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Smart Packaging Comes To Market: Brand Enhancement with Electronics 2014-2024 - Product Image

Smart Packaging Comes To Market: Brand Enhancement with Electronics 2014-2024

  • Published: March 2014
  • Region: Global
  • 286 Pages
  • IDTechEx
The Global Demand For Electronic Smart Packaging Will Grow To Over $1.45 Billion In The Next Decade

FEATURED COMPANIES

  • ACREO, Sweden
  • Cymbet, USA
  • Holst Centre, Netherlands
  • MWV, USA
  • PolyIC, Germany
  • Solarmer, USA
  • MORE

This report reveals the global demand for electronic smart packaging devices is currently at a tipping point and will grow rapidly to over $1.45 billion within 10 years. The electronic packaging (e-packaging) market will remain primarily in consumer packaged goods CPG reaching 14.5 billion units that have electronic functionality within a decade.

Electronics and electrics are already used in packaging, from winking rum bottles and talking pizza boxes to aerosols that emit electrically charged insecticide that chases the bug. Electronic medication packs record how much is taken and when and prompts the user. Reprogrammable phone decoration has arrived. But that is just a warm up. The key enabling technology - printed electronics - often used with other conventional electronics - can make new packaging and product features feasible. Consequently, many leading brand owners have recently put multidisciplinary teams onto the adoption of the new paper thin electronics on their high volume packaging. It will provide a host of consumer benefits and make competition look very tired indeed. This is mainly about modern merchandising - progressing way beyond static print - and dramatically READ MORE >

1. EXECUTIVE SUMMARY AND CONCLUSIONS
1.1. Benchmarking validation of figures
1.2. Market sub sectors merge
1.2.1. EAS and RFID
1.2.2. NFC in Smart Packaging
1.3. Reasons for the slow start
1.3.1. Unbalanced supply chain
1.3.2. Many examples of e-packaging
1.3.3. Little market pull
1.3.4. Tipping point
1.3.5. P&G and printed electronics
1.3.6. Using more of the human senses and in a better way
1.3.7. Reusable electronic packaging
1.3.8. Major adoption is certain now
1.3.9. The forthcoming e-Label
1.3.10. Technology push
1.4. Market drivers
1.4.1. Two routes for e-packaging
1.4.2. Price sensitivity
1.4.3. Basic hardware platforms are essential to achieve volume
1.5. New components and creative design
1.5.1. New design paradigms
1.5.2. Electronic graphic design
1.5.3. Diageo needs
1.6. Emerging Technologies, Business Drivers and Insights
1.6.1. Displays
1.6.2. Power
1.6.3. Other components: Logic, sensors, conductive ink
1.7. Market Background
1.8. Feedback from Interviews with End Users

2. INTRODUCTION
2.1. Types of packaging
2.1.1. Demographic timebomb
2.2. Why progress is now much faster
2.2.1. Using the nine human senses
2.2.2. AstraZeneca Diprivan chipless RFID
2.3. Why basic hardware platforms are essential
2.3.1. Argument for printing standard circuits
2.3.2. Touch and hearing
2.3.3. Smell
2.4. Why e-packaging has been slow to appear
2.4.1. Inadequate market research
2.4.2. Lack of market pull
2.4.3. Wrong priorities by developers - engineering led design
2.4.4. Inadequate cost reduction
2.4.5. Odd inventions not economy of scale/hardware platforms
2.4.6. Failure to solve technical problems
2.4.7. Legal constraints
2.4.8. Lessons from brand enhancement of cars using printed electronics

3. END USER INTERVIEWS AND FEEDBACK ON SMART PACKAGING
3.1. Drivers
3.2. End User Views - Application Needs
3.3. End User Views - Technical Needs

4. THE NEED FOR ELECTRONICS IN PACKAGING
4.1. Safety
4.2. Security and reducing crime
4.3. Uniqueness/ product differentiation
4.4. Convenience
4.5. Leveraging the brand with extra functions, brand enhancement
4.6. Merchandising and increasing sales
4.6.1. Attracting attention
4.6.2. Rewards
4.7. Entertainment
4.7.1. Touchcode
4.8. Error Prevention
4.9. Environmental aspects of disposal
4.10. Environmental quality control within the package
4.11. Quality Assurance
4.12. Consumer feedback
4.13. Removing tedious procedures
4.14. Cost reduction, efficiency and automated data collection

