Advances in Abrasive Technology XIII
Trans Tech Publications Inc, November 2010, Pages: 1050
Series: Advanced Materials Research Vols. 126-128
Selected, peer reviewed papers from ISAAT 2010
Abrasive machining is one of the oldest technologies, and continues to have a far-reaching impact on a broad spectrum of industries. In particular, there is an ever-increasing demand by modern manufacturing for advanced abrasive techniques and other precision machining technologies. As well as abrasive-related technologies, electrical discharge machining (EDM), glass molding, machine tool systems, green manufacturing, laser-beam machining, tribology, advanced cutting methods, etc. are addressed here. The more than 167 presentations contributed by workers from all over the world will make this volume essential reading.
Preface
Organizers, Sponsors and Committees
Session A1: Abrasive Jet Machining
Progress in the Modeling of Abrasive Jet Machining
Y.M. Ali, P. Mathew and J. Wang
Characteristics and Polishing Effect of Abrasive Jet Beam with Polymer Abrasive Suspension Additives
W.S. Luo, C.Y. Wang, Y.X. Song and Y.P. Liao
Session A2: Abrasive Machining Mechanical Characterization of Lapping Plate Materials in Diamond Charging Process
H. Tanaka, H. Chiba, T. Yoshikawa, K. Iwatsuka and Y. Maeda
Simulation of Grinding Surface Creation – A Single Grit Approach
X. Chen and T. Tecelli Öpöz
A Study on Multi-Objective Optimization of Abrasive Blasting Systems
V.N. Pi and T.M. Duc
Analysis and Modeling of Micro Abrasive Air Jet Cutting Aspect Ratio
Q.L. Li, C.Z. Huang, J. Wang, H.T. Zhu and Z.W. Liu
Contact Conditions in 5-Axis-Grinding of Double Curved Surfaces with Toric Grinding Wheels
B. Denkena, L. de Leon and L. Behrens
Analysis of Super-High Speed Point Grinding Forces
Y.D. Gong, J. Qiu, Y.M. Liu and J. Cheng
Theoretical Analysis of Grinding Temperature Field for Carbon Fiber Reinforced Plastics
H. Gao, H.L. Ma, Y.J. Bao, H.P. Yuan and R.K. Kang
Laser Assist Powder Jet Deposition
N. Yoshihara, R. Hiromatsu, K. Mizutani, J.W. Yan and T. Kuriyagawa
A Study on Pressure Stability in Double-Sided Polishing Process
W. Li, C. Jin and X.Z. Hu
Process Influences in the Wire Cutting of Concrete
B. Denkena, L. de Leon and F. Seiffert
Research on Machining Simulation of Ultra High-Speed Grinding Machine
Tool Based on Web
W.S. Wang, P. Guan and T.B. Yu
Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad
M. Li, Y.W. Zhu, J. Li, J.F. Ye and J.L. Fan
Grinding Characteristic Research of High Efficiency Deep Grinding for Viscous Material
X.M. Sheng, L. Guo, K. Tang, H.Q. Mi, J.W. Yu and T. Chen
A Simulation System for Grinding Based on Virtual Reality
T.B. Yu, P.C. Su, J.Q. Zhang, P. Guan and W.S. Wang
Analysis of Roughness in Super-High Speed Point Grinding
Y.M. Liu, Y.D. Gong, J. Cheng and T.C. Han
Grinding Performance of a Grain-Arranged Diamond Wheel against Aluminum
Alloys and Ti6Al4V
S. Okuyama, A. Yui and T. Kitajima
Study on the Subsurface Damage Distribution of the Silicon Wafer Ground by Diamond Wheel
S. Gao, R.K. Kang, D.M. Guo and Q.S. Huang
Investigation of Grinding Process Simulation
T.B. Yu, J.Q. Zhang, P. Guan and W.S. Wang
