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Local Distribution of HDTV and Other Bandwidth-demanding Signals: Assessment Technologies and Markets

Description:
This report addresses technologies and markets that support home/office (“local”) distribution of bandwidth-intensive signals. Related applications also require QoS support; and demanding the rate of transmission from several Mb/s and up to several Gb/s; such requirements became typical for current HDV, IPTV and similar signals distribution. These applications are opening the multi-billion market for manufacturers of related ICT devices; they also intend to satisfy the growing users’ demand for home/office interconnects.

Two major types of communications channels in the converged LAN/PAN environment are:

-Wireless, and

-Wired.

Among them, the differentiation has to be made for uncompressed and compressed information transmission.

The report continues the Practel project that addresses bandwidth-hungry applications for signals distribution at home or small office; it updates and adds new information.

This report concentrates on recent technological advances (in the discussed area) as well as on related markets; and, particular, it analyzes the following technologies and markets:

- WPAN/WLAN– UWB, Visible Light Communication (VLC), 60 GHz radio, and IEEE 802.11n; as well as other recently introduced competing technologies;

- Wired PAN/LAN – HomePlug, HPNA-ITU, MOCA, HDBaseT, DiiVA and Display Port.

The report also contains a survey of related industries, vendors and their products.

Research Methodology:

Considerable research was done using the Internet. Information from various Web sites was studied and analyzed. Evaluation of publicly available marketing and technical publications was conducted. Telephone conversations and interviews were held with industry analysts, technical experts and executives. In addition to these interviews and primary research, secondary sources were used to develop a more complete mosaic of the market landscape, including industry and trade publications, conferences and seminars.

The overriding objective throughout the work has been to provide valid and relevant information. This has led to a continual review and update of the information content.

Target Audience:

This report is important to a wide population of researches, technical and sales staff involved in the developing of CE devices and their communications gear. It is recommended for both service providers and vendors that are working with related technologies. The report also helps to understand issues associated with relationship between “local” LAN/PAN communications and other technologies.
 
Contents:
1.0 Introduction
1.1 Requirements
1.1.1 LAN-PAN Convergence
1.2 Types
1.3 Paradigm
1.4 Scope
1.5 Details
1.6 Research Methodology
1.7 Target Audience

2.0 Wireless ICT
2.1 Ultra Wideband (UWB)
2.1.1 Downturn
2.1.2 General: History
2.1.3 Benefits
2.1.4 Definition
2.1.5 Rates
2.1.6 Spectrum Allocation
2.1.7 Regulations
2.1.8 Major Features
2.1.9 Standards
2.1.9.1 Multiband OFDM
2.1.9.2 DS-UWB
2.1.9.3 Groups: History
2.1.9.4 ECMA - ISO
2.1.9.5 WiNET (IP over UWB)
2.1.9.6 EC
2.1.9.7 Japan
2.1.10 Market Estimate
2.1.10.1 General
2.1.10.2 Geographical Segmentation
2.1.10.3 Forecast
2.1.11 UWB and WPAN
2.1.12 Industry
- Alereon (chipsets)
- Camero (radar, equipment for first responders)
- decaWave
- Gefen (Device)
- General Atomics (chipsets)
- Multispectral (Zebra)
- Pulse~ Link (chipsets)
- RealTek (IC)
- Sigma Designs (Chipsets)
- Spectec
- Time Domain (chipsets-fusion of communications & radar)
- Ubisense (RFID-tracking)
- Veebeam
- Wisair (WUSB-chipsets)

2.2 Visible Light Communications
2.2.1 General
2.2.1.1 Free Space Optics and VLC
2.2.2 Details
2.2.2.1 Communications Channel
2.2.2.2 Transmitter
2.2.2.3 Receiver
2.2.2.4 Major Characteristics
2.2.2.4.1 Limiting Factors
2.2.2.5 LED Evolution
2.2.2.5.1 General
2.2.2.5.2 Developments and Market
2.2.2.6 Applications
2.2.2.7 VLC Standards Development
2.2.2.7.1 The IEEE
2.2.2.7.1.1 Considerations
2.2.2.7.1.2 Project
2.2.2.7.1.3 Approval
2.2.2.7.2 Jeita (Japan Electronics and Information Technology Industries Association)
2.2.2.7.3 Visible Light Communications Consortium (VLCC)
2.2.2.7.3.1 General
2.2.2.7.3.2 Experimental Systems- VLCC Projects
2.2.3 Companies and Organizations
- ECMA
- Nakagawa Laboratories
- NEC
- Siemens
- Tamura

