|
|
 |
|
Viewing report
|
|
|
|
3D IC & TSV Profiles (report & database)
Yole Development, Oct 2007
The report provides more than 300 slides ?ready to use? for your own business. IDMs and OSATs players have been investigated. For each profile, you will have access to the following features:
Company overview:
- Financial highlights
- Company products and markets
- Strategic alliances & partnerships
Mapping of the R&D labs and main manufacturing fabs locations: Key R&D, Front-end, Back-end, and Assembly site activities have been identified
Key contacts developing the TSV technology
Summary of the 3D IC technologies developed
Latest announcements
Product Roadmaps
Product objectives
A unique tool for equipment & material suppliers to develop their business worldwide with the key players of the 3D IC industrial value chain.
A complete company profiles report to enable suppliers of semiconductor industry to detect new opportunities on the 3D Packaging semiconductor market.
Product overview
This unique report & database will provide you a global picture of what is happening today in the 3D IC world: gain access quickly to the profiles of the Top 50 key players developing the TSV ?Through Silicon Via? technology, including locations (R&D labs, cutting edge pilot lines and manufacturing plants), key business & technical contacts, product roadmaps, 3D processes developed, strategic alliances & partnerships. The covered geographical areas includes North America, Europe and Asia.
Key features
Whiling to develop your business and learn more about the key 3D IC players? Our report and database are 2 unique tools to answer your questions:
Application fields covered:
RF-SiP: Integrated passives, antennas, amplifiers, MMICs, power components...
CMOS imagers: Chip scale Opto WLP and 3D LSI CMOS image sensors
Memories: NAND Flash, NOR Flash and DRAMs
3D MEMS: Silicon Microphones, pressure sensors, inertial sensors and MOEMS to be stacked on CMOS wafers
Memories & logic: FPGAs, SRAM / DRAM cache memories to be stacked directly onto microprocessor cores
Elements included:
Comprehensive Database:
- 3D IC segmentation incorporated
- Customized research enabled
- Easy to share & extract information
Complete Profiles Report:
- Top 50 players covered
- 3D technologies developed
- Latest product achievements
- Key Contacts & Locations
- Companies Roadmaps to production
Facts & Figures
For each player in the database, you will gets its:
Activities through our 3D IC segmentation:
- RF-SiP, Flash, DRAM, CIS, Logic, MEMS, IP, R&D supply
Key contacts:
- Business, Engineering and Researcher contacts
Fabs identity & locations:
- Creation date, generic coordinates, clean room class & size, fab capacity, wafer size, product lines developed
3D technologies developed:
- Stacking scheme: C2C, C2W, W2W, number of stacked layers
- Bonding technology: Cu-to-Cu, adhesive, direct oxide, eutectic?
- Wafer level: substrate material, wafer thickness budget, handling process developed
- Via level: holes diameters, interconnect densities, drilling technologies (wet etch, laser, DRIE?) and filling processes (Copper, Tungsten, Poly-silicon?)
Who should buy this report?
Semiconductor players, equipment & material suppliers are targeted by this report:
- Business development managers to access key contacts developing the 3D technologies and to define product development strategies
- Marketing executives to find key figures and profiles for their strategic plans
- Technical directors and development engineers to get a global overview of the market & technical requirements in order to evaluate and scale with their product development projects
Benefits
Our database references more than 400 fabs locations and about 250 qualified contacts involved in the developments of 3D ICs. For example, you can use this tool for:
- Searching new qualified contacts to develop your business
- Studying the profile and repartition of one given technology among the different industry players
- Getting a wide-angle view on the 3D ICs market
Also available
3D IC & TSV report
Customers who bought this item also bought
3D IC & TSV report
3D IC Technology - An Assessment
3-D TSV Interconnects - Devices & Systems 2008 Report
How 3D Memory Stacks Up
3-D TSV Interconnects - Equipment & Materials 2008 Report
2008 3D Television Report
3D Medical Imaging - Global Strategic Business Report
2007 3D Technology and Markets: A Study of All Aspects of Electronic 3D Systems, Applications and Markets
TSV+ Cost Analysis Tool
The Business Case for Digital 3D Cinema Exhibition
2009 Autostereoscopic 3D Displays in Signage and Professional Applications
IC EUROPE - European Database of Integrated Circuit, Packaging, MEMS, R&D & PowerDevices Players and Market Study
|
|
|
|