5. THE MAGIC THAT IS BECOMING POSSIBLE
5.1. Printed electronics products from Toppan Forms
5.2. Solar bags
5.3. Smart substrates
5.4. Transparent and invisible electronics
5.5. Tightly rollable electronics
5.5.1. Fault tolerant electronics
5.6. Stretchable and morphing electronics
5.7. Edible electronics
5.8. Electronics as art
5.9. Origami electronics
5.10. The package becomes the delivery mechanism
5.11. Electronic release, dispensing and consumer information

6. BASIC HARDWARE PLATFORMS NEEDED BY THE MARKET
6.1. Winking image label
6.2. Talking label
6.3. Recording talking label
6.4. Scrolling text label
6.5. Timer
6.6. Self adjusting use by date
6.7. Other sensing electronics
6.8. Moving color picture label
6.9. Drug and cosmetic delivery system
6.10. Ultra low cost printed RFID/EAS label

7. PRECURSORS OF IMPENDING E-PACKAGING CAPABILITIES
7.1. Coming down market
7.2. T-Ink and all the senses

8. EXAMPLES OF E-PACKAGING
8.1. Examples of e-packaging and related uses with human interface
8.1.1. Bombay Sapphire pack
8.1.2. Printed electronics magazine cover - Blue Spark, NTERA, CalPoly, SiCal, Canvas and Ricoh
8.1.3. Printed electronic greeting cards - Tigerprint, PragmatIC, and Novalia
8.1.4. Cigarettes scrolling display - Kent
8.1.5. Talking pill compliance kit - MeadWestvaco
8.1.6. Monochrome reprogrammable phone decoration - Hitachi
8.1.7. Color reprogrammable phone decoration - Hewlett Packard and Kent Display
8.1.8. Rum winking segments - Coyopa
8.1.9. Talking pizza boxes - National Football League and Mangia Media
8.1.10. Batteries with integral battery tester - Duracell
8.1.11. Point of Sale Material - News Corporation and T-Ink
8.1.12. Place mats - McDonalds
8.1.13. Animation and sound - Westpoint Stevens
8.1.14. Board games become animated - Hasbro and Character Visions
8.1.15. Interactive tablecloth - Hallmark
8.1.16. Compliance monitoring blisterpack - National Institutes of Health/Fisher Scientific
8.1.17. Compliance monitoring blisterpack laminate - Novartis/Compliers Group/DCM
8.1.18. Smart blisterpack dispenser - Bang & Olufsen Medicom
8.1.19. Winking sign - ACREO
8.1.20. Compliance monitoring plastic bottle - Aardex
8.1.21. Talking medicine - CVS and other US pharmacies
8.1.22. Talking prizes - Coca-Cola
8.1.23. Beer package game - VTT Technology
8.1.24. Electronic cosmetic pack - Procter and Gamble
8.1.25. Cookie heater pack - T-Ink
8.1.26. Sata Airlines - Ynvisible
8.2. Examples of e-packaging without human interface
8.2.1. Time temperature label - Findus Bioett
8.2.2. Anti-theft - Wal-Mart/Tyco ADT
8.2.3. Time temperature recorders - Healthcare shippers/KSW Microtec
8.2.4. Fly seeking spray - Reckitt Benkiser
8.2.5. RFID for tracking - Tesco & Metro/Alien Technology
8.2.6. Blisterpack with electronic feedback buttons - Kuopio University Hospital
8.2.7. Trizivir - AstraZeneca
8.2.8. Oxycontin - Purdue Pharma
8.2.9. Viagra - Pfizer
8.2.10. Theft detection - Swedish Postal Service and Deutsche Post
8.2.11. Blood - Massachusetts General Hospital
8.2.12. Real time locating systems - Jackson Healthcare Hospitals/Awarepoint

