ST LSM330DLC 6-axis MEMS Inertial Module (3D accelerometer + 3D Gyroscope) - Reverse Costing Analysis

System Plus Consulting, February 2012, Pages: 160

Physical Analysis of the Devices
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price

System Plus Consulting is proud to publish the reverse costing report of the new 6-axis MEMS Inertial Module supplied by STMicroelectronics. The LSM330DLC is a system-in-package featuring a 3axis accelerometer and a 3-axis gyroscope. With a 4.0x5.0x1.1mm size, it belongs to the smallest inertial modules for consumer applications. It is manufactured with the same ST THELMA process used for more than 1.5billon MEMS devices. The LSM330DLC is targeted for consumer applications: GPS navigation systems, Impact recognition and logging, Gaming …

This report provides complete teardown of the MEMS IMU with:
-Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

The report provide also a comparative analysis with the previous ST 6DoF MEMS IMU, the LSM330DL.

Glossary

Overview/Introduction
- Executive Summary
- Reverse Costing Methodology

ST Company Profile
- Product Range
- Business Model

Physical analysis
- Physical Analysis Methodology
- LSM330DLC - Package
Package Characteristics & Markings
Package X-Ray
Package Cross-Section
Package Opening
- LSM330DLC - Accelerometer
Accelerometer Cross-section
Accelerometer ASIC
Accelerometer MEMS
- LSM330DLC - Gyroscope
Gyroscope Cross-section
Gyroscope ASIC
Gyroscope MEMS
- LSM330DL Short Physical Analysis
- ST 3-Axis Accelerometers MEMS Dies Comparison
- ST 3-Axis Gyroscopes MEMS Dies Comparison

Manufacturing Process Flow
- Overview
- ASIC/MEMS Process Flows
- Description of the Wafer Fabrication Units

Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Supply Chain Analysis
- Manufacturers financial ratios
- Yields Explanation
- Yields Hypotheses
- ASICs Front-End Cost
- ASICs Back-End 0 Cost (Probe Test and Dicing)
- ASICs Dies Cost (Front End + Back End 0)
- MEMSs Front-End Cost
- MEMSs Front-End Cost per Process Steps
- MEMSs Front-End: Equipment Cost per Family
- MEMSs Front-End: Material Cost per Family
- Back-End 0: Packaging, Probe Test and Dicing Cost
- Back-End 0 Cost per Process Steps
- Back-End 0: Dies Cost (Front End + Back End 0)
- Back-End 1: Final Test & Calibration Cost
- LSM330DLC/DL Component Cost (FE + BE 0 + BE 1)
- Estimated Price Analysis

Conclusion

Product Samples

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