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Viewing report
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LED Manufacturing Technologies
Yole Development, Nov 2007, Pages: 186
Glossary
Executive summary
LED market main metrics and players
- Market segmentation
- LED market volume as a function of LED type
- LED market revenues as a function of LED type
- LED 2006 applications breakdown
- 2001-2012 GaN LED market
- Average retail price of conventional packaged LED
- Estimated worldwide blue LED dies capacity by region in million units
- Major worldwide players and related position on the value-chain: Europe, Japan, Korea, Taiwan, China, North America
General Illumination market
- Worldwide estimation of generated lumens (lm.hr/year)
- Evolution of white LEDs needs for general lighting
- Market estimation for White-LEDs for general illumination
- Wafers needs for general illumination (2” equivalent wafers, million units)
Projection systems & light-engines market
- Introduction: Definition of a light engine
- Products which require a light engine
- Light engines market forecast 2006-2011
- Market introduction roadmap for light-engine-based products
- Light engine roadmap for displays
- Digital Cinema Projectors market
- Conclusions: What light sources for projection displays: LED or LD?
Current status of the LED performance and related technologies
- Number of lm requested for various applications and related time-to-market for mass-production
- Main manufacturing steps and related options for GaN-based LED
- Examples of current LED companies process flow-chart
- LED: lateral or vertical structure
- GaN-LED: Emitting colour as a function of In concentration
- Global LED efficiency is the ratio of the final luminous output power over the wall-plug input power
- Internal QE has now reached ~73% for low power LED (I=20mA)…
- but this value significantly drops as the current (so the power) increases !
- How is the input power dissipated? Average LED optical output power vs. heat generation at different current levels
- Extraction efficiency (?extr.) is strongly linked to the die size….
- Different options to optimize LED performance
- Expected efficiency gains for the future white power LED generation
- Influence of selected improvements on the four key efficiency parameters
- The perfect white LED would include…
New LED manufacturing techno. to enhance luminous efficiency
- Various techniques to improve white LED efficiency
New growth substrates for nitride LEDs
- Sensitivity to dislocations density in the active layer for optical nitride devices
- Estimated volume of substrates for GaN-based LED production (SiC & Sapphire) 2005-2012
- 2006 sapphire substrates market for LED: price, units and diameter analysis
- 2005-2012 Sapphire substrates market volume for LEDs by diameter & related market value
- 2005-2012 Sapphire substrates market value for LEDs, segmented by diameter
- 2005-2012 SiC wafer diameter evolution for GaN/SiC LED production
- 2005-2012 SiC substrates market volume for LEDs by diameter & related market size
- Sapphire substrates main manufacturers
- Different substrates for GaN epitaxy
- GaN substrates / applications matrix
- Conclusion: Tentative time-to-market of various substrates
Photonic crystals and textured surface
- Goal of the LED surface modification: enhance light extraction and directional emission
- Photonic crystal vs. Surface texturing
- Photonic crystals: the principle
- Example of photonic crystals based LED Luminus PhlatLight®
- Nano-imprint lithography, a key technology for photonic crystals LED
- Photonic crystals LEDs: New developments
- Photonic crystals LEDs by Laser Holography
- Conclusion
Laser Lift-Off (LLO) & Flip-Chip
- LLO Technique: definition
- OSRAM LED chip technology (ThinGaN® technology)
- LLO equipments
- LLO technique & Flip chip mounting
- The flip-chip mounting: transparent substrates only!
- Flip-chip can be coupled with back-face contact reflector technique
- Schematic fabrication process for wafer-bonded transparent substrate AlGaInP/GaP LEDs
Transparent top contacts with ZnO
Temporary Bonding
- Temporary bonding: introduction
- Thin wafer handling: different solutions
- Temporary bonding: principle
- Main temporary bonding methods comparison
- Temporary bonding using wax
- Temporary bonding using adhesive tapes
- Example of EVG and TEL temporary bonding tools
Dicing and Scribing
- Definition
- Techniques, Throughputs and costs
- Number of dies / wafer
- Laser Scribing & Dicing
- Diamond Scribing & Dicing
- Example of JPSA, NWR, Synova and Oxford Laser tools
Binning
- Binning: Definition
- What is Binning?
- Binning: the criteria
- Binning must prioritize on only one parameter to achieve a proper yield
- Binning: conclusions
Patents and licenses status in the LED business: The phosphor battlefield
- Patent is part of global IP
- “The NICHIA story”: 1995 – 1999
- Some Examples of the GaN LED patent situation
- Main agreements and cross-licenses in LED business
- US and Asia remain the most active regions in LED patents
- EU patents status
- Ranking of the most active companies in LED technology patents
- Main phosphor-related patents from various manufacturers
- Main phosphor technologies in use
- Main phosphor suppliers
- Conclusions
UV-LED and bulk-AlN: The future of white LEDs?
- Introduction
- What are UV wavelengths ?
- UV emission wavelength depends on the Al content in the AlGaN alloy
- Why bulk AlN to make UV LEDs?
- Current UV-LED state-of-the-art
- Main initiatives in AlN bulk single crystal developments
- Tentative roadmap for 2” AlN single crystal market price & useable area
- Example of current available offers in AlN substrates
- Conclusion
The ’’Green Gap’’
- Introduction: green is missing…
- Why green wavelengths so hard to get?
- Conclusions
LED lifetime: new business models are needed
- Long lifetime can be a market driver for adoption but not a money maker for light source vendors
General conclusions
Annexes: Company profiles
- CREE
- Philips Lumileds
- OSRAM
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