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The Worldwide IC Packaging Market
New Venture Research, June 2010, Pages: 350
The Most Comprehensive Report Available On The Global IC Packaging Industry
Synopsis:
Industry Overview
- Semiconductor Industry Analysis
- SATS Company Financial Analysis
- Global Economic Factors
Worldwide IC Packaging Market Forecasts, 2008–2014
- Units
- Package Prices
- Packaging Revenue
- By Semiconductor Product
- By Package Family
- By I/O Range
Contract IC Packaging Market Forecasts, 2008–2014
- Units
- Package Prices
- Packaging Revenue
- Competitive Rankings
- Company Profiles
After an unprecedented five years of continuous market growth, the semiconductor industry faltered in late 2009 as the global economic crisis struck hard. So, where is the industry headed now and what are the implications for the IC packaging industry? New Venture Research (NVR) , in the 2010 Edition of The Worldwide IC Packaging Market, analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market.
The report begins with NVR’s views on the state of the semiconductor industry, along with a top level forecast (see Figure 1). This discussion includes factors bearing on individual semiconductor products as well as global economic factors. The financial performance of the publicly-traded SATS companies’ is also addressed.
Following this high-level review, the report presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the contract assembly market. The package families are then rolled up by I/O count and semiconductor product. In doing so, the report generates the total value of the IC packaging industry.
Next, the report presents NVR’s continuing, extensive coverage of the packaging contractor market. Packaging contractors will continue to assume a larger share of the world's IC packaging business. The report breaks the contractor market down by package families and major product categories providing units and revenue for each category. To help you further assess this group of companies, the report profiles the activities of the world’s largest contractors and the packages they offer.
Author:
Sandra Winkler is the senior analyst for IC packaging at New Venture Research (NVR). She began her analyst career as an independent consultant to the telecommunications industry more than 20 years ago. Ms. Winkler has authored widely cited reports on IC packaging since 1995 for Electronic Trend Publications (ETP) which is now NVR. She has spoken at numerous industry conferences and has written articles for a variety of trade publications. Ms. Winkler has an MBA from Santa Clara University.
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