PRESENTATIONS INCLUDE: Implementing Lead-Free: the Whys, Whats and Hows - HDPUG: Global Initiative for Lead and Bromine Free Conversion - NEMI Lead-Free Taskforce Activities: Work in Progress Summary - Are Optoelectronic Products Compatible with Lead-Free Assembly Requirements? - Advanced Interconnect Technologies Batam Lead-Free Program - Intermetallic Compound Formation in Lead-Free Solder Systems - Why Not Solder Lead-Free at 230°C? - PANEL A: Whiskering Guidelines and Test Methods - PANEL B: Lead-Free Components: Why Wait? - And More.
