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Viewing report
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Infineon EWLP Package Reverse Costing
System Plus Consulting, Feb 2010, Pages: 53
The First Reverse Analysis Report of a Fan-out Wafer Level Package!
Reverse costing report of the enhanced Wafer Level BGA (eWLB) package used in the X-GOLD™ 213 circuit from Infineon, the first fan-out wafer level package in production.
eWLB is a Ball Grid Array package based on the emerging Fan-Out Wafer Level Package (FO-WLP) concept. All the packaging operations are done at the wafer level, and a fan-out area is provided, which extends the package size beyond the IC surface area to allow for higher ball counts. The ball pitch is 0.5mm and only one redistribution layer is used for this 217 balls 8x8mm package.
The eWLB is manufactured on 200mm wafers by Infineon who licensed the technology to ASE and STATS Chip PAC.
This report provides for a complete teardown of the XGOLD213™ eWLB package including:
- Detailed photos
- Material analysis
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost-breakdown
- Selling price estimation
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