Fabrication of a Spherical Silicon Solar Cell Module
U.C. Cho
Application of a Case-Based Process Expert System for NC Camshaft Grinding
Z.H. Deng, D.F. Cao, X.H. Zhang and H. Tang
Effect of Flexing on Coated Abrasive Belt Grinding of Stainless Steel
X. Kennedy and S. Gowri
Ultrasonic Vibration Grinding Test of Composite Ceramics Based on the Nonlocal Theory
B. Zhao, P. Xie and C.Y. Zhao
Study on Surface Residual Stress of Nano-Zirconia Toughened Alumina Ceramics under Two-Dimentional Ultrasonic Vibration Assisted Grinding
Y.Y. Yan, B. Zhao and J.L. Liu
Development of Media for Low Pressure Abrasive Flow Machining
W.S. Fong, Y.M. Wan and D.L. Butler
Experimental Investigation on High-Speed Grinding of 40Cr Steel with Vitrified CBN Grinding Wheel
J.W. Yu, T. Chen, Z.T. Shang, X.M. Sheng and G.Z. Xie
On-Machine Method to Condition the Grinding Ability of Resin-Bond Wheels
Y. Tani, T.W. Kim, J. Murata, Y. Zhang, S. Sawayama and K. Tsutanaka
A Study on the Spiral Polishing of the Inner Wall of Stainless Bores
W.C. Chen, B.H. Yan and S.M. Lee
Modeling Surface Roughness and Hardness of Grinding SKD11 Steel Using Adaptive Network Based Fuzzy Inference
C.H. Chang, J.C. Tsai, N.H. Chiu and R.Y. Chein
Surface Texture Analysis of Fixed and Free Abrasive Machining of Silicon Substrates for Solar Cells
C.C.A. Chen and P.H. Chao
Influences of Characteristics of Large Particle on the ‘Trap’ Effect of Semi-Fixed Abrasive Tool
B.H. Lv, J.L. Yuan, Q.F. Deng and Z.W. Wang
Session A3: Advanced Cutting Technology Laboratory Comparison of Mini-Discs with Point-Attack Picks
B. Tiryaki, I.D. Gipps and X.S. Li
Tool Wear Mechanism in Continuous Cutting of Difficult-to-Cut Material under Dry Machining
G.A. Ibrahim, C.H. Che Haron and J.A. Ghani
On Geometrical Errors and their Suppression in Turning Operation by Controlling Thrust Forces
K. Miura, T. Yamada and H.S. Lee
Optimal Improvement on Cutting Yield Rate in ACF Attach Process of TFT-LCD Module Using Response Surface Method
J.L. Kuo and C.H. Hsieh
Study on Tool Life by Breakage in Micro Endmilling
O. Horiuchi, B.X. Ma, M. Nomura, T. Shibata, Y. Murakami and M. Masuda
Comparative Studies on the Cutting Performance of HFCVD Diamond and DLC Coated
WC-Co Milling Tools in Dry Machining Al/SiC-MMC
B. Shen, F.H. Sun and D.C. Zhang
Study on the Cutting Performance of HFCVD Diamond Coated Silicon Nitride Inserts in Dry Turning Aluminum Silicon Alloy
F.H. Sun, B. Shen and G.D. Yang
Session B1: Brittle Material Machining Elastic and Plastic Behaviors in Ductile-Regime Machining Process of Quartz Glass
T. Takechi, J. Tamaki, A. Kubo and A.M.M. Sharif Ullah
DEM Simulation and Experimental Investigation of Silicon Carbide on Pre-Stressed Machining
S.Q. Jiang, Y.Q. Tan, G.F. Zhang, R.T. Peng and D.M. Yang
A Study on the Ductile Mode Cutting of Lithium Niobate
H. Shizuka, K. Okuda, M. Nunobiki, W. Li and T. Inaoka
A Study of Ultrasonically Assisted Fly Cutting for High Precision Machining Hard Brittle Materials
K. Hara, H. Isobe, S. Chiba and K. Abe
The Investigation on Small Hole Drilling-Grinding in Glass and Ceramic
Y.M. Quan, J.J. Chen and H. Xu
Machining Schemes for Dicing Soda Lime Glass
J.C. Tsai and H.S. Chen
