3D Chips (3D IC) - Global Strategic Business Report

Global Industry Analysts, Inc, October 2010, Pages: 300

This report analyzes the Global market for 3D Chips (3D IC) in US$ Million. Annual estimates and forecasts are provided for the period 2006 through 2015. The report profiles 38 companies including many key and niche players such as Amkor Technology, GlobalFoundries, Inc., Hynix Semiconductor, Inc., International Business Machines Corporation, Intel Corporation, Micron Technology, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Sony Corporation, Tezzaron Semiconductor Corporation, Toshiba Semiconductors, and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

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3D CHIPS (3D IC)

A GLOBAL MARKET REPORT

CONTENTS

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations I-1
Disclaimers I-2
Data Interpretation & Reporting Level I-3
Quantitative Techniques & Analytics I-3
Product Definitions and Scope of Study I-3

II. Executive Summary

1. MARKET OUTLOOK II-1
Semiconductor Industry: An Overview II-1
Chip-Making Industry Reels Under the Economic Pressure II-1
3D Chips: Market & Technology Overview II-2
A Quick Primer II-2
Transition from 2D Configuration to 3D IC II-3
Appeal of 3D Chip Soars Among End-Use Sectors II-3
Rationale Behind the Growing Popularity of 3D IC II-3
TSV Technology - Ensuring Success of 3D-IC Integration II-4
3D TSV: Technological Trends and Issues II-4
Market Adoption of 3D IC Technology: Challenges II-5

2. PRODUCT OVERVIEW II-6
Semiconductor II-6
Discrete Devices II-6
Integrated Circuits (ICs) II-6
Analog ICs II-6
Digital ICs II-7
3D IC (Three-Dimensional Integrated Circuit) - An Introduction II-7
3D Packaging Vs 3D Ics II-7
Benefits of 3D IC II-8
Manufacturing Technologies for 3D IC II-8
Technological Challenges II-9
Manufacturing Costs II-9
Yield II-9
Heat II-9
Complexity of Design II-9
Lack of Clearly Defined Standards II-9
Lack of Relevance Post Insertion II-9
Supply Delay II-9

3. PRODUCT INTRODUCTIONS/LAUNCHES II-10
TierLogic Announces the Launch of 3D FPGA II-10
Movidius Rolls Out 3D Chip for Smartphones II-10
STMicroelectronics Unveils 3D IC Chip for Digital TV Applications II-10
Applied Materials Launches Avila™ Technology II-10
STMicroelectronics Launches 3D IC for Enhanced Audio in
Portable Media Players II-11
BeSang Unleashes 3D IC Technology to Enable Low Cost Solutions II-11
Sound Design Technologies Rolls Out New 3D Chip Stacking
Technology II-11
Toshiba to Develop 3D NAND Flash Chip II-11
NEC Develops New 3D Chip Stacked Flexible Memory for SoC II-12
IMEC Introduces 3D SIC Technology II-12
Aviza Technology Launches Versalis fxP II-12

4. RECENT INDUSTRY ACTIVITY II-14
CEA-Leti, SPTS Ally Over Next-Gen TSV Development II-14
EVG, IME Collaborate for 3D-IC Integration Technologies II-14
CMC, CMP, MOSIS Ally for 3D-IC Process II-14
Elpida Collaborate with PTI, UMC for 3D-IC Integration
Development II-14
Leti, R3Logic Partner for 3D-IC Methodologies and Designs II-15
NEC Electronics Merges with Renesas Technology II-15
Advanced Technology Investment Company Acquires Chartered
Semiconductor Manufacturing II-15
ON Semiconductor Acquires Sound Design Technologies II-15
SPP Acquires Key Assets of Aviza Technology II-16
IBM Partners with ETH and EPFL to Co-Develop Eco-Friendly 3D
Microchips II-16
S.E.T and IMEC Collaborate to Develop Processes for 3D
Integration II-17
Industrial Technology Research Institute Collaborates with
Applied Materials II-17
EV Group and Applied Materials Collaborate to Develop Wafer
Bonding Process for 3D IC II-18
Soitec Collaborates with CEA-Leti for 3D Integration II-18
Apple Acquires Stake in Imagination Technologies II-18
Applied Materials Acquires Semitool II-19
KLA- Tencor Acquires Stake in ICOS Vision Systems II-19
Zoran Corporation Takes Over Let It Wave II-19
SanDisk Enters into Collaboration with Toshiba for Rewriteable
3D Chip Development II-19
BeSang Collaborates with National NanoFab Centre and Stanford
NanoFab to Develop 3D IC II-20
Singapore forms Novel Consortium to Boost 3D Adoption II-20
DDD and Samsung Collaborate for Development of 3D Chips II-21

