PRESENTATIONS INCLUDE: Overview of Issues Related to Lead-Free Solder Implementation - Lead-Free Packaging: Industry Status and Strategy - Wetting Characteristics of Lead-Free Solder for SMT Applications - Practical Concerns in Lead-Free SMT and Wave Soldering - Lead-Free BGAs: Challenges and Solutions - Lead Free Packaging Review - Considerations for High Temp Soldering on Polymeric Materials - Are We Looking in the Wrong Direction? - Lead-Free Conversion: Industry Readiness Challenges and Status.
