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ASICs, ASSPs & PLDs/FPGAs — 2011 Edition
Description:
ASICs, ASSPs & PLDs/FPGAs - Report Overview
Key features of the study include:
- Coverage of the market for Classic ASICs, MPU Core-based ASICs, Classic ASSPs, MPU Core-based ASSPs and PLDs/FPGAs.
- Analysis of 24 application areas, providing detailed coverage of each end-use sector.
- Unit, revenue and average pricing (ASP) analysis for each product type, in each application area.
- Supplier market share estimates (in revenues) in 2010.
- Highly quantitative analysis, with discussion summarized in short, easy to read bullet points.
- PDF and Excel delivery options available.
- Analyst support time to answer all reasonable questions relating to forecasts and conclusions.
Application Analysis
The study provides analysis of the market for ASICs, ASSPs & PLDs/FPGAs in the following applications:
- Automotive Under-the-Hood Electronics
- Automotive OE Entertainment Systems
- Automotive Aftermarket
- Cellphones
- Enterprise Customer Premises Equipment
- Wired Communications Infrastructure
- Wireless Communications Infrastructure
- Compute Platforms
- HDDs & Storage Systems
- Office Equipment & Computer Peripherals
- Wired Games Consoles
- Handheld Games Consoles
- eBook Readers/Media Tablets/Netbooks
- Media Players/MP3 Players
- Cameras & Camcorders
- Digital TVs & Set-top Boxes
- DVD Recorders & Players
- Residential Customer Premises Equipment
- Other Consumer Electronics
- Automation & Drives
- Medical Electronics
- Chips Cards & Payment Processing
- Other Industrial Electronics
- Military/Aerospace
For each application, the study provides analysis of units, revenues and average pricing (ASP) for each of the following product types. Base year for analysis is 2010, with forecasts to 2016.
- Classic ASICs
- MPU Core-based ASICs
- Classic ASSPs
- MPU Core-based ASSPs
- PLDs/FPGAs
Key features of the study include:
- Coverage of the market for Classic ASICs, MPU Core-based ASICs, Classic ASSPs, MPU Core-based ASSPs and PLDs/FPGAs.
- Analysis of 24 application areas, providing detailed coverage of each end-use sector.
- Unit, revenue and average pricing (ASP) analysis for each product type, in each application area.
- Supplier market share estimates (in revenues) in 2010.
- Highly quantitative analysis, with discussion summarized in short, easy to read bullet points.
- PDF and Excel delivery options available.
- Analyst support time to answer all reasonable questions relating to forecasts and conclusions.
Application Analysis
The study provides analysis of the market for ASICs, ASSPs & PLDs/FPGAs in the following applications:
- Automotive Under-the-Hood Electronics
- Automotive OE Entertainment Systems
- Automotive Aftermarket
- Cellphones
- Enterprise Customer Premises Equipment
- Wired Communications Infrastructure
- Wireless Communications Infrastructure
- Compute Platforms
- HDDs & Storage Systems
- Office Equipment & Computer Peripherals
- Wired Games Consoles
- Handheld Games Consoles
- eBook Readers/Media Tablets/Netbooks
- Media Players/MP3 Players
- Cameras & Camcorders
- Digital TVs & Set-top Boxes
- DVD Recorders & Players
- Residential Customer Premises Equipment
- Other Consumer Electronics
- Automation & Drives
- Medical Electronics
- Chips Cards & Payment Processing
- Other Industrial Electronics
- Military/Aerospace
For each application, the study provides analysis of units, revenues and average pricing (ASP) for each of the following product types. Base year for analysis is 2010, with forecasts to 2016.
- Classic ASICs
- MPU Core-based ASICs
- Classic ASSPs
- MPU Core-based ASSPs
- PLDs/FPGAs
Contents:
Section 1 – Executive Overview Key Point Conclusions
Section 2 – Scope & Method
2.1 Scope
2.2 Research Method
2.3 Embedded Processing Service
Section 3 – Application Analysis
3.1 Automotive Under-the-hood Electronics
3.2 Automotive OE Entertainment Systems
3.3 Automotive Aftermarket
3.4 Cellphones
3.5 Enterprise Customer Premises Equipment
3.6 Wired Communications Infrastructure
3.7 Wireless Communications Infrastructure
3.8 Compute Platforms
3.9 HDDs & Storage Systems
3.10 Office Equipment & Computer Peripherals
3.11 Wired Games Consoles
3.12 Handheld Games Consoles
3.13 eBook Readers/Media Tablets/ Netbooks
3.14 Media Players/MP3 Players
3.15 Cameras & Camcorders
3.16 Digital TVs & Set-top Boxes
3.17 DVD Recorders & Players
3.18 Residential Customer Premises Equipment
3.19 Other Consumer Electronics
3.20 Automation & Drives
3.21 Medical Electronics
3.22 Chips Cards & Payment Processing
3.23 Other Industrial Electronics
3.24 Military/Aerospace
Section 4 – Product Analysis
Section 5 – 2010 Supplier Market Shares Appendix I — Embedded Processing Supplier Activity Summary
List of Tables (51 tables)
Section 2 – Scope & Method
2.1 Scope
2.2 Research Method
2.3 Embedded Processing Service
Section 3 – Application Analysis
3.1 Automotive Under-the-hood Electronics
3.2 Automotive OE Entertainment Systems
3.3 Automotive Aftermarket
3.4 Cellphones
3.5 Enterprise Customer Premises Equipment
3.6 Wired Communications Infrastructure
3.7 Wireless Communications Infrastructure
3.8 Compute Platforms
3.9 HDDs & Storage Systems
3.10 Office Equipment & Computer Peripherals
3.11 Wired Games Consoles
3.12 Handheld Games Consoles
3.13 eBook Readers/Media Tablets/ Netbooks
3.14 Media Players/MP3 Players
3.15 Cameras & Camcorders
3.16 Digital TVs & Set-top Boxes
3.17 DVD Recorders & Players
3.18 Residential Customer Premises Equipment
3.19 Other Consumer Electronics
3.20 Automation & Drives
3.21 Medical Electronics
3.22 Chips Cards & Payment Processing
3.23 Other Industrial Electronics
3.24 Military/Aerospace
Section 4 – Product Analysis
Section 5 – 2010 Supplier Market Shares Appendix I — Embedded Processing Supplier Activity Summary
List of Tables (51 tables)
Companies Mentioned
Colin Barnden - Principal Analyst
Colin joined Semicast Research in June 2006 and is principal analyst for semiconductor research and vice president of business development. Prior to joining Semicast, he worked for 12 years at IMS Research, rising to the position of Senior Research Director of its Semiconductor Research Group and responsible for analyst coverage on the analog/mixed signal, optoelectronic and embedded processing industries. Colin also set-up and established IMS Research's Automotive Electronics Group. During his tenure, Colin authored dozens of reports and became a well respected industry analyst. He holds a B.S. in Electronic Engineering from Aston University, England.
Colin joined Semicast Research in June 2006 and is principal analyst for semiconductor research and vice president of business development. Prior to joining Semicast, he worked for 12 years at IMS Research, rising to the position of Senior Research Director of its Semiconductor Research Group and responsible for analyst coverage on the analog/mixed signal, optoelectronic and embedded processing industries. Colin also set-up and established IMS Research's Automotive Electronics Group. During his tenure, Colin authored dozens of reports and became a well respected industry analyst. He holds a B.S. in Electronic Engineering from Aston University, England.
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