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Wispry RF MEMS Reverse Cost Analysis
Description:
- Physical Analysis of the Device
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price
The market for RF MEMS in cell phone finally emerges with the first Wispry antenna tuner in high volume production! RF MEMS switches and variable capacitors are on the verge of being the next very big market for the MEMS industry.
Manufactured by IBM, Wispry MEMS element is a network of 32 variable capacitors, integrated in a plastic package (3x2x1mm) with a laminate substrate.
This report provides complete teardown of the inertial MEMS with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price
The market for RF MEMS in cell phone finally emerges with the first Wispry antenna tuner in high volume production! RF MEMS switches and variable capacitors are on the verge of being the next very big market for the MEMS industry.
Manufactured by IBM, Wispry MEMS element is a network of 32 variable capacitors, integrated in a plastic package (3x2x1mm) with a laminate substrate.
This report provides complete teardown of the inertial MEMS with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Contents:
1. Overview / Introduction
– Executive Summary – Reverse Costing Methodology
2. Company Profile
– Wispry Profile
3. Physical Analysis
– Package Characteristics
– Package Markings
– Package X-Ray
– Package Composition
– Package Opening & Bonding Number
– Package Cross-Section
– Die Dimensions
– MEMS Details
– MEMS Structure
– MEMS Cross-Section
– MEMS Process Characteristics
4. Manufacturing Process Flow
– Front-end Process Flow
– Package Process Flow
– Wafer Fabrication Units
5. Cost Analysis
– Supply Chain Analysis
– Wafer Cost Hypothesis
– Wafer Cost
– Die cost
– Packaging Process Flow
– Packaging Cost Details
– Final Test Cost
– Component Manufacturing Cost
– Yield Synthesis
6. Estimated Manufacturer Price Analysis
– Manufacturers ratios
– Estimated manufacturer Price
– Executive Summary – Reverse Costing Methodology
2. Company Profile
– Wispry Profile
3. Physical Analysis
– Package Characteristics
– Package Markings
– Package X-Ray
– Package Composition
– Package Opening & Bonding Number
– Package Cross-Section
– Die Dimensions
– MEMS Details
– MEMS Structure
– MEMS Cross-Section
– MEMS Process Characteristics
4. Manufacturing Process Flow
– Front-end Process Flow
– Package Process Flow
– Wafer Fabrication Units
5. Cost Analysis
– Supply Chain Analysis
– Wafer Cost Hypothesis
– Wafer Cost
– Die cost
– Packaging Process Flow
– Packaging Cost Details
– Final Test Cost
– Component Manufacturing Cost
– Yield Synthesis
6. Estimated Manufacturer Price Analysis
– Manufacturers ratios
– Estimated manufacturer Price
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