5. FOCUS ON SELECT PLAYERS II-22
Amkor Technology (US) II-22
GlobalFoundries, Inc. (US) II-22
Hynix Semiconductor, Inc. (South Korea) II-22
International Business Machines Corporation (US) II-23
Intel Corporation (US) II-23
Micron Technology, Inc. (US) II-23
Renesas Electronics Corporation (Japan) II-24
Samsung Electronics Co., Ltd. (South Korea) II-24
Sony Corporation (Japan) II-24
Tezzaron Semiconductor Corporation (US) II-25
Toshiba Semiconductors (Japan) II-25
Ziptronix, Inc. (US) II-25

6. GLOBAL MARKET PERSPECTIVE II-26
Table 1: World Recent Past, Current & Future Analysis for 3D
Chips (3D IC) Analyzed with Annual Sales Figures in US$
Million for Years 2006 through 2015 (includes corresponding
Graph/Chart) II-26

III. COMPETITIVE LANDSCAPE

Total Companies Profiled: 38 (including Divisions/Subsidiaries - 40)

---------
Region/Country Players
---------
The United States 16
Canada 1
Japan 6
Europe 9
France 3
The United Kingdom 1
Rest of Europe 5
Asia-Pacific (Excluding Japan) 8
---------

Owing to the technological advances and myriad requirements of end-use markets, the semiconductor industry is currently witnessing a major shift from 2D packaging to 3D stacking, which uses surface bump bonding with vias or wires for connections. With tiny footprint, low power consumption, exceptional speed, circuit security and several other advantages, 3D chips provide the paradigm for developing a broader set of electronic products and systems. The Semiconductor industry witnessed a phenomenal transition with the introduction of Ball Grid Array (BGA), Flip Chip (FC), and Chip-Scale Packages (CSP), while packaging industry gained significance since 2000. Through-silicon via (TSV) packaging or three-dimensional integrated circuit (3D IC) technology is expected to significantly enhance the transistor density and cubic density, instead of only the plane density of chips. Significant dynamics in CMOS image sensor, MEMS, analog, logic and memory industries continued and are expected to drive high-volume adoption of 3D TSVs in the subsequent decade. Moreover, novel applications, including HB-LED silicon modules, Power and Solar components are also expected to gain from the 3D TSV market trend and the interconnect technology.

As stated by the new market research report on 3D Chips (3D IC), the market penetration of 3D IC integration technology in various applications is dependent on the cost associated with specific process, requirement of interconnect density and limitations on form factor. 3D technologies are gradually evolving to handle the issues related to chip signaling, memory latency and restricted communications capacity. Stacking of chipsets and processor is expected to manage performance lapses caused by interconnect delays. Currently, 3D IC is emerging as an efficient solution in cell phone cameras and memory chip stacks.

The 3D TSV interconnects, in addition to 3D packaging offer immense opportunities for 3D integration with significantly lower investments. 3D IC integration systems are classified on the basis of the level of interconnectivity at the bond pad, package and transistor level. While conventional processes of interconnectivity, such as flip chip and wire bond, are being used in the production of packaging levels, the modern 3D integration aims to incorporate TSV technology as the key method for interconnecting. Decreased form factor, cost reduction and enhanced performance are the major drivers for the increased adoption of TSV-based 3D ICs.

However several issues limit the adoption of the TSV-based 3D ICs in the market. Major issues include supply chain factors, test solutions, thermal management factors, and lack of design devices and tools. Information sharing and communication across the supply chain, including designing, testing and production, are the pre-requisites for the adoption of this technology in the market.

Major players profiled in the report include Amkor Technology, GlobalFoundries Inc., Hynix Semiconductor Inc., International Business Machines Corporation, Intel Corporation, Micron Technology Inc., Renesas Electronics Corporation, Samsung Electronics Co. Ltd., Sony Corporation, Tezzaron Semiconductor Corporation, Toshiba Semiconductors, Ziptronix Inc.

© Global Industry Analysts, Inc

- Amkor Technology
- GlobalFoundries Inc.
- Hynix Semiconductor Inc.
- International Business Machines Corporation
- Intel Corporation
- Micron Technology Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co. Ltd.
- Sony Corporation
- Tezzaron Semiconductor Corporation
- Toshiba Semiconductors
- Ziptronix Inc.

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