Research and Markets, the largest resource for market research information in world providing essential market research reports, industry research, industry analysis, forecasts, market studies, company profiles and country reports.
Welcome - Home - Register - Login - Help/FAQ - 0 items View Basket
Worlds Largest Market Research Resource - 722239 Live Reports
Search Research and Markets
  Search
Enter keywords, a title or
a report id number below.





Advanced   
Company search
Register for free email updates of market research
Currency
  Select a currency for use throughout the site



Viewing report

Order by Fax
Printer Friendly
PDF Brochure
Send to Friend
Enquire before Buying
| More
Hard CopyAdd to Basket
CD ROMAdd to Basket
Electronic (PDF)Add to Basket
Site LicenseAdd to Basket
EnterprisewideAdd to Basket



Micropackaging for the Next Generation of Optical and Electrical Components
Optoelectronics Industry Development Association, Jan 2007, Pages: 70

  Description  

  Table of Contents  
    
    
    
   
 Enquire before Buying  
 Send to a Friend  

1 Introduction

2 State of the communications industry
2.1 Investment in the optical components space
2.2 Markets and drivers for higher data rate devices in communications
2.2.1 Server applications
2.2.2 Enterprise applications and carrier networks
2.2.3 Storage Applications

3 Optical devices for high speed communications
3.1 Building blocks
3.2 Device design concerns
3.2.1 III-V material systems used for communications
3.2.2 The waveguide
3.2.3 Capacitance and bandwidth
3.2.4 Simple device geometries

4 Discrete packaging in communications

5 Hybrid packaging
5.1 Silicon optical bench
5.2 Silicon sub-mount technology
5.3 Passive waveguide technology
5.4 Passive alignment technology
5.4.1 Single emitters
5.4.2 Silicon bench and planar waveguide technology
5.4.3 RF signaling and silicon optical bench
5.4.4 Multi-emitter technology - parallel optics
5.5 Wafer scale technology and processes
5.6 Module technology - optical transceivers
5.6.1 Electrical connectors and their limitations - speed is the key
5.6.2 Meeting the ASIC challenge and compensation

6 Photonic integration

7 Cost structures and manufacturing

8 Breakout sessions
8.1 Session 1
8.2 Session 2
8.3 Session 3

9 Summary

10 Recommendations

11 Micropackaging Forum Agenda

12 Attendee List



Customers who bought this item also bought

Future Optical Communications Systems

Optical Component Worldwide Strategies Market Shares and Forecasts, 2009 to 2015

Optical Component Market Opportunities, Strategies, and Forecasts, 2006 to 2012

Optical Components Markets: 2007-Vol 1

The New Optical Core: Photonic Switching and Next-Generation Optical Transport in Long-Haul Core Networks

100 Gb Ethernet: The Next Challenge for Communications Systems

Silicon Photonics: Challenges and Future

Optical MEMS

100 Gbit Interconnects and Above: The Need for Speed

Optical Switching Sub-systems and Components: Market and Trends

Optical Access: Next Generation Technology and Services in the First Mile

Optical Networking Components: The Next Wave Q2/2006



Top of page


   All rights reserved. © Copyright 2009 Research and Markets
   Terms and conditions Privacy Policy Publishers Employment Opportunities Site Map Link to us Webmaster


Research and Markets RSS Feeds