|
|
 |
|
Viewing report
|
|
|
|
Invensense ITG-3200 MEMS gyro 3-axes Reverse Costing
System Plus Consulting, May 2010, Pages: 100
Reverse costing report of the MEMS Gyroscope ITG-3200, the first 3-axis (Pitch-Roll-Yaw) gyro developed by InvenSense
- Physical Analysis of the Device
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price
The ITG-3200 is the first 3-axis (Pitch-Roll-Yaw) gyro developed by InvenSense. It uses a very thin 4x4x0.9mm QFN package. The components are manufactured on 200mm wafers using a three-bonded-wafer process: a thin sensor wafer and a protective cap wafer both processed by DeepRIE, and an ASIC wafer for signal conditioning. The ITG-32003-Axis gyroscopes are suitable for various motion processing solutions for consumer products.
This report provides complete teardown of the MEMS Gyroscope with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost-breakdown
- Selling price estimation
|
|
|
|
