The Worldwide Motherboard Application IC Market, 3Q 2011

Market Intelligence & Consulting Institute (MIC), October 2011, Pages: 16

This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. The report finds that in the wake of a slight pickup in shipment volume in the first quarter of 2011, worldwide motherboard shipment volume witnessed a sequential decline in the second quarter of 2011 but still enjoyed a year-on-year growth. It is observed that LGA775 remained the dominant CPU connector type in the second quarter of 2011. It is anticipated that worldwide motherboard shipment volume will continue to grow steadily in the third quarter of 2011 but the growth momentum will slow down in the last quarter of 2011.

Worldwide Motherboard Shipment Volume, 1Q 2010 - 2Q 2012

Worldwide Motherboard Shipment Volume by CPU Supplier, 1Q 2009 - 2Q 2011

Worldwide Motherboard Shipment Share by CPU Supplier, 1Q 2009 - 2Q 2011

Worldwide Motherboard Shipment Volume by CPU Connector Type, 1Q 2009 - 2Q 2011

Worldwide Motherboard Shipment Share by CPU Connector Type, 1Q 2009 - 2Q 2011

Worldwide Motherboard Shipment Volume by Chipset Supplier, 1Q 2009 - 2Q 2011

Worldwide Motherboard Shipment Share by Chipset Supplier, 1Q 2009 - 2Q 2011

Worldwide Motherboard Shipment Volume by Chipset Type, 1Q 2009 - 2Q 2011

Worldwide Motherboard Shipment Share by Chipset Type, 1Q 2009 - 2Q 2011

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