2.3 60 GHz Radio and Competition
2.3.1 New Industry
2.3.2 60 GHz Radio
2.3.2.1 General
2.3.2.2 Opportunities
2.3.2.3 Characteristics
2.3.2.4 Specifics
2.3.2.5 Benefits and Challenges
2.3.2.6 Specifics of Applications
2.3.3 mm-Wave Technologies for Bandwidth-intensive Signals Distribution
2.3.3.1 General
2.3.3.2 WirelessHD
2.3.3.2.1 Group
2.3.3.2.2 Goal
2.3.3.2.3 Details: WirelessHD Technology
2.3.3.2.4 Completion: Specification
2.3.3.2.5 Progress and Issues
2.3.3.2.5.1 Progress in ICs Design
2.3.3.2.5.2 Modulation
2.3.3.2.6 Market Estimate
2.3.3.2.7 Industry
- Agilent (Test platform)
- Cables To Go (WiHD Device)
- IBM-MediaTek (Chipsets for 60 GHz – 802.15.3c)
- LG
- Panasonic
- SiBeam (Chipsets)
2.3.3.3 IEEE 802.15.3c-Physical Layer of WiHD
2.3.3.3.1 Current Status and Details
2.3.3.3.2 Comparison
2.3.3.4 WiGig: Wi-Fi Extension
2.3.3.4.1 Wi-Fi and WiGig
2.3.3.4.1.1 Union
2.3.3.5 ECMA
2.3.4 Amimon - WHDI
2.3.4.1 General
2.3.4.2 Principle
2.3.4.3 Industry

2.4 Comparison

2.5 IEEE 802.11n
2.5.1 802.11n Status
2.5.2 Environment
2.5.3 Draft v. 1.0
2.5.4 Draft v. 2.0
2.5.5 Further Developments and IEEE Approval
2.5.6 Wi-Fi Alliance
2.5.7 802.11n Technology
2.5.7.1 Advances
2.5.8 Major Features
2.5.8.1 Specifics
2.5.8.2 Channel Bandwidth
2.5.8.3 Adaptation
2.5.8.4 Security
2.5.9 Benefits and Applications
2.5.9.1 Benefits
2.5.9.2 Applications
2.5.10 Market
2.5.10.1 General: Drivers
2.5.10.2 802.11n and HDVD
2.5.11 Market Forecast
2.5.11.1 Model Assumptions
2.5.11.2 Forecast
2.5.12 Industry
- Aerohive (APs)
- Aruba (AP)
- Atheros (Chipsets, WUSB)
- Axar (HDVD)
- Buffalo (Router, AP)
- Belkin (Routers, Adaptors, WUBS)
- Broadcom (Chipsets, WUSB)
- Cisco (AP)
- Celeno (HDVD)
- D-Link (Routers, WUSB)
- Edimax (Router, WUSB Adapter)
- Extreme (AP)
- Marvell (Chipsets)
- Meru (Family of Products, HDVD)
- Metalink (Chipsets; HDTV)
- Motorola (Tools, AP)
- NEC (Router)
- Netgear (Router, AP, HD streaming)
- Redpine Signals (Chipsets)
- Ruckus (AP, Multimedia)
- Ralink (Chipsets)
- Qualcomm (Chipsets)
- Quantenna (HDVD)
- Siemens – Nokia Siemens (AP)
- SiGe (Chipsets)
- Sanyo (WHDVD)
- TrendNet (Routers, AP, WUSB)
- ZyXel (AP, Router, WUSB)

2.6 WiDi

2.7 IEEE 802.11ac
2.7.1 General
2.7.2 Details

3.0 Wired Technologies
3.1 PLC Technologies
3.1.1 General: HomePlug
3.1.2 HomePlug Alliance
3.1.2.1 Goal
3.1.2.2 Timetable
3.1.3 ZigBee/HomePlug Smart Energy
3.1.4 Benefits
3.1.5 Details
3.1.6 HomePlug 1.0
3.1.7 HomePlug GP
3.1.8 HomePlug AV
3.1.8.1 HomePlug AV2
3.1.9 International: Standard Organizations Work
3.1.9.1 IEEE
3.1.9.2 TIA
3.1.9.3 ETSI
3.1.10 HomePlug Market Segment
3.1.10.1 HomePlug AV2 Market Segment
3.1.11 Vendors
- ActionTec
- Atheros
- Arkados
- Asoka
- Bewan
- Corinex
- CopperGate
- Devolo AG
- DS2
- GigaFast
- Gigle Networks
- Insteon
- IOGear
- LEA
- Motorola
- NEC
- Siemens
- SigmaDesigns
- Spidcom
- ST&T
- Zyxel

