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The Worldwide Motherboard Application IC Market, 1Q 2011
Market Intelligence & Consulting Institute (MIC) [a division of Institute for Information Industry (III)], March 2011, Pages: 13
This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. The report finds that worldwide motherboard shipment volume dropped both sequentially and year-on-year in the fourth quarter of 2010. However, the shipment volume is expected to see significant growth in the first quarter of 2011. It is observed that LGA775 remained the dominant CPU connector type in the fourth quarter of 2010, followed by socket 1156 and socket AM3. Meanwhile, although the Intel G/Q 4 Series continued to be the most popular chipset type in the fourth quarter, shipment share of the Intel H/Q 5 Series has picked up and narrowed the gap with that of the Intel G/Q 4 Series.
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