The Worldwide IC Packaging Market - 2012 Edition
New Venture Research, May 2012, Pages: 425
Following a year of unprecedented growth in 2010(IC revenue grew 40.6% while units expanded 35.5%), 2011 experienced a slight downturn in the second half of the year. Semiconductor industry growth is expected to expand by only 4% in 2012 but take an upward path thereafter. Overall the IC market is being driven by demand for handheld consumer devices and the adjoining infrastructure. The automobile industry has recovered, which are laden with semiconductor devices, yet supply has been dampen with the tsunami flooding of Japan and Thailand. The economic uncertainty of Europe and developments in the Arab Spring are other affecting factors.
New Venture Research (NVR) , in The Worldwide IC Packaging Market, 2012 Edition, analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market. The report begins with an economic and industry overview, historic and future unit and revenue graphs, and a SATS company overview.
Following this high-level review, the report presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the contract assembly market. The package families are then rolled up by I/O count and semiconductor product. In doing so, the report generates the total value of the IC packaging industry.
Next, the report presents NVR's continuing, Mextensive coverage of the packaging contractor market. Packaging contractors will continue to assume a larger share of the world's IC packaging business. The report breaks the contractor market down by package families and major product categories providing units and revenue for each category. To help you further assess this group of companies, the report profiles the activities of the world's largest contractors and the packages they offer.
The Worldwide IC Packaging Market, 2012 Edition continues NVR's leadership position in assessing the status and future of IC packaging. This report will provide you with an effective and economical tool for assessing the future of this market.
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: The State of the Industry
- Economic Overview
- Industry Overview
- SATs Company Overview
Chapter 4: IC Package Forecast by Product
- MPU
- MCU
- DSP
- DRAM
- Flash
- SRAM
- ROM and EPROM
- EEPROM/Other Memory
- Digital Bipolar
- Standard Logic
- Gate Arrays
- Cell-Based and PLD
- Display Drivers
- Custom Logic
- Amplifiers
- Interfaces
- Volt age Regulators
- Data Converters
- Custom Analog
Chapter 5:
- IC Package Forecast by Package Family
- DIP
- SOT
- SO
- TSOP
- DFN
- CC
- QFP
- QFN
- PGA
- BGA
- FBGA
- WLP
- DCA
Chapter 6: Packaging Contractor Market
- Market Overview
- Forecasts by Package Family
- DIP
- SOT
- SO
- TSOP
- DFN
- CC
- QFP
- QFN
- PGA
- BGA
- FBGA
- WLP
Unit, Revenue, and Pricing Forecasts
Forecast by Product
Contractor Rankings
Chapter 7: Company Profiles
- Amkor
- Anst China
- ASE
- Azimuth
- Carsem
- ChipMOS
- Cirtek
- CORWIL Technology
- FlipChip Int'l
- Hana
- Hana Micron
- I2A
- IDS Electronics
- Jiangsu Changjiang
- Lingsen Precision
- Millennium Microtech
- Naito Densei Kogyo
- NANIUM
- Nantong Fujitsu
- OSE
- Powertech
- Shinko Electric
- Signetics
- Sigurd
- Siliconware
- SPEL
- STATS ChipPAC
- Tianshui Huatian Tech
- Unisem
- UTAC
- Vigilant Technology
- XinTec
- Amkor
- Anst China
- ASE
- Azimuth
- Carsem
- ChipMOS
- Cirtek
- CORWIL Technology
- FlipChip Int'l
- Hana
- Hana Micron
- I2A
- IDS Electronics
- Jiangsu Changjiang
- Lingsen Precision
- Millennium Microtech
- Naito Densei Kogyo
- NANIUM
- Nantong Fujitsu
- OSE
- Powertech
- Shinko Electric
- Signetics
- Sigurd
- Siliconware
- SPEL
- STATS ChipPAC
- Tianshui Huatian Tech
- Unisem
- UTAC
- Vigilant Technology
- XinTec
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