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Signal Integrity Characterization Techniques
IEC Publications, Feb 2009, Pages: 783
Signal Integrity Characterization Techniques addresses the gap between traditional digital and microwave measurement technologies while focusing on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors, PCBs, cables, IC packages, and backplanes are critical elements of differential channels that must now be optimized using today’s most powerful analysis and characterization tools. Both measurements and simulation must be done on the device under test and must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements—from backplane design challenges to advanced error correction techniques to jitter measurement tools. The authors’ approach wisely address many of today’s high-speed technologies, provides excellent insight into its future direction, and will teach the reader valuable lessons pertaining to the signal integrity industry.
ABOUT THE AUTHORS
Mike Resso is a signal integrity application specialist in the component test division of Agilent Technologies. He is responsible for the technical training of field engineers, symposium lecturing, and the creation of sales tools that will expand the worldwide market growth of high bandwidth oscilloscopes. His current activities include developing novel signal integrity measurement techniques related to high-speed digital design applications, identifying new test methodologies in the communications field, and interfacing with Agilent R&D engineers to bring innovative products to the marketplace. He has over twenty years experience in the test and measurement industry, and his background includes the design and development of electro-optic test instrumentation for aerospace and commercial applications. His most recent activity has focused on the complete multiport characterization of high speed digital interconnects using time domain reflectometry and vector network analysis. He has authored over 20 technical papers in diverse fields such as infrared detector probe systems, linearly variable optical filters, and electrically conductive antireflection coatings. Mike received a B.S. degree in electrical and computer engineering from University of California.
Eric Bogatin is signal integrity evangelist of Bogatin Enterprises, LLC which specializes in training for signal integrity and interconnect design. His company offers a complete curriculum in short courses and training materials to help accelerate engineers and managers up the learning curve to be more effective in fields related to signal integrity. He has held senior engineering and management positions at such companies as AT&T Bell Labs, Raychem Corporation, Advanced Packaging Systems, and Sun Microsystems. For 20 years, he has been involved in various aspects of signal integrity and inter-connect design, from the materials side, manufacturing, product design, measurements and, most recently, education and consulting. Eric has written four books on signal integrity and inter-connect design, over 200 papers, and most recently wrote a book entitled Signal Integrity-Simplified published in 2004. Eric received his Ph.D. in physics from the University of Arizona in Tucson in 1980 and his B.S. in physics from the Massachusetts Institute of Technology in 1976.
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