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Electroless Copper and Nickel-Phosphorus Plating. Woodhead Publishing Series in Metals and Surface Engineering - Product Image

Electroless Copper and Nickel-Phosphorus Plating. Woodhead Publishing Series in Metals and Surface Engineering

  • ID: 2719580
  • January 2011
  • 304 Pages
  • Elsevier Science and Technology

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.

After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.

Written by leading experts in the field Electroless copper and nickel-phosphorus READ MORE >

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Introduction to electroless copper and nickel-phosphorus (Ni-P) depositions. Part 1 Electroless copper depositions: Surface morphology evolution of electroless copper deposits
Cross-section of electroless copper deposits and the void fraction
Crystal structure and surface residual stress of electroless copper deposits
The atomic model of the diamond pyramid structure in electroless copper deposits
Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits
Adhesion strength of electroless copper deposit to epoxy board
Electrical resistivity of electroless copper deposit
Applications of electroless copper deposits. Part 2 Electroless nickel-phosphorus (Ni-P) depositions: Crystallisation of nickel-phosphorus (Ni-P) deposits with high phosphorus content
Crystallisation of nickel-phosphorus (Ni-P) deposits with medium and low phosphorus content
Modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits
Artificial neural network (ANN) modelling of crystallisation temperatures of nickel-phosphorus deposits
Hardness evolution of nickel-phosphorus (Ni-P) deposits with thermal processing
Applications of electroless nickel-phosphorus (Ni-P) plating.

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Sha, W
Professor Wei Sha is Professor of Materials Science at The Queen's University of Belfast, UK
Wu, Xiaomin
Keong, K G
Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.

Note: Product cover images may vary from those shown
Note: Product cover images may vary from those shown

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