|
|
 |
|
Viewing report
|
|
|
|
Thermal Conductivity 27/Thermal Expansion 15: Proceedings of the 27th International Thermal Conductivity Conference and the 15th International Thermal Expansion Symposium
DEStech Publications, Inc., Oct 2004, Pages: 681
The International Thermal Conductivity Conference-now in its 27th year- is a major international conference on materials science and technology. Seventy-five outstanding technical papers, from leading materials specialists from around the world, were presented at the conference. Published after the conference, this volume contains the complete edited texts with all tables and figures from the latest conference.
In additional to traditional topics such as thermal insulation, instrumentation and standards, the conference tried to highlight research in carbon nanotubes, nanomaterials, novel thin films, thermoelectric and composites. Thermal expansion measurements using X-ray and neutron diffraction methods were presented for the first. The conference highlighted the fact that conductivity and thermal expansion are playing important roles in advanced material research.
The conference was chaired by Hsin Wang and Wallace D. Porter from the Oak Ridge National Laboratory which was the sponsor of the Conference. This publication also includes papers presented by The 15th International Thermal Expansion Symposium which was held concurrently with the Thermal Conductivity Conference
Major presentation of new developments in materials science and technology
Applications in metals, composites, and polymers
Special emphasis on nanomaterials
98 participants from 16 different countries
Illustrations and tables throughout
Extensive subject index
Customers who bought this item also bought
Thermal Conductivity 29/Thermal Expansion 17: Proceedings of the 29th International Thermal Conductivity Conference and the 17th International Thermal Expansion Symposium
World Thermal Battery Markets
Conference Proceedings of Thermal Power India 2
Progress in Thermal Barrier Coatings
Thermal Conductivity 28/Thermal Expansion 16: Proceedings of the 28th International Thermal Conductivity Conference and the 16th International Thermal Expansion Symposium
Cellular and Porous Materials: Thermal Properties Simulation and Prediction
Proceedings of the American Society for Composites - 22nd Technical Conference
Conference Proceedings from The 3rd Thermal Power India 2009
SAMPE Fall Technical Conference: From Art to Science - Advancing Materials and Process Engineering
World Thermal Black
Electronic Thermal Management - Global Strategic Business Report
The Chinese Market for Thermal Insulation
|
|
|
|
