• 1-800-526-8630U.S. (TOLL FREE)
  • 1-917-300-0470EAST COAST U.S.
  • +353-1-416-8900REST OF WORLD
Ericsson GSM/LTE Multi-mode Baseband Unit KDU 137 624/3 R2A Model DUS 31 01 - Product Image

Ericsson GSM/LTE Multi-mode Baseband Unit KDU 137 624/3 R2A Model DUS 31 01

  • ID: 2932977
  • August 2014
  • 46 Pages
  • EJL Wireless Research

FEATURED COMPANIES

  • Analog Devices
  • Broadcom
  • Fairchild Semiconductor
  • Maxim Integrated Products
  • NXP Semiconductors
  • ON Semiconductor
  • MORE

Design Analysis Ericsson DUS31 01 FDD/TDD LTE + GSM Baseband Unit

This report covers the design analysis of a Ericsson DUS31 01 FDD/TDD LTE + GSM. This unit is part of the RBS6000 system. The unit was manufactured between Q1 of 2013.

Key Findings:

- Advanced ASICs for high capacity LTE user support and throughput

- Advanced power management for ASICs and FPGAs

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Broadcom, Fairchild Semiconductor, Integrated Device Technology, Maxim Integrated Products, NXP Semiconductors, ON Semiconductor, Samsung Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description

Package Type
Total Pages: 46
Total Tables: 9
Total Exhibits: 36

Important Note: There is NO component pricing contained within the report.

Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Analog Devices
  • Broadcom
  • Fairchild Semiconductor
  • Maxim Integrated Products
  • NXP Semiconductors
  • ON Semiconductor
  • MORE

EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM
Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering

CHAPTER 2: DUS MECHANICAL ANALYSIS
Mechanical Analysis

CHAPTER 3: BASEBAND PROCESSING/CPRI/INTERFACE BOARD SUBSYSTEM

APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES
Table 1: Area C Bill of Materials
Table 2: DUS PCB Top Area A Bill of Materials
Table 3: DUS PCB Top Area A1 Bill of Materials
Table 4: DUS PCB Top Area A2 Bill of Materials
Table 5: DUS PCB Bottom Area B Bill of Materials
Table 6: Passive Component Case Size Distribution by System Subsection
Table 7: Identified Passive Component Supplier Distribution by System Subsection
Table 8: Active/Passive Component Distribution by System Subsection
Table 9: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS
Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System
Exhibit 2: Ericsson RBS6601 Macro Cell Main/Remote BTS System
Exhibit 3: Ericsson DUS System Block Diagram
Exhibit 4: DUS Unit, Front
Exhibit 5: DUS Unit, Back
Exhibit 6: DUS Unit, Left Side
Exhibit 7: DUS Unit, Top
Exhibit 8: DUS Unit, Bottom
Exhibit 9: DUS Faceplate, Top View
Exhibit 10: DUS Faceplate, Bottom View
Exhibit 11: DUS Faceplate, Internal View
Exhibit 12: DUS Top Shield, External View
Exhibit 13: DUS Top Shield, Internal View
Exhibit 14: DUS Bottom Shield, External View
Exhibit 15: DUS Bottom Shield, Internal View
Exhibit 16: DUS Bottom Shield, Front View
Exhibit 17: DUS 31 01 System, Exploded Side View
Exhibit 18: DUS with Top Shield Removed
Exhibit 19: DUS Semiconductor IC Heat Sink Types, Top View
Exhibit 20: DUS Semiconductor IC Heat Sink Types, Bottom View
Exhibit 21: DUS PCB, Top View w/Heat Sinks
Exhibit 22: DUS PCB Top, Area A
Exhibit 23: DUS PCB Top, Area A1 and A2
Exhibit 24: DUS PCB Bottom, Area B
Exhibit 25: DUS PCB Top Area A Component Diagram
Exhibit 26: Area C SSD Daughter Card Component Diagram, Top (L) and Bottom (R)
Exhibit 27: DUS PCB Top Area A1 Component Diagram
Exhibit 28: DUS PCB Top Area A2 Component Diagram
Exhibit 29: DUS Baseband Processing/CPRI/Interface Block Diagram
Exhibit 30: DUS PCB Bottom Area B Component Diagram
Exhibit 31: Passive Component Case Size Distribution
Exhibit 32: Identified Passive Component Market Share by Vendor
Exhibit 33: Active Semiconductor Component Share
Exhibit 34: High Pin Count IC vs. Discretes
Exhibit 35: Active Semiconductor Market Share by Vendor
Exhibit 36: High Pin Count (64+) Active Semiconductor Market Share by Vendor

Note: Product cover images may vary from those shown

- Analog Devices
- Broadcom
- Fairchild Semiconductor
- Integrated Device Technology
- Maxim Integrated Products
- NXP Semiconductors
- ON Semiconductor
- Samsung Semiconductor
- STMicroelectronics
- Texas Instruments
- Vishay Semiconductors.

Note: Product cover images may vary from those shown
Note: Product cover images may vary from those shown

RELATED PRODUCTS

Our Clients

Our clients' logos