Session C1: CMP and Silicon Wafer Processing Effect of Shear and Thermal Characteristics on Chemical Mechanical Polishing
H.J. Tsai, J.H. Horng, H.C. Tsai, S.J. Chiu and P.Y. Huang
A Dishing Model for Chemical Mechanical Polishing of Plug Structures
S.H. Chang
Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer
Z.Z. Wang, Y.B. Wu, L.B. Zhou, Y.B. Guo and C.X. Wu
Machining Force and Modes for Si Wafer Machining with Rotational Tool
N. Yokemura, K. Imai and H. Hashimoto
Wafer Polishing Process with Signal Analysis and Monitoring for Optimum Condition of Machining
J.T. Lee, E.S. Lee, J.K. Won and H.Z. Choi
Effects of Wafer Carrier Design on Contact Stress Uniformity in CMP
I. Hu, T.S. Yang and K.S. Chen
Study on Chemical Mechanical Polishing with Ultrasonic Vibration
P.L. Tso and Y.C. Chang
Experimental Investigation on Effects of Passivants in the Abrasive-Free Polishing of Copper Film
J.C. Tsai and W.C. Lin
Friction Phenomenon in Chemical Mechanical Polishing of Oxide Film
M.Y. Tsai and W.Z. Yang
Diamond Pad Conditioners with Oriented Polycrystalline Diamond Cubes
Y.T. Chen, T.W. Lin, Y.S. Liao, J.S. Chen, C.Y. Lin and J.C. Sung
Mosaic Diamond Disks with Brazed Pallets for CMP
Y.T. Chen, C.C. Yu, C.S. Chou, C.C. Chou, Y.L. Pai, Z.Q. Yang, M.H. Cheng, T.C. Hu, M. Sung and J.C. Sung
Session C2: Coolants and Cooling Estimation of Heat Transfer Coefficients in Dry and Cold-Air Cutting
F. Jiang, J.F. Li, J. Sun, S. Zhang and L. Yan
Tool Life and Surface Roughness of FCD 700 Ductile Cast Iron when Dry Turning Using Carbide Tool
J.A. Ghani, M.N.A. Mohd Rodzi, K. Othman and C.H. Che Haron
Effects of Cutting Fluid with Nano Particles on the Grinding of Titanium Alloys
Y.S. Liao, Y.P. Yu and C.H. Chang
Session D1: Design, Fabrication and Analysis of Devices for the Applications of Abrasive Technologies Development of Three-Dimensional Dynamometer for Wafer Grinder
X.L. Zhu, R.K. Kang, Y.Q. Wang and D.M. Guo
Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire – Surface Formation Characteristics
Z.Q. Liang, X.B. Wang, Y.B. Wu and W.X. Zhao
Session E1: EDM, Ultrasonic Machining, and Laser Machining Fabrication of Micro Shapes by EDM with Micro Electrodes Generated in Turning Operation
K. Miura, M. Takahashi, T. Yamada and H.S. Lee
Study on Application of Taguchi Method to Ultrasonic-Aided Spin Welding of Heterogeneous Plastic Materials
K.M. Shu, C.S. Chang, W.J. Chuang, S.I. Wang and Y.Y. Jang
Bending of Pure Titanium Sheet to Curved Surface Shape by Laser Forming Technique
M. Nunobiki, K. Okuda, K. Hourai and H. Shizuka
Microfabrication of Photosensitive Glass by Femtosecond Laser Direct Writing
C.W. Cheng, J.S. Chen, P.X. Lee and C.W. Chien
Repairing Damage on Ground Fused Silica by CO2 Laser Irradiation
P. Yao, T. Abe, N. Yoshihara, T.F. Zhou, J.W. Yan and T. Kuriyagawa
An Investigation of Attachment on Electrode Surface in Dry EDM
K.Y. Shue, Y.Y. Tsai and Y.M. Chang
Session E2: Eco-Machining Investigation of Eco-Friendly Fixed-Abrasive Polishing with Compact Robot
S. Ogawa, S. Okumura, T. Hirogaki, E. Aoyama and Y. Onchi
Session F1: Finishing, Lapping and Polishing High-Integrity Finishing of 4H-SiC (0001) by Plasma-Assisted Polishing
