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The Worldwide Motherboard Application IC Market, 2Q 2011

Description:
This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. The report finds that worldwide motherboard shipment volume - which dropped both sequentially and year-on-year in the fourth quarter of 2010 - picked up in the first quarter of 2011. It is observed that LGA775 remained the dominant CPU connector type in the first quarter of 2011, followed by socket 1156 and socket 1155 in spite of the fact that the socket 1155 is expected to replace socket 1156 soon. It is anticipated that worldwide motherboard shipment year-on-year growth momentum will continue well into the second quarter of 2011 and throughout 2011 albeit at a slower growth pace.
 
Contents:
Worldwide Motherboard Shipment Volume, 1Q 2010 - 1Q 2012

Worldwide Motherboard Shipment Volume by CPU Supplier, 1Q 2009 - 1Q 2011

Worldwide Motherboard Shipment Share by CPU Supplier, 1Q 2009 - 1Q 2011

Worldwide Motherboard Shipment Volume by CPU Connector Type, 1Q 2009 - 1Q 2011

Worldwide Motherboard Shipment Share by CPU Connector Type, 1Q 2009 - 1Q 2011

Worldwide Motherboard Shipment Volume by Chipset Supplier, 1Q 2009 - 1Q 2011

Worldwide Motherboard Shipment Share by Chipset Supplier, 1Q 2009 - 1Q 2011

Worldwide Motherboard Shipment Volume by Chipset Type, 1Q 2009 - 1Q 2011

Worldwide Motherboard Shipment Share by Chipset Type, 1Q 2009 - 1Q 2011

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