3. Background 3.1. Server Industry Market Overview 3.2. Silicon Industry Technology Drivers 3.3. Silicon Industry Companies 3.4. Communications Industry Overview 3.4.1. Optical Components Companies 3.5. Government Initiatives 3.5.1. USA 3.5.2. Japanese government funding 3.6. Protocols for the Data Center 3.6.1. Network introduction 3.6.2. Ethernet 3.6.3. Fiber Channel 3.6.4. Infiniband 3.7. Standards development
4. Electrical Interconnects overview 4.1. Overview of the interconnect segmentation 4.1.1. Intra chip interconnects 4.1.2. Inter-chip interconnects 4.1.3. Back plane interconnects 4.2. RF considerations for back planes and connectors 4.3. Channel Model 4.4. ITRS roadmap for interconnects 4.5. 3-D stacking and wafer level interconnects
5. Optical Interconnects for back plane and boards 5.1. Fiber Optic Connectors and Cable Assemblies 5.2. Optical Transceivers 5.2.1. Single Channel -duplex 5.2.2. Parallel Channel 5.3. On-board waveguides
6. Economics 6.1. Transceivers 6.2. Dilemma with the economics for optical component implementations
