Global Die Bonder Equipment Market to Reach $1.3 Billion by 2030
The global market for Die Bonder Equipment estimated at US$823.4 Million in the year 2022, is projected to reach a revised size of US$1.3 Billion by 2030, growing at a CAGR of 6.2% over the analysis period 2022-2030. Fully Automatic, one of the segments analyzed in the report, is projected to record 6.6% CAGR and reach US$582.6 Million by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Semi-Automatic segment is readjusted to a revised 6.2% CAGR for the next 8-year period.The U.S. Market is Estimated at $224.3 Million, While China is Forecast to Grow at 9.4% CAGR
The Die Bonder Equipment market in the U.S. is estimated at US$224.3 Million in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$283.4 Million by the year 2030 trailing a CAGR of 9.4% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.2% and 5.1% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 4.8% CAGR.Select Competitors (Total 34 Featured) -
- Anza Technology, Inc.
- ASM Pacific Technology Ltd.
- Be Semiconductor Industries N.V.
- Dias Automation (Hk) Ltd
- Dr. Tresky Ag
- Fasford Technology Co., Ltd.
- Finetech GmbH & Co. Kg
- Four Technos Co., Ltd.
- Hybond, Inc.
- Kulicke & Soffa
- Microassembly Technologies, Ltd.
- Mycronic AB
- Palomar Technologies, Inc.
- Paroteq GmbH
- Right to Win
- Shibuya Corporation
- Shinkawa Ltd.
- Smart Equipment Technology
- Tpt Wire Bonder GmbH & Co. Kg
- Tresky GmbH
- Unitemp GmbH
- West·Bond, Inc.
What's New?
- Special coverage on Russia-Ukraine war; global inflation; easing of zero-Covid policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
- Global competitiveness and key competitor percentage market shares
- Market presence across multiple geographies - Strong/Active/Niche/Trivial
- Online interactive peer-to-peer collaborative bespoke updates
- Access to digital archives and Research Platform
- Complimentary updates for one year
Table of Contents
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Anza Technology, Inc.
- ASM Pacific Technology Ltd.
- Be Semiconductor Industries N.V.
- Dias Automation (Hk) Ltd
- Dr. Tresky Ag
- Fasford Technology Co., Ltd.
- Finetech GmbH & Co. Kg
- Four Technos Co., Ltd.
- Hybond, Inc.
- Kulicke & Soffa
- Microassembly Technologies, Ltd.
- Mycronic AB
- Palomar Technologies, Inc.
- Paroteq GmbH
- Right to Win
- Shibuya Corporation
- Shinkawa Ltd.
- Smart Equipment Technology
- Tpt Wire Bonder GmbH & Co. Kg
- Tresky GmbH
- Unitemp GmbH
- West·Bond, Inc.
Table Information
Report Attribute | Details |
---|---|
No. of Pages | 89 |
Published | May 2024 |
Forecast Period | 2022 - 2030 |
Estimated Market Value ( USD | $ 823.4 Million |
Forecasted Market Value ( USD | $ 1300 Million |
Compound Annual Growth Rate | 5.9% |
Regions Covered | Global |