- Language: English
- 115 Pages
- Published: March 2009
- Region: Global
Encapsulation and Flexible Substrates for Organic and Dye-Sensitized Photovoltaics
- Published: December 2010
- Region: Global
- 62 Pages
Organic Photovoltaics (OPV) is among the most air and moisture-sensitive applications in PV. For dye-sensitized cell (DSC) photovoltaics, another factor comes into play: the use of liquid electrolytes that can leak, rendering cells ineffective. These technical issues are key culprits that have kept these interesting PV technologies from gaining market share. But as the OPV and DSC communities struggle to commercialize their technologies they are increasingly realizing that to make money, they are going to have to spend money on encapsulation.
As a result, NanoMarkets believes that there are growing opportunities for providers of encapsulation materials and systems to sell into the OPV/DSC segment. These opportunities are enhanced by the fact that encapsulation is an especially important, but tricky issue on flexible substrates and flexibility is a key part of the OPV/DSC value proposition.
But the OPV/DSC encapsulation business extends well beyond the flexible substrate niche. There are expanding opportunities for rigid - i.e., glass - substrates too. OPV cells, in particular, still have lifetimes of only 10 - 20 years even when encapsulated in glass; that is, even glass is not a robust enough encapsulant for OPV. This means even more opportunities for the encapsulant business.
This NanoMarkets report provides our analysis of the market for encapsulation and substrate materials for OPV and DSC, including a detailed eight-year forecast of the revenue opportunities that these materials present in these markets. We believe that this report will be essential reading for chemical, glass, polymer, and thin-film ceramic manufacturers as well as OPV and DSC manufacturers and those seeking to enable the unique devices and applications that those PV technologies can provide.
SHOW LESS READ MORE >
E.1 How New Encapsulation Technology Will Enable Growth in the OPV and DSC Businesses
E.1.1 Opportunities for Encapsulation Materials and Systems Suppliers
E.1.2 Overview of Key Encapsulation Firms
E.2 How Substrate Suppliers Will Benefit from OPV's and DSC's Unique Features
E.2.1 Opportunities for Substrate Suppliers: Glass Metal and Plastic
E.2.2 Overview of Key Substrate Firms
E.3 Substrate/Encapsulation Strategies of Leading OPV and DSC Firms
E.4 Summary of Eight-Year Forecasts of Encapsulant and Substrate Materials for OPV and DSC
Chapter One: Introduction
1.1 Background to this Report
1.1.1 Encapsulation Opportunities for OPV and DSC
1.1.2 Substrate Opportunities for OPV and DSC
1.1.3 OPV, DSC, BIPV and Substrates
1.2 Objectives and Scope of this Report
1.3 Methodology of this Report
1.4 Plan of this Report
Chapter Two: Encapsulation and Substrates for OPV and DSC
2.1 Current Substrate/Encapsulation Environment
2.1.1 What Can Be Learned from OLEDs and Inorganic TFPV?
2.1.2 Limits to Current Approaches
2.2 Substrate Requirements for OPV and DSC
2.2.1 Glass: Rigid, Inflexible, and Not Quite Impermeable
2.2.2 Metal Substrates: Not Just the Middle of the Road
2.2.3 Polymer Films: Can the Cheap Ones Work?
2.2.4 Flexible Glass and Paper Options
2.3 Encapsulation Requirements for OPV and DSC
2.3.1 How Much is Enough: Encapsulation Performance and the Cost Barrier
2.3.2 The Dyad Option: Can Cost be Made Reasonable?
2.4 Key Points Made in this Chapter
Chapter Three: Opportunities for Encapsulation and Substrate Materials in OPV and DSC
3.1 Unique Niches and OPV and DSC: Impact on Encapsulation and Substrates
3.1.1 Avoiding Competition with Other PV: Encapsulation Helps, But Just a Bit
3.1.2 OPV/DSC Markets Evolving
3.1.3 Portability and Flexibility in OPV/DSC: Opportunities for Encapsulation?
3.1.4 The Rise of Ultra-Cheap PV, Low-Cost Manufacturing and What this Means for Substrates and Encapsulation
3.2 Encapsulation and Substrates for BIPV with OPV and DSC: Is This the True High-Volume, High-Value Market?
3.2.1 The Need for Enhanced Encapsulation in OPV/DSC-based BIPV
3.2.2 Challenges for Encapsulation in the OPV/DSC-based BIPV Market
3.3 Substrate Markets for OPV and DSC
3.3.1 Glass Substrates for OPV and DSC: Required in Some Cases
3.3.2 Plastic and Paper Substrates: Maximizing Cheapness?
3.3.3 Metal Substrates: Middling Flexibility or High Strength?
3.4 Encapsulation Markets for OPV and DSC
3.4.1 Can Skimping on Encapsulation Pay off for Portable Chargers
3.4.2 When Glass is Not Enough: Where Additional Films are Needed
3.4.3 Where Dyads and Other Advanced Encapsulation Solutions are Needed
3.4 Key Points Made in this Chapter
Chapter Four: Eight-Year Forecasts of Encapsulation and Substrate Markets for OPV and DSC
4.1 Forecasting Methodology
4.1.1 Economic and Policy Issues
4.1.2 Data Sources
4.1.3 Scope of Forecast
4.1.4 Alternative Scenarios and Other Factors Taken Into Consideration
4.2 Forecasts of Substrate Markets: By Technology and Type of Substrate
4.2.1 Forecasts of Substrates for OPV
4.2.2 Forecasts of Substrates for DSC
4.3 Forecasts of Encapsulation Markets: By Technology and Type of Application
4.3.1 Forecasts of Encapsulation for OPV
4.3.2 Forecasts of Encapsulation for DSC
4.4 Summary of Forecasts
4.4.1 Summary of Forecasts of Substrate/Encapsulation by Organic-Based PV Technology
4.4.2 Summary of Forecasts of Substrate/Encapsulation Material by Material Type
Acronyms and Abbreviations Used In this Report
About the Author
List of Exhibits
Exhibit E-1: View of Selected Encapsulation Firms
Exhibit E-2: View of Selected Substrate Suppliers
Exhibit E-3: Activities of Selected OPV/DSC Firms
Exhibit E-4: Substrate and Encapsulation Material Revenues by PV Technology
Exhibit 4-1: Substrate Materials for OPV
Exhibit 4-2: Substrate Materials for DSC
Exhibit 4-3: Encapsulation Materials for OPV
Exhibit 4-4: Encapsulation Materials for DSC
Exhibit 4-5: Substrate and Encapsulation Material Revenues by PV Technology
Exhibit 4-6: Substrate and Encapsulation Material Revenues by Material Type