K. Yamamura, T. Takiguchi, M. Ueda, A.N. Hattori and N. Zettsu
A Review on the CMP of SiC and Sapphire Wafers
Y.G. Wang and L.C. Zhang
Polyline Dwell Time Algorithm for Every Type of Tool Path for Ultrasonic-Magnetorheological Combined Finishing
F.H. Zhang, X.B. Yu, Y. Zhang and Y.Y. Lin
Odor Suppression of Putrid Water-Soluble Coolant Using Home Ion Generator
S. Ninomiya, M. Iwai, K. Takano, T. Shimizu and K. Suzuki
Study the Rheological Properties of Abrasive Gel with Various Passageways in Abrasive Flow Machining
K.C. Cheng, K.Y. Chen, A.C. Wang and Y.C. Lin
Processing Characteristics of Structured Lapping Films under Grinding Load Control
S. Higuchi, M. Sugisaki, H. Kato and K. Okawa
Design of Product Surface Finish via Magnetic-Assistance
P.S. Pa
Lapping of Polycrystalline Diamond Compact (PDC)
A. Fang, E. Castell Perez, A. Puerta Gomez, S.S. Zhou and J. Sowers
Research on the With-In Wafer Non-Uniformity (WIWNU) of the Large Quadrate Optic in the Fast Polishing Process
Y.B. Guo, W. Yang, Z. Chen and Y.F. Peng
Fabrication of Small Polishing Tool by Using Electrophoresis Phenomenon
W. Natsu and T. Miyata
Identification of Brittle-Ductile Material Removal Characteristics in Ultrasonic Aided Lapping of Engineering Ceramics
F. Jiao, C.Y. Zhao and B. Zhao
Evaluation of Polished Surface for Viscoelastic Polymer
T. Kubo, S. Ota, M. Oda, K. Hashishita and Y. Kakinuma
Research on Axisymmetric Free-Form Creation with Rotating Polishing Tool
S. Tsubota and W. Natsu
Simulation Study of Sliding Control for Constant Polishing Force Using an Innovative Sphere-Like Polishing Tool on a Machining Center
A. Wahjudi and F.J. Shiou
Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers
Y.G. Wang, L.C. Zhang and A. Biddut
On the Technologies of Electrochemical Mechanical Finishing
G.B. Pang, X. Adayi, W.J. Xu, Y.P. Peng and J.J. Zhou
EDM Properties of EC-PCD Using a Copper Electrode
S. Ninomiya, M. Iwai, G. Sugino, T. Takada and K. Suzuki
Using Electro-Rheological Chain Structure to Improve SKD11 Surface
M.C. Hung, Y.Y. Tsai and L. Wang
Gear Finishing and Modification Compound Process by Pulse Electrochemical Finishing with a Moving Cathode
G.B. Pang, W.J. Xu, J.J. Zhou and D.M. Li
A New Polishing Pad of EVA-Adhesive-Dressed-with-SiC-Grits Polishing Face and its Applications in Silicon Wafer Polishing
S.L. Tsai, F.Y. Huang, B.H. Yan and Y.C. Tsai
Mathematical Modeling of Electrochemical Deburring
W.J. Xu, W. Wang, X.Y. Wang and G.B. Pang
Study on Precision Polishing of a Mini Roller Mold
C.L. Chao, Y.C. Hsiao, W.C. Chou, C.W. Kuo, W.L. Lai, H.Y. Lin and K.J. Ma
Session G1: Glass Molding and Related Topics Abrasive Wear Caused by EMC Particles
Y.C. Liaw and J.H. Chou
Numerical Simulation on Two-Step Isothermal Glass Lens Molding
S.H. Yin, K.J. Zhu, Y.F. Wang, F.J. Chen and Y. Wang
Session G2: Grinding Wheel and Abrasive Grain Technologies
Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire – Wear Behaviors of Resin Bond Diamond Wheel
Y.B. Wu, Z.Q. Liang, X.B. Wang and W.M. Lin
Effect of Wheel Arrangement on Ground Surface Topography in Horizontal-Axis-Type Rotary Surface Grinding
A. Kubo, J. Tamaki and A.M.M. Sharif Ullah
A Study of the Diamond Tools for Grinding Polycrystalline Diamond
