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Building Automation: Wireless Communications, Technologies and Markets Development Product Image Special Offer Sale Banner

Building Automation: Wireless Communications, Technologies and Markets Development

  • ID: 1205531
  • February 2010
  • PracTel Inc
Special Offer Banner
10%
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Offer ends 31st Dec 2014

FEATURED COMPANIES

  • Aeon Labs
  • Atmel (Chipsets)
  • Chipcon –TI (Chipsets)
  • Falcom (Modules)
  • Jennic (Chipsets-Modules)
  • Sigma Designs
  • MORE

This report is important to a wide population of researches, technical and sales staff involved in the developing and implementation buildings automation. It is recommended for both service providers and vendors that are working with related technologies. The report also helps to understand issues associated with relationship between building automation ICT and other communications technologies.

Brief:

Commercial buildings (both office and apartment) represent a huge addressable market of field equipment currently using wired field buses to connect sensors and actuators with lighting, heating, elevators, ventilation, access control, and safety systems. Analyzed in this report wireless technologies features and functionalities are very well suited to commercial building communications applications. The market, so far, is conservative and owners of the buildings cautiously accept wireless technologies (most vendors offer their proprietary technologies). The industry analysts predict that progress in this area will be relatively slow; but in 3-5 years from now around 20%-25% of building automation projects will be engineered with standardized wireless connections; the preferred READ MORE >

FEATURED COMPANIES

  • Aeon Labs
  • Atmel (Chipsets)
  • Chipcon –TI (Chipsets)
  • Falcom (Modules)
  • Jennic (Chipsets-Modules)
  • Sigma Designs
  • MORE

1.0 Introduction

1.1 General

1.2 Place

1.3 Scope

1.4 Research Methodology

1.5 Target Audience

2.0 KNX

2.1 General

2.2 Worldwide Acceptance

2.3 Details

2.4 KNX-RF

2.5 KNX Market for Building Automation

2.6 Selected Vendors

- Andromeda

- Distech

- Gira

- Jung

- Siemens

- Trialog

3.0 IEEE 802.15.1 (Bluetooth-BT) in Building Automation

3.1 BT Protocol Stack

3.1.1 Transport layer

3.1.1.1 Radio Layer

3.1.1.2 Baseband and Link Manager Layers

3.1.1.3 Middleware Layer

3.2 Profiles

3.2.1 Power Consumption-ULP

3.3 Bluetooth Security

3.4 Highlights

3.4.1 The Standard:

3.4.2 The Technology:

3.4.3 Evolution

3.5 Market Estimate

3.6 BT Industry

- Bluegiga

- BlueRadios

- Bluelon

- Broadcom

- Cambridge Consultants

- CSR

- Intronico

- Laird Technologies

- Sena

- Smart Network Devices

- Stollmann

- TI

- Wireless Cables

4.0 ZigBee

4.1 General

4.2 Technology

4.2.1 Major Features

4.2.2 Device Types

4.2.3 Protocol Stack

4.2.3.1 Physical and MAC Layers – IEEE802.15.4

4.2.3.1.1 Frame

4.2.4 Upper Layers

4.3 Interoperability

4.4 Security

4.5 Platform Considerations

4.5.1 Battery Life

4.6 ZigBee Technology Benefits and Limitations

4.7 Standardization Process

4.7.1 ZigBee Alliance

4.7.1.1 Objectives

4.7.2 IEEE 802.15.4 and ZigBee

4.7.2.1 IEEE 802.15.4 Radio

4.8 Application Specifics

4.8.1 Building Automation Profile

4.9 Market

4.9.1 Segments-ZigBee Market

4.9.2 Forecast

4.9.3 Industry

- Airbee (Software)

- Amber (RF Systems)

- Arch Rock (WSN)

- Atmel (Chipsets)

- Aurel (Modules)

- CEL (modules)

- Chipcon –TI (Chipsets)

- Cirronet-RFM (Modules)

- Crossbow (WSN, Environment Monitoring, motes)

- Digi (Radio)

- Ember (Chipsets)

- Falcom (Modules)

- GreenPeak (WSN)

- Helicomm (Modules)

- Jennic (Chipsets-Modules)

- Freescale (Chipsets)

- MeshNetics (Atmel Acquired MeshNetics ZigBee Intellectual Properties-February, 2009) (Modules)

- Oki (Chipsets)

- Renesas (Platforms)

- Silicon Laboratories (Chipsets, Modules)

- SimpleHomeNet (Building Automation)

- Synapse (Module, Protocols)

- Telegesis (Integrator)

- TI (Chipsets)

5.0 Z-Wave

5.1 General

5.2 Z-Wave Alliance

5.3 Benefits

5.4 Details

5.4.1 General

5.4.2 Characteristics

5.5 ZigBee and Z-Wave

5.6 Advance Energy Control Framework

5.7 Selected Vendors

- Aeon Labs

- BuLogics

- Mi Casa Verde

- Sigma Designs

- There

5.8 Pricing

6.0 Conclusions

7.0 Appendix: Comparison

LIST OF FIGURES:

Figure 1: Global KNX Equipment Sales Estimate (Building Automation) – $US M

Figure 2: Bluetooth Protocol Stack

Figure 3: Piconets Illustration

Figure 4: Estimate –BT Market (Modules Shipped in Million)

Figure 5: BT Market Estimate –Modules Sales ($US M)

Figure 6: BT Market Geographical Segmentation

Figure 7: ZigBee Channels

Figure 8: ZigBee Protocol Stack

Figure 9: Applications-Profiles

Figure 10: Estimate: ZigBee Modules Market Worldwide ($M)

Figure 11: Estimate: ZigBee Modules Market Worldwide (M Units)

Figure 12: ZigBee Market Segmentation (2009)

Figure 13: ZigBee Market Segmentation (2014)

Figure 14: U.S. ZigBee Product Sales for Lighting and HVAC Building Applications ($US)

LIST OF TABLES:

Table 1: WGs

Table 2: Bluetooth Profiles

Table 3: ZigBee Parameters

Table 4: Z-Wave and ZigBee

Table 5: Z-wave Products Retail Pricing

- Aeon Labs

- BuLogics

- Mi Casa Verde

- Sigma Designs

- There
- Airbee (Software)

- Amber (RF Systems)

- Arch Rock (WSN)

- Atmel (Chipsets)

- Aurel (Modules)

- CEL (modules)

- Chipcon –TI (Chipsets)

- Cirronet-RFM (Modules)

- Crossbow (WSN, Environment Monitoring, motes)

- Digi (Radio)

- Ember (Chipsets)

- Falcom (Modules)

- GreenPeak (WSN)

- Helicomm (Modules)

- Jennic (Chipsets-Modules)

- Freescale (Chipsets)

- MeshNetics (Atmel Acquired MeshNetics ZigBee Intellectual Properties-February, 2009) (Modules)

- Oki (Chipsets)

- Renesas (Platforms)

- Silicon Laboratories (Chipsets, Modules)

- SimpleHomeNet (Building Automation)

- Synapse (Module, Protocols)

- Telegesis (Integrator)

- TI (Chipsets)

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