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Advanced Packaging: 3D Glass & Silicon Interposers 2012 Product Image

Advanced Packaging: 3D Glass & Silicon Interposers 2012

  • Published: September 2012
  • Region: Global
  • 344 Pages
  • Yole Développement

FEATURED COMPANIES

  • Allvia
  • Dalsa
  • Ibiden
  • Murata
  • Shinko
  • Teledyne
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Why and how 2.5D integration will impact more than 15% of the IC substrate business by 2017

2.5D AND 3D INTEGRATION IS SET TO BE A LONG-LASTING TREND IN THE SEMICONDUCTOR INDUSTRY

After meeting with swift commercial success on a few initial applications, including MEMS, sensors and power amplifiers, 3D integration has been on everyone’s mind for the past five years. However, once the initial euphoria faded, and despite technical developments which assured most observers that mass adoption of 3D was not out of reach, some unanticipated technical and supply chain hurdles were revealed that were higher than anticipated. It was then that 2.5D integration by means of 3D glass or silicon interposers was revealed by experts as a necessary stepping-stone to full 3D integration. Our first report on 3D interposers and 2.5D integration was in 2010; at that time, we listed the various applications of this technology trend and its drivers, and we showed that glass and silicon interposers were expected to become high-volume necessities, rather than just high-performance solutions for a few niche applications.

In this 2012 edition of that report, we provide more evidence READ MORE >

1. Scope of the report , definitions and background

2. Executive summary

3. Supply chain analysis

4. Market forecasts
- 2010-2017 wafer forecasts
- 2010-2017 unit forecasts
- 2010-2017 revenue (M$) forecasts
- 2011 interposer wafer capacity

5. Applications and drivers
1. System partitioning interposers
2. MEMS & sensors 3D capping interposers
3. Interposers for CMOS image sensors
4. 3D silicon substrates for High Power LEDs
5. 3D integrated passive devices
6. Misc. Glass/silicon package substrates

6. Technologies and roadmaps
- Technologies and design rules for interposers by application
- Interposer manufacturing process flow
- Assembly and test
- Reliability
- Design and modeling
- Focus on Glass interposers
- Focus on PANEL interposers
- Roadmaps

7. Technology alternatives
- Organic interposers strike back
- 2.5D integration with fan-out WLP (eWLB)

8. 3D Interposers and 2.5D modules
Cost case studies
- Cost model and cost down roadmap of a large 2.5D FPGA structure
- Cost model of a 2.5DAPE for tablets

9. Capex investmet forecasts

10. Conclusions

APPENDIX

- Altera
- Amkor
- Allvia
- Apple
- Asahi Glass Corporation (AGC)
- ASE
- Bosch
- Avago Technologies
- CEA-Leti
- Cisco
- Dai Nippon Print (DNP)
- Dalsa
- EPWorks
- eSilicon
- Flip Chip International (FCI)
- Fraunhofer Institüt
- Fujikura
- Fujitsu
- GlobalFoundries
- GlobalUniChip (GUC)
- Hoya
- Huawei
- Ibiden
- IBM
- IME
- IMEC
- Intel
- ipdia
- LG Innotek
- LSI Logic
- Mediatek
- Micron
- Murata
- Nepes
- Nokia
- Oracle
- PlanOptik
- Qualcomm
- Samsung
- Sematech
- Semtech
- Sensonor
- Shinko
- Sibdi
- Silex
- Sony
- SPIL
- StatsChipPac
- STMicroelectronics
- Suss Microtec
- TDK-Epcos
- Tecnisco
- Teledyne
- Texas Instruments
- Tezzaron
- tMt
- Toshiba
- TSMC
- UMC
- Unisem
- Viagan
- VisEra
- VTI Technologies
- Xilinx

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