PRESENTATIONS INCLUDE: Lead-Free Summit: Introduction and Overview - Lead-Free Assembly: Infrastructure and Execution - Challenges Facing Implementation of Lead-Free Packages - Lead-Free Soldering: An Overview and Comparisons - New Polymer Material Sets for Lead-Free BGA Packaging - Lead-Free: An Overview of Temperature Cycling, Aging, Bend - Testing and Plating Chemical Evaluation Results - Can Lead-Free Implementation Be Cost Effective and Painless? - Elimination of Lead From External Lead Finishing - Reliability and Standards - Material and Supplier Issues - Basic Data and Design - And More.
