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Components, Packaging and Manufacturing Technology
Trans Tech Publications Inc, March 2011, Pages: 870
Series: Key Engineering Materials, Volumes 460 - 461
Selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
This work thus constitutes a handy guide to current thinking in the field.
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