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Smart Grid: Role of Wireless ICT in Building Automation and Control

Description:
This report specifies on the electrical Smart Grid. In particular, it is concentrating on Wireless Information and Communications Technologies (WICT) developing, standardization and markets in building automation and control (BA&C) and the role they play in the Smart Grid development - one of the most important projects in the global economy; with the U.S. government pumping billions dollars in Smart Grid implementation. BA&C is one of the significant elements of the Smart Grid infrastructure, with millions of apartment buildings and around 750,000 office building being eventually connected with this electrical Smart. It is estimated that efficient BA&C can save around $3-$10 billion (smart energy consumption) on the annual basis in the U.S. alone.

The report analyzes markets and technologies for the following WICT:

- KNX-RF
- ZigBee
- Z-Wave
- Bluetooth
- EnOcean.

The report addresses technologies details and their roles in the efforts to build “green” economy; it is also provides marketing characteristics and survey of the selected vendors.

The report also stresses the importance of integration WICT with wired technologies, such as BACnet; some of the BA&C wired protocols are also analyzed in connection with this.

This report is useful to a wide audience of engineers, managers and sales staff involved in the design, implementation and maintenance of wireless communications equipment for BA&C and Smart Grid.

Target Audience

This report is important to a wide population of researches, technical and sales staff involved in the developing of the WICT for BA&C; and particular, in connection with the Smart Grid project. It is recommended for both users and vendors that are working with related technologies. The report also helps to understand issues associated with relationship between BA&C communications and other networks.

Research Methodology

Considerable research was done using the Internet. Information from various Web sites was studied and analyzed. Evaluation of publicly available marketing and technical publications was conducted. Telephone conversations and interviews were held with industry analysts, technical experts and executives. In addition to these interviews and primary research, secondary sources were used to develop a more complete mosaic of the market landscape, including industry and trade publications, conferences and seminars.

The overriding objective throughout the work has been to provide valid and relevant information. This has led to a continual review and update of the information content.
 
Contents:
1.0 Introduction
1.1 General
1.2 Value
1.3 Goals
1.4 Research Methodology
1.5 Target Audience

2.0 Smart Grid and Building Automation
2.1 General
2.2 Building Automation and Control – Part of Smart Grid Initiatives
2.2.1 Details
2.2.1.1 BA&C Major Tasks
2.2.2 Process Example
2.2.3 BA&C System Components
2.3 U.S.
2.4 England
2.5 Definition
2.6 Developing
2.7 ICT Requirements

3.0 History - KNX
3.1 KNX
3.1.1 General
3.1.2 Worldwide Acceptance
3.1.3 Applications
3.1.4 Independence
3.1.5 Details
3.1.5.1 Device Categories
3.1.5.2 Benefits
3.1.5.3 Process
3.1.6 KNX-RF
3.1.6.1 General
3.1.6.2 Physical Layer
3.1.6.3 Configuration Modes
3.1.6.4 Device Models
3.1.7 KNX Market for Building Automation
3.1.8 Selected Vendors
- Andromeda
- Gira
- Jung
- Siemens
- Trialog

4.0 ZigBee
4.1 Directions
4.1.1 Drivers
4.2 ZigBee/IEEE 802.15.4 Place in BA&C
4.2.1 General
4.2.2 Technology
4.2.2.1 Major Features
4.2.2.2 Device Types
4.2.2.3 Protocol Stack
4.2.2.3.1 Physical and MAC layers – IEEE802.15.4
4.2.2.3.1.1 Frame
4.2.2.3.2 Upper Layers
4.2.2.3.2.1 Interoperability
4.2.2.3.2.2 Security
4.2.3 Platform Considerations
4.2.3.1 Battery Life
4.2.4 ZigBee Technology Benefits and Limitations
4.3 Standardization Process
4.3.1 ZigBee Alliance
4.3.1.1 Objectives
4.3.2 Profiles
4.3.3 ZigBee Smart Energy Profile-WICT for Smart Grid
4.3.3.1 Features and Enhancements
4.3.4 ZigBee IP
4.3.5 Building Automation Profile
4.3.6 Market
4.3.6.1 Expectations
4.3.6.2 Segments
4.3.6.3 Forecast
4.3.7 Industry
- Airbee (Software)
- Amber (RF Systems; BA Application)
- Arch Rock (WSN)
- Atmel (Chipsets, BA&C)
- Aurel (Modules BA&C)
- CEL (Modules; BA&C)
- Cirronet-RFM (Modules-Industrial Applications)
- Crossbow (WSN, Environment Monitoring BA&C, motes)
- Digi (Radio, Energy Application)
- Duolog (SOC Transceivers)
- Dust Networks (WSN, BA)
- Ember (Chipsets; BA&C)
- GreenPeak (WSN)
- Helicomm (Modules)
- Jennic (Chipsets-Modules-Health Care)
- Freescale (Chipsets)
- Nuri Telecom (AMR Application)
- Oki (Chipsets)
- Renesas (Platforms, AMR, BA&C)
- Silicon Laboratories (Chipsets, Modules)
- Synapse (Module, Protocols)
- Telegesis (Integrator, Modules)
- TI (Chipsets; BA&C)

