Research on Global and Chinese Wafer Foundry Industry, 2012

  • ID: 2368814
  • December 2012
  • Region: Global, China
  • 80 Pages
  • Huidian Research
1 of 4


  • Dongbu
  • Grace/HHNEC
  • MagnaChip
  • Samsung
  • SMIC
  • MORE

Since 2011, the world's major wafer foundries are accelerating the expansion of advanced process capacity scale. With the flourish of smart phone and tablet PC market, the demand for advance process which owns low cost and high efficiency increased rapidly, therefore, the wafer foundries including TSMC, UMC, Global Foundries and Samsung have expanded production capacity actively.

In 2011, the annual output value of global semiconductor foundries was nearly $ 30 billion, and TSMC occupies more than 40% of the market share. With the flourish of UMC, Samsung, Intel and GlobalFoundries, in order to maintain the leading position, TSMC invested $ 5.9 billion to expand 12-inch plant and improve the production capacities of 65/55 nm and 40 nm, and the capital expenditure amounted to $ 7.8 billion in 2011, mainly invested in Wafer Fifteenth Factory. In 2012, the capital expenditure is expected to reach $8-8.5 billion.

In 2011, UMC gained 35.7% stock equity of HeJian Technology (Suzhou) Co., Ltd and became its largest shareholder. In the future, UMC will continue to negotiate the acquisition of stock equity with other shareholders so as to accelerate the production capacity expansion, and also to improve the competitiveness by virtue of capacity advantage complement between China Mainland and Taiwan; at the same time, UMC began 28 nm pilot production since the first quarter of 2012, it is estimated that by the end of 2012, the revenue of 28 nm will occupy 5% of the total revenue, and the capital expenditure plan is $ 2 billion in 2012.

The global market share of China mainland's wafer foundries reached 13.3% in 2006. However, this proportion decreased year by year, and the global market share dropped to 10% and less than 9% in 2010 and 2011 respectively.

Note: Product cover images may vary from those shown
2 of 4


  • Dongbu
  • Grace/HHNEC
  • MagnaChip
  • Samsung
  • SMIC
  • MORE

1. Profile of Semiconductor Industry
1.1 Definition
1.2 Classification and Production Process
1.3 Development History
1.3.1 Journey of Integrated Circuit Industry
1.3.2 Reform and Opening Gained Vitality for China's IC Industry
1.3.3 Policy Guarantee and Market Orientation Promoted the Rapid Development of China's IC Industry
1.3.4 Increasing External Pressure and Industrial Competition Increase the Development Pressure of Local Enterprises
1.3.5 Poor Connection of Industrial Chain Restricts the Overall Industrial Development

2. Global Semiconductor Industry
2.1 Overview of Global Semiconductor Industry
2.2 Status Quo and Future Development of Global Wafer Foundry
2.3 Horizontal Comparison of Global Wafer Foundries
2.3.1 Operation Revenue of Global Wafer Foundries in 2012
2.3.2 Market Scale of Global Wafer Foundries in 2012

3. China's Semiconductor Market and Industry
3.1 Status of China's Semiconductor Industry
3.1.1 Industrial Scale Expands Continuously
3.1.2 IC Industrial Structure becomes More Balance and Reasonable
3.1.3 China has become the World's Largest Semiconductor Market
3.1.4 International Trade Expands Rapidly
3.1.5 Technical Level of All Links of the Industrial Chain Improved Largely
3.2 Comparison between China's Semiconductor Industry and International Semiconductor Industry
3.2.1 Industrial Foreign Dependence Degree is Extremely High
3.2.2 Industrial Value Chain is Still Disjointed
3.2.3 Blockade on Foreign High-end Advanced Technology Still Exist, Self-development is Extremely Urgent
3.2.4 Industrial Investment Attraction Decreased
3.3 China's Wafer Foundry and IC Design Industry
3.3.1 Status Quo of China's Wafer Foundry Industry
3.3.2 Status Quo of China's IC Design Industry

4. Analysis of Wafer Foundries
4.1 TSMC
4.1.1 Company Profile
4.1.2 Business Performance
4.1.3 Future R&D Plan
4.1.4 Development Prospect
4.2 Global Foundries
4.2.1 Global Foundries
4.2.2 Future Processing Craft
4.2.3 Wafer Supply Agreement between AMD and GF
4.2.4 Operating Revenue
4.2.5 Future Investment Direction
4.3 UMC
4.3.1 Company Profile
4.3.2 Wafer Technology
4.3.3 Production and Manufacturing
4.3.4 Operating Revenue
4.4 Samsung Electronics
4.4.1 Company Profile
4.4.2 Operation Status in 2011
4.4.3 Capacity Utilization in 2012
4.4.4 Development Strategy
4.5 SMIC
4.5.1 Company Profile
4.5.2 Operation Status in 2011
4.5.3 Company Management and Capacity Utilization in the Third Quarter of 2012
4.5.4 Development Strategy
4.6 TowerJazz
4.6.1 Company Profile
4.6.2 Operation Status
4.6.3 Development of Main Business
4.6.4 Development Strategy
4.7.1 Company Profile
4.7.2 Business Status
4.7.3 Client Distribution and Product Application
4.7.4 Operation Status
4.8 Vanguard International Semiconductor Corp
4.8.1 Company Profile
4.8.2 Pecuniary Condition
4.8.3 Technological Development Situation
4.8.4 Market Share
4.8.5 Main Clients
4.8.6 Advantages and Disadvantages of Future Development and the Coping Strategy
4.9 Dongbu HiTek
4.9.1 Company Profile
4.9.2 Advantages
4.9.3 Main Business and Clients
4.9.4 Operation Situation
4.10 MagnaChip
4.10.1 Company Profile
4.10.2 Business Performance
4.10.3 Competitive Advantages
4.10.4 Development Prospect
4.11 Grace Semiconductor
4.11.1 Company Profile
4.11.2 Business Performance
4.11.3 Competitive Advantages
4.11.4 Operation Principle
4.12 X-FAB
4.12.1 Company Profile
4.12.2 Technical Overview
4.12.3 X-FAB takeover MFI, Expand MEMS Wafer Foundry Business Continuously
4.13 China Resources Microelectronics
4.13.1 Company Profile
4.13.2 Development History
4.13.3 Main Business and Strength
4.13.4 Operation Status
4.13.5 Development Plan
4.14 ASMC
4.14.1 Company Profile
4.14.2 Operation Status in 2011
4.14.3 Company Management and Capacity Utilization in the Third Quarter of 2012
4.14.4 Development Strategy

Note: Product cover images may vary from those shown
3 of 4

- Dongbu
- Grace/HHNEC
- MagnaChip
- Samsung
- Tower Jazz
- Vanguard

Note: Product cover images may vary from those shown
4 of 4
Note: Product cover images may vary from those shown


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