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High Speed Electronics Report 2009
BPA Consulting, Sep 2009
Supply Chain Opportunities in High-Speed Electronics
A Strategic Review of PCB, Material and Interconnection Trends and Needs for Electronic Assemblies for High-Speed Telecom, Datacom Networks and High-End Computers over the period 2009 to 2014.
KEY TRENDS:
- 40G networks are about to take the next step to 100G.
- 16G Fibre Channel is emerging in the data storage arena, 32G will follow
- The copper and fibre interface continues to change and will penetrate at a system level in the future
- Wireless mobile datacom is moving from 3G to 4G.
- Convergence of satellite and terrestrial mobile communications
- Coreless and thin core packaging solutions for high speed semiconductors
KEY DELIVERABLES:
- This study provides a totally integrated assessment of the high speed electronics value chain
- Identification and quantification of the opportunities for small, medium and large technology vendors
- Comprehensive roadmaps detailing the technologies, materials and processes that will be needed to participate in these markets
- Identifies key technology and market drivers of this major market sector
STUDY BACKGROUND AND SCOPE:
In 2001, second generation mobile communication 2G was maturing and 3G on the near horizon with interim technologies 2.5G (GPRS) and 2.75G (EDGE) moving in faster.
8 years on, the demand for greater bandwidth for video streaming,mobile TV and internet has driven the development of LTE (Long Term Evolution), HSPA (High Speed Packet Access) and WiMAX which are designed for data rates of 10Mbps and beyond and are collectively known as 4G. A 3G base station has a bandwidth capacity of 10Mbps. 4G networks will enable a bandwidth capacity of up to 2Gbps. For continuity and compatibility wireless base stations and remote radio heads must accommodate multiple standards and be easily upgradeable.
For data communications carrier networks, the dotcom crash of 2001 delayed the shift from 2.5Gbps to 10Gbps carrier Ethernet as capacity exceeded demand and new installations looked to more cost-effective solutions with multiple 2.5G components rather than selecting the emerging and not so cost-effective 10G components.
8 years on, 10G Ethernet has matured, 40G is emerging and 100G is very much on developers’ roadmaps. The current key issue is whether 100G Ethernet will replace OC-768 in the long haul market. Whether 40G or 100G is used, advanced signal modulation and compensation technologies will need to be implemented in transceiver components
The 2009 High Speed Report will take a look at these and other high speed technologies from 1Gbps to 100Gbps and explore the implications for IC packaging and interconnection technologies, markets and the supply chain. This report will be for strategists and business managers keen to develop current and future business opportunities.
The analyst will review the technological drivers for key systems in the high speed data and telecommunication networking market to identify the features that will impact on the requirements and specifications for printed circuits boards, IC packaging, interconnection and associated assembly, materials and processing.
Systems for review will include;
- Routers
- Servers
- Optical Switches
- Wireless Base Transceiver Stations
The key protocols associated with high speed data and telecommunications are:
- OC-768 (40Gbps SONET/SDH, DWDM)
- 10G, 40G, 100G Carrier Ethernet
- 10G Fibre Channel
- 3G Mobile: HSDPA, EV-DO
- 4G Mobile: LTE, WiMAX
- USB 3.0 to 5Gbps
- Firewire (1394b) to 6.4Gbps
For all of these protocols, progress in ratification of emerging high speed standards and competition between standards will also be considered.
The purpose of the report will be to examine the system performance requirements over the next five years and explore how these will influence the requirements for printed circuit board backplanes, daughter cards and advanced IC packaging.
Key issues reviewed in this study will improve your understanding and help your company to succeed in the high-speed interconnection and packaging and their ancillary materials requirements:
- Market and technology drivers
- High speed technology trends over the next five years
- Winning technologies and protocols
- Key components
- Key players in the supply chain
- Current and future market opportunities
- PCB, advanced IC packaging and materials market size and forecasts
- Cost and environmental issues
- Standards and reliability
- Regional influences and differences
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