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The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for consumer electronics, increasing use of semiconductor chips in various industries, and shift from traditional silicon-based technologies to advanced technologies like 5g, ai, iot, and autonomous vehicles.
The wafer fab equipment market is segmented as below:
By Technology
- Automatic layer deposition
- Chemical vapor deposition
- Etching
- Oxidation
- Others
By End-user
- Foundry
- Memory
- Integrated device manufacturer (IDM)
By Geography
- APAC
- North America
- Europe
- Middle East and Africa
- South America
The report on the wafer fab equipment market covers the following areas:
- Wafer fab equipment market sizing
- Wafer fab equipment market forecast
- Wafer fab equipment market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
Executive Summary
The publisher recognizes the following companies as the key players in the global wafer fab equipment market: ASML, AIXTRON SE, Applied Materials Inc., ASM International NV, ASMPT Ltd., Baxter International Inc., EV Group, FormFactor Inc., Hitachi Ltd., HORIBA Ltd., KLA Corp., KOKUSAI ELECTRIC CORP., Lam Research Corp., Nikon Corp., PLASMA THERM, Taiwan Semiconductor Manufacturing Co. Ltd., Teradyne Inc., Tokyo Electron Ltd., Screen Holdings Co. Ltd., and Hanmi Semiconductor Co. Ltd..Commenting on the report, an analyst from the research team said: 'The latest trend gaining momentum in the market is technological advancements in semiconductor industry.'
According to the report, one of the major drivers for this market is the growing demand for consumer electronics.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- ASML
- AIXTRON SE
- Applied Materials Inc.
- ASM International NV
- ASMPT Ltd.
- Baxter International Inc.
- EV Group
- FormFactor Inc.
- Hitachi Ltd.
- HORIBA Ltd.
- KLA Corp.
- KOKUSAI ELECTRIC CORP.
- Lam Research Corp.
- Nikon Corp.
- PLASMA THERM
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Teradyne Inc.
- Tokyo Electron Ltd.
- Screen Holdings Co. Ltd.
- Hanmi Semiconductor Co. Ltd.