S.Y. Luo, J.K. Ho, M.Y. Tsai, Y.S. Liou and W.E. Chen
Complex Grinding Assisted with Electrical Discharge Machining for Electrically Conductive PCD
M. Iwai, S. Ninomiya, G. Sugino and K. Suzuki
Loading in Grinding: Chemical Reactions in Steels and Stainless Steels
J. Badger, S. Murphy and G.E. O'Donnell
The Application of Three-Dimensional Surface Parameters to Characterizing Grinding Wheel Topography
L. Yan, Z.X. Zhou, F. Jiang and Y.M. Rong
Effect of Ground Surface Roughness of Tool on Adhesion Characteristics of PVD Coating
M. Furuno, K. Kitajima, Y. Tsukuda and T. Akamatsu
Intermittent Grinding of Advanced Ceramic with the T-Tool Grinding Wheel
T. Tawakoli and B. Azarhoushang
Characterization and Performance of Monolayer Brazed Polycrystalline CBN Abrasive Tools
W.F. Ding, J.H. Xu, Z.Z. Chen, H.H. Su, Y.C. Fu and Y. Chen
Thrust Force Directional Vibration-Assisted Ductile-Mode Grinding of Single-Crystal Si
K. Imai and H. Hashimoto
Sharpening Mechanism Using Composite Electro-Plating In-Process Sharpening Technique
T.J. Chen, R.T. Lee and Y.C. Chiou
Investigation on Material Property of Electrically Conductive Polycrystalline Composite Diamond (EC-PCD)
M. Iwai, S. Ninomiya, G. Sugino and K. Suzuki
Processing EC-PCD by Constant-Force Grinding Assisted with EDM
G. Sugino, M. Iwai, T. Sano, S. Ninomiya and K. Suzuki
Session H1: High Speed and High-Efficiency Machining Ultra High Speed Turning of Inconel 718 with Sialon Ceramic Tools
G.M. Zheng, J. Zhao, X.Y. Song, Q.Y. Cao and Y.E. Li
Analysis of Surface Topography Characteristics in Electrochemical Mechanical Finishing
Z.F. Wei, W.J. Xu, G.B. Pang and X.Y. Wang
Session I1: In-Process Measurement and Monitoring, Metrology Effects of Cutting Parameters on the Transverse Vibration of Diamond Circular Saw Blade
H.Y. Fang, Y. Li, H. Huang and X.P. Xu
Modeling and Simulation of 3D Surface Finish of Grinding
A.M.M. Sharif Ullah, J. Tamaki and A. Kubo
Condition Monitoring in a Machine Tool Spindle Using Wireless Sensor
C.C. Ho, T.H. Kuo and T.T. Tsai
Approaches to In-Process Measurement of Surface Roughness in Cylindrical Grinding
T. Tachikawa, K. Ohashi, M. Tago and S. Tsukamoto
The Three-Dimensional Surface Topographic Characterisation of Diamond Grinding Wheels
D.L. Butler
Online Measurement of the Crankshaft Crankpin Roundness Errors in the Process of Coordinate Polishing with Abrasive Tap
G.J. Xiao, Y. Huang, Z. Huang and L.N. Si
Improvement in Oxide-Pattern Sizes Controllability on Scanning Probe Nanolithography
T. Onuki, T. Tokizaki, H. Ojima, J. Shimizu and L.B. Zhou
A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers
J. Zhang, B. Liu, M. Qian, X.L. Zhu and R.K. Kang
The Development of the Automatic Measurement of Straightness Using by a Ball Screw
G. Kono, T. Kuroda, T. Daitoh and K. Maruoka
Study of AE Signal for Tool Wear Monitoring in Micro Milling Based on LVQ Algorithm
C.L. Yen, M.C. Lu and J.L. Chen
New Development of Contact Probe and Methodology
G. Kimoto, T. Watanabe, S. Matsusaka, A. Inoue and T. Kuroda
Design of Digital Filters for Si Wafer Surface Profile Measurement – Noise Reduction by Lifting Scheme Wavelet Transform
K. Nonomura, M. Ono, L.B. Zhou, J. Shimizu and H. Ojima
