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Flex and Flex-Rigid Printed Circuits 2010-2016

BPA Consulting, Sep 2011


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BPA’s latest report on the markets and technologies for flexible and rigid-flex printed circuits forecasts that the global market for bareboard flex will increase from $8.6 billion to $12.7 billion by 2016. The corresponding market for flex assemblies will increase from $26.3 billion to more than $40 billion in 2016. While new applications for flex such as smart card displays, tablet computers, biometric sensors, LED lighting and wireless communication antenna (this last applicable to all market sectors) are all strong growth markets, the dominant end-market is and will continue to be mobile phones and smartphones. Here the preferred mobile phone form factor has shifted away from clamshell and slider to touchscreen display, and as data transmission rates increase with sensor and display resolution, so FPC and rigid-flex technologies are changing and advancing.

The “Flex and Flex-Rigid Printed Circuits 2010-2016” report focuses on all the key applications in each market sector to see what is driving the market forward and what will be required in future. Market forecasts are provided for each major region by technology and by application. Opportunities are identified for fabricators, equipment and material suppliers.

Key report highlights:

- Flexible and flex-rigid substrates are key technologies in future generation electronic system design and development.
- The market for flex and rigid-flex printed circuit boards for all sectors will increase to $12.7bn by 2016. Mobile phone and display interconnects dominate Asian production and markets. These segments account for nearly half of all FPC production.
- Flex and flex-rigid production in China will increase from $2 billion in 2010 to more than $4 billion by 2016 accounting for 25% of worldwide production. Asia in total will account for more than 90% of worldwide flex production by 2016

Key report benefits:

- Identifies opportunities for small, medium and large players
- Identifies and examines the technologies, materials and- processes that you will need to participate in these markets
- Identifies winning strategies for successful players
- Provides a totally integrated assessment of the global flexible and flex-rigid substrate supply chain.

Key questions answered in this report:

- How large are the markets for flexible and flex-rigid substrates? How fast are they growing? How will they develop over the next five years?
- What are the next emerging applications for flex and flex-rigid substrates?
- Which new flexible and flex-rigid substrate technologies will emerge as mainstream approaches - when and why?
- What new opportunities are emerging for companies in the supply industry for new materials, process equipment and assembly services?
- Who are the players in flexible and flex-rigid substrates worldwide? How are they differentiated?
- How is flexible and flex-rigid substrate manufacturing and end-market demand distributed worldwide?
- How will the trade balance of Western and Eastern production change over the next five years?
- What will be the winning strategies for successful flexible and flex-rigid substrate suppliers?
- How will EMS and ODMs impact the supply base?


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