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Invensense IDG 600/650 MEMS gyro 2-axes Reverse Costing Product Image

Invensense IDG 600/650 MEMS gyro 2-axes Reverse Costing

  • Published: February 2010
  • 103 pages
  • System Plus Consulting

Reverse costing & engineering process analysis of the Dual-Axis MEMS Gyroscope IDG-600/650 supplied by InvenSense and integrated in Wii motion accessory

- Physical Analysis of the Device
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price

TheIDG-600, integrated in the Nintendo Wii Motion Plus accessory , and its standard variation the IDG-650 share the same hardware. The components are manufactured using a three-bonded-wafer processs : a thin sensor wafer and a protective cap wafer processed with bulk micro machining and an ASIC wafer for signal conditioning.

The IDG-600/650 gyroscopes are suitable for high performance emotion sensing game controllers, pointing devices, multimedia remote sand computer mice applications.

This report provides complete teardown of the MEMS Gyroscope with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Glossary

Overview/Introduction
- Executive Summary
- Reverse Costing Methodology

InvenSense Company Profile
- Product Range
- Business Model

Physical analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package Opening & Bonding Number
- IDG-600 / IDG-650 Comparison
- Device Structure
- Device Dimensions
- ASIC Markings
- ASIC Minimal Dimension and Metal Layers
- ASIC Main Blocks
- ASIC Process Characteristics
- MEMS Markings
- MEMS Sensor IR View
- MEMS Sensor Details
- Component Cross-Section
- MEMS process characteristics

Manufacturing Process Flow
-Overview
- ASIC Process Flow (CMOS + Cavity Etch)
- MEMS Process Flow (Cap + Sensor + Assembly)Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Supply Chain Analysis
- Manufacturers financial ratios
- Yields Explanation
- ASIC Front-End Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- Total Front-End Cost (ASIC + MEMS + Assembly)
- Back-End 0 : Probe Test and Dicing
- Total Wafer Cost (Front-End + Back-End 0)
- Die cost
- Packaging Cost
- Final Test Cost
- Component Manufacturing Cost
- Yield Synthesis

Estimated Manufacturer Price Analysis

Conclusion

Format Properties
Electronic (PDF) The report will be emailed to you. The report is sent in PDF format. This is a single user license, allowing one specific user access to the product.
Enterprisewide The report will be emailed to you. The report is sent in PDF format. This is an enterprise license, allowing all employees within your organisation access to the product.
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