|
|
 |
|
Viewing report
|
|
|
|
Advanced Interconnect Metals for 65-22nm Devices
Techcet, Aug 2007, Pages: 48
Look into the future of IC interconnects.
This report “Interconnect Materials Beyond 65nm” includes technology trends and options, process materials evolution from 65nm to 22nm, detailed process flows and materials forecasts.
This is part of the “The Critical Materials Reports” range. These reports are focused on material areas deemed critical to semiconductor processes, as determined by many of the largest semiconductor fabricators in the world.
Product samples
A sample for this product is available. Please Login/Register to download this sample.
Customers who bought this item also bought
High k and ALD/CVD Metal Precursors
Introduction to Microfabrication, 2nd Edition
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics — 2004: Volume 812. MRS Proceedings
Advanced Metallization Conference 1999 (AMC 1999): Volume 15. MRS Conference Proceedings
Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2011: Volume 1335. MRS Proceedings
High Performance Ceramic Coatings - Global Strategic Business Report
2010 Deep Research Report on China Saw Wire Industry
Gases for Semiconductor Device Processing
Global and Chinese Copper Alloy Bar and Wire Industry Report, 2010-2012
Global and Chinese Copper Alloy Bar and Wire Industry Report, 2010-2012
|
|
|
|