Online Cutting Tool Wear Monitoring Using I-Kaz Method and New Regression Model
J.A. Ghani, M. Rizal, M.Z. Nuawi, C.H. Che Haron, M.J. Ghazali and M.N. Ab Rahman
On-Line Inspection of the Surface Roughness of Workpiece in Ultraprecision Machining
H.H. Tsai and H.P. Feng
Session M1: Machine Tools and Systems, Tooling Processing Wear Performance Evaluation of Tungsten Carbide Taps in Blind Hole Tapping Cast Iron
M. Chen, X.H. Zhang, B. Han, B. Rong and G. Liu
A Study of the Cutting Temperatures of Turning Stainless Steels with Chamfered Main Cutting Edge Nose Radius Worn Tools
C.S. Chang
Development and Analysis of Special-Shaped Stone Multi-Function NC Machining Center
K. Zhang, D.H. Zhao, H. Guo, B.J. Hou and Y.H. Wu
Experimental Study on Milling Hardened SKD Steel Using Micro CBN Ball-End Mills
Y.T. Liu, N.H. Chiu, Y.C. Lin, C.L. Lai, Y.F. Lin and H.H. Chiu
Drilling Force and Temperature of Bone by Surgical Drill
Y.X. Yang, C.Y. Wang, Z. Qin, L.L. Xu, Y.X. Song and H.Y. Chen
A Ball-Bar Based Error Measurement Method for a RRTTT-Type Five-Axis Machine Tool
S.M. Wang, H.J. Yu and D.F. Chen
Research on a Helical Drill Point Grinding Machine
P. Zou, X.L. Yang, J.Z. Xu, W.Y. Tian and M. Hu
The Kinematical Performance Analysis of a Kind of Parallel Turning-Grinding Machine
S.X. Yuan, X.L. Wen and M. Hu
Development of a Reverse Micro EDM-Drilling for Holing Diamond-Tool
S.T. Chen, Z.H. Jiang, Y.Y. Wu and H.Y. Yang
Study on Thermal Properties of Hybrid Journal Bearing for Super High Speed Grinding Machine
S.C. Xiu, S.Q. Gao and Z.L. Sun
Session M2: Micro/Nano-Machining Grinding and Polishing of Nanolayered Structures: Thin Film Amorphous Silicon Solar Panels
T. Sumitomo, L.B. Zhou and H. Huang
CIMDW – A New Technique of Corona Ignited Micro-Discharge in Microwelding
Y.S. Liao, J.Y. Lin, Y.C. Chung and T.Y. Yang
Modeling Aspect Ratio of a Micro EDM Hole
G. Yin, Z. Yu, C. An and J. Li
Effect of Material Type and Tip Radius of AFM Probes on Nanosheets
Groove Machining Accuracy
K. Demura, S. Hirose and T. Ihara
Mold Fabricated by Nanoscratching for Nanoimprint Lithography
W. Ohsone, J. Shimizu, L.B. Zhou, H. Ojima, T. Onuki, T. Yamamoto and H. Huang
The Determination of Key Material Property in High Energy Beam Drilling
J.E. Ho and C.L. Yen
Grindability of Micro Pyramid-Structured Surface for Various Hard and Brittle Materials
J. Xie, Y.X. Lu and Y.W. Zhuo
Evaluating the Micromachining Rate of Nanosecond Laser with Thermal Analysis
J.E. Ho and H.T. Young
Optimal Parameter Design in Flip Chip Micro-Machining Process for Solder Residue by Using Design of Experiments Approach
J.L. Kuo and C.C. Kuo
Influence of the Electrochemical Dissolution Effect on the Material Removal Rate Utilizing Electrokinetic Phenomenon
C.S. Leo, D.L. Butler, S.H. Ng and S. Danyluk
A Study of Uncut Chips Produced by CNT Grinding Wheel
Y. Zhang, Y. Gao and J. You
In Situ: A Novel Approach for the Production of Micro Holes
K.P. Somashekhar, N. Ramachandran and J. Mathew
Analysis of Mechanical Property of Crystal CaF2 and Effects of Tool Rake Angle on Ductile Machining Process
M.J. Chen and W.B. Jiang
