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Strategic Analysis of the Chinese VLSI Design Services and Semiconductor Packaging Markets
Frost & Sullivan, April 2007, Pages: 149
This Frost & Sullivan research service titled Strategic Analysis of the Chinese VLSI Design Services and Semiconductor Packaging Markets provides a detailed analysis on the various semiconductors that cater to a number of end-user segments. In this research, expert analysts thoroughly examine the following applications: computers and computer peripherals, communications, consumer electronics, industrial, and automotive.
Market Sectors
Expert analysts thoroughly examine the following market sectors in this research:
By Application:
-Computers and computer peripherals
-Communications
-Consumer electronics
-Industrial
-Automotive
Boom Time in the VLSI Design Services and Semiconductor Packaging Market Following the Return of IC Design Engineers to China
With semiconductor consumption skyrocketing due to a boom in electronics manufacturing, very large scale integration (VLSI) design has become the latest buzzword in the Chinese semiconductor value chain. In the last three years, numerous venture capitalists have reposed faith in VLSI design houses. The return of several Chinese integrated circuit (IC) design engineers from the United States has also augured well for the market, with many of them launching their own design houses. This trend has not only raised the technological sophistication of VLSI design services, but has also assured the market of abundant outsourcing projects – especially considering the country’s low labor costs and abundant talent pool. Although the current major process technology of Chinese VLSI design houses is inferior to those in the United States and Europe, it is expected to improve at a much faster pace.
Meanwhile, the packaging segment is also rising in stature and influence, and is no longer considered a passive counterpart of the electronics component in the semiconductor market. 'The increasing complexity of products coupled with the demand of better performing chips has facilitated wider acknowledgement of packaging as a core activity in the semiconductor value chain,' says the analyst of this research service. 'The demand for miniaturized packages from various end-user segments is soaring, as is the technological competence of Chinese packaging manufacturers, giving a huge boost to market revenue.'
Manufacturers and Designers Enjoy Strong Government Backing
Both packaging manufacturers as well as design houses are buoyed by robust Government support in the form of financing, tax exemptions, favorable import/export laws, and intellectual property (IP) protection. The country’s foreign direct investment (FDI) policies also encourage global semiconductor and packaging companies to set up factories in China. It is vital for large design houses to maintain close relationships with the Government, as it can win them huge national projects that are more profitable and have longer deadlines.
'IC design houses should have in-depth understanding of the customers’ specific requirements by maintaining close, clear, and continuous communication with them throughout the whole design chain,' notes the analyst. 'On the other hand, semiconductor packaging manufacturers need to pay more attention to their R&D activities, as it can help them develop new products that suit market requirements, thereby meeting stricter time-to-market demands.'
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