3.2 ITU G.hn - HomePNA
3.2.1 HomePNA Alliance
3.2.1.1 General
3.2.1.2 HomePNA Specification: Major Features
3.2.1.2.1 Fast EoC HomePNA
3.2.1.3 Major Benefits
3.2.2 ITU
3.2.2.1 General
3.2.3 HomeGrid Forum
3.2.4 Mixed Reaction
3.2.5 G.hn Details
3.2.6 Acceptance
3.2.7 HomePNA-G.hn
3.2.8 Samples of Vendors
- Cameo
- Cisco
- CopperGate (Sigma Designs)
- Motorola
- Netsys
- SendTek
- Suttle
- TRENDnet

3.3 MOCA
3.3.1 General
3.3.2 Partnerships
3.3.3 Details
3.3.3.1 MOCA v 2.0
3.3.4 Market
3.3.5 Samples of Vendors
- Actioncable
- Actiontec
- Broadcom
- CommScope
- Entropic
- Netgear

3.4 HDBaseT
3.4.1 HDBaseT Alliance
3.4.2 Features
3.4.2.1 Details
3.4.3 Industry
- Atlona
- Valense

3.5 DiiVA (Digital Interactive Interface for Video & Audio)
3.5.1 Consortium
3.5.1.1 Major Applications and Features
3.5.1.2 Specification
3.5.2 Synerchip
3.6 DispayPort
3.6.1 VESA
3.6.2 DisplayPort Specification
3.6.3 Icron
3.6.4 Market Estimate
3.7 Comparison

4.0 Conclusions

Attachment I: ETSI UWB Standards

List of Figures:

Figure 1: Throughput vs. Distance
Figure 2: UWB Spectrum
Figure 3: DS-UWB Spectrum Characteristics
Figure 4: Spectrum Regulations-UWB
Figure 5: TAM: Global UWB IC Sales ($B)
Figure 6: TAM: Global UWB IC Sales (Unit M)
Figure 7: Spectrum
Figure 8: Illustration-VLC Channel
Figure 9: VLC Transmission Channel Example: Details
Figure 10: TAM: U.S. LED Sales ($B)
Figure 11: TAM U.S. LED Sales (Bil. Units)
Figure 12: Cost and Brightness- Light Sources
Figure 13: 60 GHz “Open” Spectrum
Figure 14: TAM: U.S. WiHD Equipment Sales ($B)
Figure 15: TAM: U.S. WiHD Equipment Sales (Mil. Units)
Figure 16: IEEE802.15 Structure
Figure 17: 802.11 Protocol Family MAC Frame Structure
Figure 18: PM Global 802.11n Devices Sales (Mil. Units)
Figure 19: TAM: Global HomePlug-Equipped Products (Mil. Units)
Figure 20: TAM: Global HomePlug-Equipped Products ($B)
Figure 21: TAM: U.S. MOCA IC Sales (Mil Units)
Figure 22: TAM: U.S. MOCA IC Sales ($M)
Figure 23: PM: Global DisplayPort-compatible Interfaces Sales (Mil. Units)

List of Tables:

Table 1: MB-OFDM UWB Spectrum Designation
Table 2: Comparison: DS-UWB and MB-OFDM
Table 3: VLC Properties
Table 4: VLC, IR and RF Communications Applications Comparison
Table 5: Locations Technologies-VLC Place
Table 6: Use Cases
Table 7: Bandwidth Utilization Details
Table 8: HDV Formats and Required Speed of Delivery
Table 9: Attenuation
Table 10: Properties
Table 11: Comparison: Characteristics
Table 12: 802.11 Standards Characteristics
Table 13: Comparison of 802.11 Family Members Transfer Rates
Table 14: 802.11n Advantages
Table 15: HomePlug Major Milestones
Table 16: HomePlug Smart Energy
Table 17: HomePlug: Bandwidth-intensive Home Applications (%)
Table 18: ITU and HomePNA
Table 19: DiiVA Specification v1.1
Table 20: Comparison
 
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