gbit Ethernet Forum that took place in conjunction with this meeting.
The configuration and cost of optical component packages depends on the application. Packages can incorporate individual passive or active components, or be ‘hybrids’ that incorporate two or more components. This report focuses on packaging for optical com-ponents for systems that operate at high data rates. The next generation of optical com-munication products, such as the 100 Gbit Ethernet, will require such components.
The communications industry is constantly being pushed to deliver higher data rates and lower cost products. The movement is away from discrete components to functional modules, especially in the Ethernet and fiber channel markets. There are several compet-ing approaches for miniaturizing and increasing the optical component functionality. The direction of component development will ultimately be linked to the evolution of net-works and new applications. Standards are also important for the development of next generation products.
Participants in the forum addressed three main questions:
1. Which is the right approach: hybrid packaging or system on chip?
2. What are the technology roadblocks and how will integration play a role in the next generation of equipment development?
3. What issues are going to drive micro optic packaging: placement, thermal, electro-magnetic interference (EMI) or signal integrity (optical and electrical)? How far down does the functionality need to reach?
First, this document provides background information on optical component packaging. It will evaluate the impact of communication business drivers and the issues on the future of technology development. Next, it incorporates the discussions and positions of several U.S. companies. On the technology side, the report discusses the continuing need for more sophisticated components and the opportunities for photonic integration. It high-lights concerns over cost structures and outsourcing. The document concludes with a discussion of the three parallel breakout sessions and a summary of the Forum’s findings. Based on the presentations and the breakout sessions, the report provides several recom-mendations.
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