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World Flexible Printed Circuit Board Markets
Frost & Sullivan, May 2008, Pages: 57
Enhancements in Handheld Wireless Telecommunications and Higher Connection Densities Show the Way Forward for the World Flexible PCB Market
The physical properties of flexible printed circuits (FPCs) make them especially suited to the electronics industry, but with the wide range of options available in terms of materials and processors, FPCs are progressing into an ever-widening range of applications. The world flexible printed circuit board (PCB) market has grown at an impressive rate, with the mobile phone and digital camera sectors accounting for 33 percent of the revenues, opening new avenues for the market. Aspects such as system intelligence, high-resolution display, flexibility, portability, and differentiation as well as the redefining and ramping up of functionality are the underlying themes permeating the market. Mobile phones that support new standards and features are grabbing consumer attention. MP3 music playback capability is the latest in a series of enhancements that are pushing the cumulative sales figures in this sector. Manufacturers are also integrating digital TV tuners into next-generation mobile phones, enabling them to receive TV broadcasts. As the demand for mobile phones is expected to remain vigorous, the mood in the PCB market is upbeat.
The introduction of 3.5G and long term evolution (LTE) and the development of increasingly thinner, smaller, and faster products for the consumer electronics and telecommunications sectors are also fuelling advancements in the FPC market. Successful consumer acceptance of the latest technologies such as sequential binding and deep micro-vias has added another level of excitement to the market. 'With the trend toward miniaturization and high-speed performance, high density interconnection (HDI) technology is expected to become a profitable market for major flex PCB manufacturers,' notes the analyst. 'HDI is being applied in multilayered PCBs, multilayered FPCs and integrated circuit (IC) substrates, and single-layered printed circuits.'
Business Ramifications of Rigid-flex Applications Trigger Host of Mergers and Acquisitions
A convergence between rigid PCs and flex PCs seems inevitable and strategic moves to accommodate ongoing trends have seen a spate of mergers and acquisitions in the rigid and flex markets in recent years. As the ability to offer both rigid and flexible PCs may become a key differentiator for OEMs in the market, top-tier companies are acquiring lower tier or emerging companies with the objective of outpacing prevailing competition. Companies that can offer integrated solutions combining both rigid and flexible PCBs will greatly multiply prospects for a wider customer base. Increasing use of this technology and ultimate stabilization will eventually raise the levels of expertise, both in terms of technology and materials, ensuring that the market moves full steam ahead.
'Rigid-flex offers designers the opportunity to integrate the cutting-edge benefits of weight reduction and enhancement of interconnect reliability,' notes the analyst. 'It is expected to find a myriad of real-world applications in sectors ranging from consumer electronics and aerospace and defense to medical devices.' Aiming to offer an enhanced product portfolio, some printed circuit manufacturers are foraying into the multilayer rigid PCB market. As rigid-flex and semiconductor packaging are the fastest growing segments in the FPC market, participants are lured by the promise of huge profit margins compared to rigid PCBs. The outsourcing trend is also fast catching up, as flex PC companies are providing integrated 'one-stop' services to OEMs, including component selection, fabrication, design, purchasing, and assembly. FPC companies are relying heavily on contract manufacturing as their mainstream strategy to better their prospects.
This Frost & Sullivan research service titled World Flexible Printed Circuit Board Markets provides an analysis of the various factors driving and restraining the market, revenue forecasts, geographic trends, and competitive structure. In this research, Frost & Sullivan's expert analysts cover various end-user segments including the automotive, aerospace and defense, medical, industrial, semiconductor packaging, and telecommunication industries.
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