9. THE TOOLKIT OF ELECTRONIC COMPONENTS FOR E-PACKAGING
9.1. Challenges of traditional components
9.2. Printed and potentially printed electronics
9.2.1. Successes so far
9.2.2. Materials employed
9.2.3. Printing technology employed
9.2.4. Multiple film then components printed on top of each other
9.3. Paper vs plastic substrates vs direct printing onto packaging
9.3.1. Paper vs plastic substrates
9.3.2. Electronic displays that can be printed on any surface
9.4. Transistors and memory inorganic
9.4.1. Nanosilicon ink
9.4.2. Zinc oxide based ink
9.5. Transistors and memory organic
9.6. Displays
9.6.1. Electrophoretic
9.6.2. Thermochromic
9.6.3. Electrochromic
9.6.4. Printed LCD
9.6.5. OLED
9.6.6. Electrowetting
9.7. Energy harvesting for packaging
9.7.1. Photovoltaics
9.7.2. Other
9.8. Batteries
9.8.1. Single use laminar batteries
9.8.2. Rechargeable laminar batteries
9.8.3. New shapes - laminar and flexible batteries
9.9. Transparent batteries and photovoltaics - NEC, Waseda University, AIST
9.10. Other important flexible components now available
9.10.1. Capacitors and supercapacitors
9.10.2. Applications for supercapacitors
9.10.3. Resistors
9.10.4. Conductive patterns for antennas, identification, keyboards etc.
9.10.5. Programming at manufacturer, purchaser or end user
9.11. New types of component - thin and flexible
9.11.1. Memristors
9.11.2. Metamaterials
9.11.3. Thin film lasers, supercabatteries, fuel cells

10. NFC IN SMART PACKAGING
10.1. NFC background
10.1.1. 2010 Turning Point
10.1.2. The biggest but least used RFID network today
10.1.3. Beyond payments and transit
10.2. Key adoption factors
10.2.1. Technologies to address challenges
10.3. Conclusions: NFC in Packaging

11. SUPPLIER AND DEVELOPER PROFILES
11.1. ACREO, Sweden
11.2. BASF, Germany
11.3. Blue Spark Technologies, USA
11.4. Canatu, Finland
11.5. CapXX, Australia
11.6. Cymbet, USA
11.7. E-Ink
11.8. Enfucell, Finland
11.9. Excellatron, USA
11.10. Fraunhofer Institute for Electronic Nano Systems (ENAS), Germany
11.11. Front Edge Technology, USA
11.12. Holst Centre, Netherlands
11.13. Infinite Power Solutions USA
11.14. Infratab, USA
11.15. Institute of Bioengineering and Nanotechnology (A*Star), Singapore
11.16. ISORG, France
11.17. Kovio, USA
11.18. Massachusetts Institute of Technology USA
11.19. MWV, USA
11.20. NEC, Japan
11.21. New University of Lisbon, Portugal
11.22. Novalia, UK
11.23. Plastic Logic, UK
11.24. PolyIC, Germany
11.25. PragmatIC Printing, UK
11.26. Printechnologics, Germany
11.27. PST Sensor, South Africa
11.28. Solarmer, USA
11.29. Soligie, USA
11.30. Thin Film Electronics, Norway
11.31. T-Ink
11.32. VTT, Finland

12. MARKET FORECASTS 2014-2024
12.1. How printed electronics is being applied
12.2. Surprisingly poor progress with low cost electronics so far
12.3. Ultimate market potential
12.4. E-packaging market 2014-2024
12.5. Beyond brand enhancement
12.6. Printed electronics market
12.7. Battery market for small devices
12.8. Printed electronics needs new design rules
12.9. The emerging value chain is unbalanced

- ACREO, Sweden
- BASF, Germany
- Blue Spark Technologies, USA
- Canatu, Finland
- CapXX, Australia
- Cymbet, USA
- E-Ink
- Enfucell, Finland
- Excellatron, USA
- Fraunhofer Institute for Electronic Nano Systems (ENAS), Germany
- Front Edge Technology, USA
- Holst Centre, Netherlands
- Infinite Power Solutions USA
- Infratab, USA
- Institute of Bioengineering and Nanotechnology (A*Star), Singapore
- ISORG, France
- Kovio, USA
- Massachusetts Institute of Technology USA
- MWV, USA
- NEC, Japan
- New University of Lisbon, Portugal
- Novalia, UK
- Plastic Logic, UK
- PolyIC, Germany
- PragmatIC Printing, UK
- Printechnologics, Germany
- PST Sensor, South Africa
- Solarmer, USA
- Soligie, USA
- Thin Film Electronics, Norway
- T-Ink
- VTT, Finland

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