5.0 Z-Wave
5.1 General
5.2 Z-Wave Alliance
5.3 Benefits
5.4 Details
5.4.1 Features
5.4.2 Characteristics
5.4.2.1 Protocol Stack
5.4.2.2 Devices
5.5 ZigBee and Z-Wave
5.6 Advance Energy Control Framework
5.7 Selected Vendors
- Aeon Labs
- BuLogics
- Mi Casa Verde
- Sigma Designs
- There
5.8 Pricing
5.9 Market

6.0 IEEE 802.15.1 (Bluetooth-BT)
6.1 BT Protocol Stack
6.1.1 Transport layer
6.1.1.1 Radio Layer
6.1.1.2 Baseband and Link Manager Layers
6.1.1.2.1 Power Consumption
6.1.2 Middleware Layer
6.1.2.1 Sniffing Mode
6.1.3 Bluetooth Security
6.1.4 Highlights
6.1.4.1 The Standard
6.1.4.2 The Technology
6.1.5 Evolution (BT v2.0-v4.0)
6.1.6 Profiles
6.1.6.1 Power Consumption-ULP-BT V4.0
6.2 Market Estimate
6.3 Industry: Sample
- Sena

7.0 EnOcean
7.1 The Company
7.2 EnOcean Alliance
7.3 Standard
7.3.1 Features
7.3.2 Drivers
7.3.2.1 EnOcean –Green Technology
7.3.2.2 Batteries
7.4 Details
7.4.1 Framework
7.4.2 Generations
7.4.3 Profiles
7.4.4 Benefits
7.5 Unions
7.6 Market Estimate
7.7 Industry
- BSC Magnum
- Beckhoff
- Echoflex
- Illumra
- Thermokon

8.0 Conclusions
- Attachment I - LEED
- Attachment II - BACnet
- Origination
- Goal
- Popularity
- Details
- Vendors and Products

List Of Figures:

Figure 1: Global KNX Equipment Sales Estimate (BA&C) – $US M
Figure 2: ZigBee Protocol Stack
Figure 3: Interoperability Platform
Figure 4: Profiles - Illustration
Figure 5: ZigBee Market Segments
Figure 6: Estimate: ZigBee Modules Sales Market Worldwide ($M)
Figure 7: Estimate: ZigBee Modules Market Worldwide (M Units)
Figure 8: BA&C – related Sector of ZigBee Market – Estimate ($M)
Figure 9: BA&C – related Sector of ZigBee Market – Estimate (M Units)
Figure 10: ZigBee Market Segmentation (2010)
Figure 11: ZigBee Market Segmentation (2014)
Figure 12: Illustration – Z-Wave Protocol Layers
Figure 13: TAM: U.S. Sales – Z-Wave Products for BA&C-Commercial Buildings (Unit M)
Figure 14: TAM: U.S. Sales – Z-Wave Products for BA&C-Commercial Buildings ($M)
Figure 15: Bluetooth Protocol Stack
Figure 16: Piconets Illustration
Figure 17: Estimate –BT Market (Unit Shipped in Billion)
Figure 18: Estimate –BT Market (Units Shipped $B)
Figure 19: BT Market Geographical Segmentation
Figure 20: Functionalities
Figure 21: Energy Requirements
Figure 22: Market Estimate: EnOcean Equipment Sale ($M)
Figure 23: Market Estimate: EnOcean Equipment Sale (Mil. Units)

List of Tables:

Table 1: Comparison
Table 2: KNX Association WGs
Table 3: ZigBee Parameters
Table 4: ZigBee Smart Energy Profile Feature Set
Table 5: Z-Wave and ZigBee
Table 6: Z-Wave Products Retail Pricing
Table 7: Samples of Bluetooth Profiles
Table 8: Illustration-Bluetooth Profiles and Protocols
Table 9: Parameters
Table 10: Estimate: BA&C Segment of BT Market (% from Total)
Table 11: Major Features
Table 12: Energy Scavenging
 
Companies Mentioned
- Airbee (Software)
- Amber (RF Systems; BA Application)
- Arch Rock (WSN)
- Atmel (Chipsets, BA&C)
- Aurel (Modules BA&C)
- CEL (Modules; BA&C)
- Cirronet-RFM (Modules-Industrial Applications)
- Crossbow (WSN, Environment Monitoring BA&C, motes)
- Digi (Radio, Energy Application)
- Duolog (SOC Transceivers)
- Dust Networks (WSN, BA)
- Ember (Chipsets; BA&C)
- GreenPeak (WSN)
- Helicomm (Modules)
- Jennic (Chipsets-Modules-Health Care)
- Freescale (Chipsets)
- Nuri Telecom (AMR Application)
- Oki (Chipsets)
- Renesas (Platforms, AMR, BA&C)
- Silicon Laboratories (Chipsets, Modules)
- Synapse (Module, Protocols)
- Telegesis (Integrator, Modules)
- TI (Chipsets; BA&C)
- Aeon Labs
- BuLogics
- Mi Casa Verde
- Sigma Designs
- There
 
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