Contents:

ADVANCED ELECTRONIC PACKAGING CONTENTS 1. METHODOLOGY 1 Study Reliability and Reporting Limitations 1 Disclaimers 2 Quantitative Techniques & Reporting Level 3 2. CURRENT AND FUTURE ANALYSIS 4 Industry Faces Challenging Times 4 3. INDUSTRY OVERVIEW 5 A Brief Insight 5 Market Share Scenario 7 4. TRENDS AND ISSUES 8 Suppliers Outsource Packaging To Curtail Costs 8 BGAs on a Tremendous Growth Path 8 Glue Logic Makers Move to Advanced Packaging 9 Contractors Move Towards High Pin-Count Packages 9 Wafer Scale Packaging Anticipated to Cut Costs 9 Disparity in Scale Sizes - A Reason for Concern 10 Miniaturization Impels Adoption of Wafer- Level Chip Scale Packaging 10 Challenges Facing Assembly and Packaging 11 Technology Trends 11 5. GROWTH DRIVERS 12 Portable Equipment Drives Growth in Flip Chips 12 Drivers for Electronic Packaging Technologies 12 Shrinking Die Sizes to Drive New Packaging Technologies 13 Factors Driving Growth in the Chip Scale Packaging Market 13 Market Technology Drivers by Major End- Use Sectors 14 6. PRODUCT FACTS 14 Ball Grid Arrays 14 Chip Scale Packaging (CSP) 14 Multi Chip Modules (MCM) 14 7. CORPORATE DEVELOPMENTS 16 Telit Introduces M2M BGA Module 16 TSI Group Acquires Three Los Angeles Based Brazing and Machining Businesses 16 Ferro Creates New Electronic Packaging Materials Unit 16 A Group of US Based Investors Establish Chip-Packaging Plant in Vietnam 16 Blackstone Acquires Klockner 16 Micronic Gets Another Asian Customer for FPS5100 Laser Pattern Generator 17 RJR Polymers Introduces LCP Compatible Epoxies 17 8. MAJOR PLAYERS 17 Advanced Semiconductor Engineering Group (Taiwan) 17 ASAT Holdings Limited (Hong Kong) 17 Amkor Technology Inc. (US) 18 ASM International NV (The Netherlands) 18 ASM Pacific Technology Ltd (Hong Kong) 18 CARSEM (Malaysia) 18 Chipbond Technology Corp (Taiwan) 18 ChipMos Technologies (Taiwan) 19 FlipChip International (US) 19 Fujitsu Ltd (Japan) 19 NEC Electronics Corporation (Japan) 19 Orient Semiconductor Electronics (Taiwan) 19 Siliconware Precision Industries Co., Ltd. (Taiwan) 20 STATS ChipPAC Ltd. (Singapore) 20 Tessera, Inc. (US) 20 Toshiba America Electronic Components Inc. (US) 20 9. MARKET ANALYTICS 21 10. THE UNITED STATES 25 Chip Manufacturers - Looking for Greener Pastures 25 11. CANADA 26 12. JAPAN 27 Weakness in the Industry Structure 27 Japanese Companies on Comeback Trial 27 13. EUROPE 29 a. France 31 b. Germany 32 c. Italy 33 d. The United Kingdom 34 e. Rest of Europe 35 14. ASIA-PACIFIC 36 A Brief Review 36 China - A Promising Market 36 Taiwan - Looking Ahead 36 15. REST OF WORLD 38 EXHIBITS Table 1: Percentage Breakdown of Semiconductor Capital Equipment Manufacturers in the World - 2005 Table 2: Percentage Breakdown of Semiconductor Plastic Packaging Materials Market in the World - 2005 Table 3: Advanced Electronic Packaging Technology Trends (2010 & 2015) Table 4: Percentage Breakdown of Laminate Substrate Market by Technology in the World - 2005 Table 5: Percentage Breakdown of Leading Fabless Packaging Techniques in the World - 2005 Table 6: Percentage Breakdown Leading Foundry Manufacturing Regions in the World - 2005 Table 7: Percentage Breakdown of Leading IC Socket Manufacturers in the World - 2005 Table 8: Percentage Breakdown of Leading CSP Substrate Suppliers in the World - 2005 Table 9: Percentage Breakdown of Leading Chip Packaging Manufacturers in the World - 2005 Table 10: Trends in Flip Chip Production Worldwide (2005): Percentage Breakdown by End Product Table 11: Global Advanced Electronic Packaging Market by Region for the Period 2007-2015 (Sales in US$ Million) Table 12: Percentage Breakdown of Global Advanced Electronic Packaging Market by Region for the Years 2008 & 2012 Table 13: Global Ball Grid Arrays Market by Region for the Period 2007-2015 (Sales in US$ Million) Table 14: Percentage Breakdown of Global Ball Grid Arrays Market by Region for the Years 2008 & 2012 Table 15: Global Chip Scale Packages Market by Region for the Period 2007- 2015 (Sales in US$ Million) Table 16: Percentage Breakdown of Global Chip Scale Packages Market by Region for the Years 2008 & 2012 Table 17: Global Multi Chip Modules Market by Region for the Period 2007-2015 (Sales in US$ Million) Table 18: Percentage Breakdown of Global Multi Chip Modules Market by Region for the Years 2008 & 2012 Table 19: Advanced Electronic Packaging Market by Product Segment in the US: 2007-2015 (Sales in US$ Million) Table 20: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in the US for the Years 2008 & 2012 Table 21: Advanced Electronic Packaging Market by Product Segment in Canada: 2007-2015 (Sales in US$ Million) Table 22: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Canada for the Years 2008 & 2012 Table 23: Advanced Electronic Packaging Market by Product Segment in Japan: 2007-2015 (Sales in US$ Million) Table 24: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Japan for the Years 2008 & 2012 Table 25: Advanced Electronic Packaging Market by Region in Europe: 2007-2015 (Sales in US$ Million) Table 26: Percentage Breakdown of Advanced Electronic Packaging Market by Region in Europe for the Years 2008 & 2012 Table 27: Advanced Electronic Packaging Market by Product Segment in Europe: 2007-2015 (Sales in US$ Million) Table 28: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Europe for the Years 2008 & 2012 Table 29: Advanced Electronic Packaging Market by Product Segment in France: 2007-2015 (Sales in US$ Million) Table 30: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in France for the Years 2008 & 2012 Table 31: Advanced Electronic Packaging Market by Product Segment in Germany: 2007-2015 (Sales in US$ Million) Table 32: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Germany for the Years 2008 & 2012 Table 33: Advanced Electronic Packaging Market by Product Segment in Italy: 2007-2015 (Sales in US$ Million) Table 34: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Italy for the Years 2008 & 2012 Table 35: Advanced Electronic Packaging Market by Product Segment in the UK: 2007-2015 (Sales in US$ Million) Table 36: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in the UK for the Years 2008 & 2012 Table 37: Advanced Electronic Packaging Market by Product Segment in Rest of Europe: 2007-2015 (Sales in US$ Million) Table 38: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Rest of Europe for the Years 2008 & 2012 Table 39: Advanced Electronic Packaging Market by Product Segment in Asia-Pacific: 2007-2015 (Sales in US$ Million) Table 40: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Asia-Pacific for the Years 2008 & 2012 Table 41: Advanced Electronic Packaging Market by Product Segment in Rest of World: 2007-2015 (Sales in US$ Million) Table 42: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Rest of World for the Years 2008 & 2012 COMPANIES PROFILED