The Worldwide Motherboard Application IC Market, 1Q 2012
Market Intelligence & Consulting Institute (MIC), April 2012, Pages: 13
This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. This report finds that after enjoying shipment growth in the third quarter, the worldwide motherboard shipment volume witnessed sequential and year-on-year declines in the fourth quarter of 2011. It is observed that LGA 775 remained the dominant CPU connector type in the fourth quarter of 2011. It is anticipated that the worldwide motherboard shipment volume will continue to experience shipment decrease in the first quarter of 2012 but begin to pick up starting in the second quarter.
Worldwide Motherboard Shipment Volume, 1Q 2010 - 4Q 2012
Worldwide Motherboard Shipment Volume by CPU Supplier, 1Q 2010 - 4Q 2011
Worldwide Motherboard Shipment Share by CPU Supplier, 1Q 2010 - 4Q 2011
Worldwide Motherboard Shipment Volume by CPU Connector Type, 1Q 2010 - 4Q 2011
Worldwide Motherboard Shipment Share by CPU Connector Type, 1Q 2010 - 4Q 2011
Worldwide Motherboard Shipment Volume by Chipset Supplier, 1Q 2010 - 4Q 2011
Worldwide Motherboard Shipment Share by Chipset Supplier, 1Q 2010 - 4Q 2011
Worldwide Motherboard Shipment Volume by Chipset Type, 1Q 2010 - 4Q 2011
Worldwide Motherboard Shipment Share by Chipset Type, 1Q 2010 - 4Q 2011
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