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Flip-Chip: Technologies, Applications, Market
Yole Development, April 2011, Pages: 307
Understanding the new requirements and technologies that will reshape the supply chain of the world’s highest value package platform
MARKET AND TECHNOLOGY TRENDS
Flip-Chip Packages accounted for 13% of all integrated circuit (IC) packages by the end of 2010, but this was worth over 29% of the global IC assembly, packaging and test market value!
Throughout this first ever Yole Développement report on flip-chip technologies and markets, you will find out how this market emerged almost from scratch 15 years ago and turned into a $16 billion market. Even though it is a large market by the figures and looks mature at first sight, we think that the Flip Chip market is still in its growth phase, with major technology, application and supply chain transformations looming ahead.
Renewed interest in flip-chip technologies is motivated in many application areas concurrently by such factors as the rising cost of gold used for wire bonding, the need for low thickness devices, continued CMOS downscaling, higher currents and temperatures, and lower voltages.
Today, many sophisticated devices can no longer be packaged with wire bonding technology and the mobile applications are increasingly requiring footprint and weight reduction coupled with higher electrical performance (signal propagation and power distribution). The emergence of the 28nm CMOS technology node in particular, poses new quality and reliability constraints on interconnect technologies so as to cope with the increasing fragility of the back end of line, which may disqualify wire bonding. Not to mention the ever increasing IO density, making it necessary to develop new bumping and substrate technologies. It is not any longer only about higher performance and lower cost reliable interconnects or assembly and packaging technologies. If remained unresolved, the above constraints will prove to be bottlenecks if not obstacles to the continuation of Moore’s law.
A SEGMENTED MARKET WITH DIVERSE “REALITIES”
Summarizing the flip-chip market and its dynamics with just a few words and figures can be misleading, as there is a wide diversity of flip-chip technologies and applications, with different drivers, levels of maturity and sometimes alternative technologies. To some, flip-chip applies to large digital system-on-chip devices like microprocessors, graphical processor units or chipsets for personal computers and gaming stations. Yet, flip-chip applies to a number of different applications addressing different packaging forms. Flip-chip applies not only to packages but also to interconnection of bare integrated circuits, like the display drivers found around all LCD screens worldwide; and flip-chip packages can address devices with die sizes ranging from less than 1mm² up to the maximum die sizes (around 650mm²).
The flip-chip market is undergoing major technology and supply chain transformations which this report describes along with their impacts on the semiconductor industry for the coming 5 years.
- Why are copper pillars becoming so popular?
- How will this affect the business?
- Who is investing in these technologies?
- How is the supply chain changing and how are new technologies reshaping the value chain?
- Will CMOS foundries seize a significant stake in this business at the expense of assembly dedicated companies in the years to come?
- How will the high value of substrates in the overall flip-chip cost of ownership be challenged?
- And what will substrate manufacturers propose to maintain it?
These are some of the questions we addressed through our 360-degree analysis of the World’s highest value semiconductor packaging technology.
FOCUS OF THE REPORT
Throughout this report, you will find everything you should know about flip-chip:
- an exhaustive presentation of the flip-chip markets,
- the applications served and their key drivers,
- the technologies used from substrates to underfills to wafer bumping to assembly,
- the analysis of the supply chain,
- a cost analysis section,
- an analysis of the market and its value chain
- and, of course, the complete set of market forecasts from 2010 to 2016 in billion units and in million wafers by application, by player type, by technology, by wafer size,…
The list and ranking of the main substrate, underfill and wafer bumping players is also detailed as of the end of 2010, including the detailed respective production capacities for wafer bumping.
Key features of the report:
- 2010 market status of wafer bumping for flip-chip, flip-chip package substrates, flip-chip underfills with breakdown of market data by player, player profile, region, …
- Supply chain analysis and ranking of the wafer bumping, flip-chip substrate and underfills players
- 2010 market status and 2011-2016 forecasts with breakdown by application area, IC type, bumping metallurgy in wafer counts and package units
- Detailed account of all the application fields of Flip-Chip
- Drivers and expected benefits by application
- Technology overview of bumping, underfilling, and substrates for flip-chip
- Complete account of copper pillar bumping status and developments
- Cost analysis of several industrial cases and cost modeling
WHO SHOULD BUY THIS REPORT
- Integrated semiconductor device manufacturers and fabless semiconductor companies
- - Visualize the drivers and expected benefits by application of flip-chip as well as the alternative options
- - Benchmark the industry status of flip-chip
- - Identify possible partnership /or second source packaging subcontractors for your forthcoming developments
- Assembly and test service companies
- - Benchmark the industry status of flip-chip. Evaluate your market and technology position
- - Screen possible new applications and technologies to support diversification strategy with flip-chip technologies
- - Silicon wafer foundries
- - Screen possible new applications and technologies to support diversification strategy with wafer bumping
- Equipment and material suppliers
- - Understand the differentiated value of your products and technologies in this large and fast growing market
- - Identify new business opportunities and prospects
- Electronic module makers and Original Equipment Makers
- - Evaluate the benefits of using flip-chip devices in your end system
- - Monitor different suppliers to adjust your sourcing strategy
- PCB and IC substrate manufacturers
- - Monitor the evolution of IC packaging, assembly and test, especially linked to the emerging 3D silicon/glass interposers and other 3D silicon technologies. Evaluate opportunities and threats for the flip-chip substrate market.
- - Screen possible new applications and technologies to support diversification strategy with flip-chip substrates
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