Invensense IDG 600/650 MEMS gyro 2-axes Reverse Costing

System Plus Consulting, February 2010, Pages: 103

Reverse costing & engineering process analysis of the Dual-Axis MEMS Gyroscope IDG-600/650 supplied by InvenSense and integrated in Wii motion accessory

- Physical Analysis of the Device
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price

TheIDG-600, integrated in the Nintendo Wii Motion Plus accessory , and its standard variation the IDG-650 share the same hardware. The components are manufactured using a three-bonded-wafer processs : a thin sensor wafer and a protective cap wafer processed with bulk micro machining and an ASIC wafer for signal conditioning.

The IDG-600/650 gyroscopes are suitable for high performance emotion sensing game controllers, pointing devices, multimedia remote sand computer mice applications.

This report provides complete teardown of the MEMS Gyroscope with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Glossary

Overview/Introduction
- Executive Summary
- Reverse Costing Methodology

InvenSense Company Profile
- Product Range
- Business Model

Physical analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package Opening & Bonding Number
- IDG-600 / IDG-650 Comparison
- Device Structure
- Device Dimensions
- ASIC Markings
- ASIC Minimal Dimension and Metal Layers
- ASIC Main Blocks
- ASIC Process Characteristics
- MEMS Markings
- MEMS Sensor IR View
- MEMS Sensor Details
- Component Cross-Section
- MEMS process characteristics

Manufacturing Process Flow
-Overview
- ASIC Process Flow (CMOS + Cavity Etch)
- MEMS Process Flow (Cap + Sensor + Assembly)Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Supply Chain Analysis
- Manufacturers financial ratios
- Yields Explanation
- ASIC Front-End Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- Total Front-End Cost (ASIC + MEMS + Assembly)
- Back-End 0 : Probe Test and Dicing
- Total Wafer Cost (Front-End + Back-End 0)
- Die cost
- Packaging Cost
- Final Test Cost
- Component Manufacturing Cost
- Yield Synthesis

Estimated Manufacturer Price Analysis

Conclusion

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