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Thin Wafers, Temporary Bonding Equipment & Materials Market 2012 Product Image

Thin Wafers, Temporary Bonding Equipment & Materials Market 2012

  • Published: October 2012
  • Region: Global
  • Yole Développement

FEATURED COMPANIES

  • 1366 Technologies
  • Brewer Science
  • ESI
  • LG Innotek
  • Qualcomm
  • SPIL
  • MORE

Memory, Logic, Power Devices & Image Sensors markets will drive the thin wafers market and related handling technologies

WITH ALMOST ¾ OF THE TOTAL NUMBER OF WAFERS EXPECTED TO BE THINNED BY 2017, TEMPORARY BONDING MARKET WILL INCREASE IN THE COMING YEARS

This Yole Développement report describes why thinner wafers will be needed in the future, especially for consumer applications. Indeed, consumer electronics is a big driver for smaller, higher-performing, lower-cost device configurations for use in various applications, such as memory and wireless devices.

These new configurations, in turn, are pushing demand for thin ( 80M 12’’ eq. wafers.

Applications are also described in the report. The 2012 market drivers for thin wafers are 3D ICs, and also Power Devices and CIS BSI for ultra-thin wafers. Indeed, the BSI application is the big driver for ultra thin wafers; this application is currently booming. 2011 was a big year for 300 mm wafer bonding tools, thanks to BSI. This application requires ultra thin layers ( 2015.

Temporary bonding implies know-how in process and chemistry, and an understanding of the final application READ MORE >

Table of contents

Why this report

What is new compared to 2011 report

List of companies mentioned in the report

Executive summary

THIN WAFERS

2011-2017 thin wafer market forecasts
- Thinned wafers vs. TOT number of shipped wafers
- Thin wafers shipment in 300 mm eq.
- 2011-2017 thin wafer shipment forecast by application in units
- In US$
- 2011-2017 thin wafer shipment forecast by wafer diameter in units
- In US$
- 2011-2017 thin wafer shipment forecast by wafer thickness in units
- In US$
- 2011 Thickness Breakdown
- 2017 Thickness Breakdown

Description of applications
- TOP Thin wafers processors
- Thin wafers processors production ranking
- Thin wafers processors by application
- Thin wafer processing geographical breakdown
- Grinding players
- MEMS
- CMOS Image Sensors
- Memory & Logic
- Power Devices
- RF Devices (GaAs)
- LEDs
- Advanced Packaging
- Photovoltaic

THIN WAFERS HANDLING

Temporary bonders/Carriers/Materials forecast
- Temporary bonded wafers forecast
- Temporary bonders forecast in $M/units
- Temporary bonders forecast by wafer size
- Temporary bonding materials forecast
- Est 2011 temporary bonding players market share

Thin wafer handling: the different solutions
- Wafer handling with carrier: temporary bonding
- The different temporary bonding techniques
- -Thermal plastic release
- - Mechanical release
- - ZoneBOND
- - YAG laser release
- - Excimer laser release
- - Chemical release
- Temporary bonding materials
- - The “Magic” material
- - Carriers
- Wafer handling with carrier: electrostatic carrier
- Wafer handling without carrier
- Wafer handling with ring technology
- Wafer thinning
- Wafer dicing

Final conclusions

- 1366 Technologies
- 3M
- AAC
- ABB
- Accretech
- ADI
- AGC
- ALSI
- Altera
- AMAT
- AMD
- Amkor
- Ampulse
- ANJI
- Aptina / Micron
- ASE
- AstroWatt
- Avago
- Brewer Science
- Cabot
- Canon
- Corning
- Cree
- Crystal Solar
- Dalsa
- Danfoss
- Discera
- Disco
- Dongjin
- DoubleCheck Semiconductors
- Dupont
- Dynatex
- Ebara
- EM Marin
- Epistar
- Epoxy Technologies
- ERS
- ESI
- EVG
- Fairchild
- Fraunhofer IZM
- Freescale
- GCL Solar
- Hamamatsu
- Hitachi Chemical
- Hynix
- IBM
- Imec
- Infineon
- Intel
- International Rectifier
- Invensense
- Ipdia
- LDK
- Leti
- LG Innotek
- Lintec
- Lumileds
- MEMC
- Micron
- Misui Chemical
- Mitsubishi Electric
- Nichia
- Nitronex
- Nitta Corp.
- Nitto Denko
- Okamoto
- Omnivision
- ON Semi
- Osram
- Panasonic
- PlanOptik
- Protec
- Qualcomm
- REC
- Renesas
- ReneSola
- RFMD
- Robert Bosch
- Roockwood
- S’Tile
- Samsung
- SanRex
- Schott
- Sensonor
- Seoul Semiconductor
- Shinko
- Sigen
- Silex
- Skyworks
- Solarforce
- SPIL
- STMicroelectronics
- Strasbaugh
- STATSChipPAC
- Sumitomo Chemical
- SUSS MicroTEC
- Synova
- Taiko
- Tekcore
- TEL
- TMAT
- TOK
- Toyoda Gosei
- Triquint
- Twincreeks
- VisEra
- WLCSP
- Xilinx
- Xintec
- Yushin.

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