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Advanced Electronic Packaging - International Technology & Market Trends
Bizacumen Inc., Nov 2009, Pages: 191
With the burgeoning demand for portable devices, demand for advanced electronic packaging for accommodating the integrated circuits that support the aforesaid devices is on rise. Decreasing device size demands low cost electronic packages that are capable of rendering high speed, finer pitch, higher pin count and reliable interconnects. Despite the fact that higher pin count increases cost, manufacturers are finding ways to deliver the most cost effective advanced electronic packages to address the needs of the industry.
Advanced Electronic Packaging industry has grown to a position where its technology has outpaced the semiconductor technology, the parent industry it addresses. Increasing silicon complexity and integration has made it mandatory for packaging technology to provide finer lead pitch, higher I/O counts, improved heat dissipation, and rapid, reliable interconnect. Simultaneously, the industry is also pushing towards decreased printed circuit board area and complexity, which is exerting further pressure on packaging requirements.
These and other market data and trends are presented in 'Advanced Electronic Packaging: International Technology & Market Trends' by BizAcumen, Inc. Our reports are designed to be most comprehensive in geographic coverage and vertical market analyses.
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