Session S1: Surface Integrity and Materials Characterization Investigation of Surface Integrity in Conventional Grinding of Ti-6Al-4V
G.Q. Guo, Z.Q. Liu, X.J. Cai, Q.L. An and M. Chen
Effect of Aged AlN Reinforced Al-Si Alloys on Dry Sliding Wear Behaviour
M.J. Ghazali, M.N. Wahab, A.R. Daud and J.A. Ghani
Optimal Cutting Parameters for Desired Surface Roughness in End Milling Inconel
Y.W. Wang, S. Zhang, J.F. Li and T.C. Ding
Polish Properties of Nano-Cluster Diamonds on Glass Substrates
S.H. Sung, Y.C. Cheng and A.H. Tan
Study on the Cutting Force, Temperature and Residual Stress in Milling the New Rotor Steel
M. Chen, B. Zou, S.Q. Zhang, B. Rong and G. Liu
Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)
H.C. Hsu, S.W. Ju, J.R. Lu and Y.M. Wan
The Research of Modulation Period on Photoelectric Properties of Ti/TiN Multilayer Films
M. Hu and Y. Liu
Study on Deformation and Damage of Single Crystal MgO by Micro-Scratch
Z.G. Dong and C.W. Kang
Micro Abrasive Jet Machining of Silicon Carbide (SiC) Fiber Reinforced Ceramic Matrix Composite
K.J. Chou, H. Usami and K. Enomoto
Thermal Transport in the Copper Powders with Nanometer and Micrometer Particles
C.Y. Ho, Y.H. Tsai and F.M. Sui
A Study of Mechanical Properties of Human Femoral Heads Using Nanoindentation
C.L. Lin, H. Huang, B.W. Cribb and A. Russell
Session T1: Tribology in Manufacturing Wear Rate Predication for Steel Based on Regression Analysis
Y.T. Yan, Z.L. Sun and T. Zhu
Plastic Flow and Related Wear Mechanisms of CVD TiC Coatings
H.H. Chien, K.J. Ma, Y.P. Yeh, S.P. Vattikuti, C.H. Kuo and C.L. Chao
Experimental Research on Wear Random Process
Z.L. Sun, Y.F. Zhang and Y.T. Yan
Experimental Study on Friction Characteristics of Hot-Pressing Matrix and Granite under Dry Sliding Conditions
L.C. Duan, S.L. Xu, H. Shi and J.P. Li
Analysis of Surface Roughness Transformation of Oxide Scale during Hot Steel Manufacturing
Z.Y. Jiang, J.N. Tang, A.K. Tieu, W.H. Sun and D.B. Wei
Session T2: Truing, Dressing and ELID
Dressing of Monolayer Brazed Diamond Wheel for Grinding Li-Ti Ferrite
H.H. Su, Y.C. Fu, J.H. Xu, W.F. Ding and H.J. Xu
Generation Process of Cutting-Edge Distribution on Grinding Wheel with Single-Point Diamond Dressing
H. Sakamoto and S. Shimizu
Nozzle-Type ELID Grinding Characteristics of Cemented Carbides
S.H. Yin, K. Tang, H. Ohmori, X.L. Zeng, F.J. Chen and Y. Wang
The CMP by Polishing with GiP Dressed by BODD
J.C. Sung, M.Y. Tsai, C.S. Chou, P.L. Tso and Y.T. Chen
Surface Roughness and Morphology of Titanium Plate Ground with Fixed and Loose Brown Alumina Abrasives
Q.L. Han and W.M. Zhang
Study on Plane Magnetic Abrasive Finishing Process - Experimental and Theoretical Analysis on Polishing Trajectory -
Y.H. Zou, A.Y. Jiao and T. Aizawa
Investigation of Semi-Fixed Abrasive Plate Wear Characteristics
P. Zhao, Q.F. Deng, B.H. Lv, W. Hang, Z.W. Wang and J.L. Yuan
Keyword Index
Author Index
Product Samples
A sample for this product is available. Please Login/Register to download this sample.
Customers who bought this item also bought
All rights reserved. © Copyright 2013 Research and Markets WWW6
Terms and Conditions Privacy Policy Publishers Employment Opportunities Site Map Link to us Webmaster Affiliate Network
