Intel Microprocessors: Intel Manufacturing Capacity and Die Cost
In-Stat/MDR, August 2005, Pages: 44
In semiconductor manufacturing, interest in Intel's manufacturing plans and activities are high due to several factors. First, Intel is the world's largest semiconductor manufacturer with annual revenues of $34.2 billion in 2004, more than three times larger than the second largest semiconductor manufacturer Samsung. As such, Intel spends an average of $4 billion to $6 billion annually on fab capacity, including both buildings and equipment. In terms of equipment, Intel accounts for approximately 20% of all semiconductor equipment purchased annually. Finally, Intel is a leader in both microprocessors and non-volatile memory, two key semiconductor technologies that drive technical innovation and signal trends in market direction and demand.
This report provides an in-depth analysis of Intel's manufacturing capacity (wafer capacity, chip capacity, process transitions), process technology (0.13µm, 90nm, 65nm, 45nm, 32nm), 300mm capacity, static leakage problems, cost estimates, yield issues, processor cost estimates and cost trends including average manufacturing cost, average cost by generation, average cost by segment, and effect of on-die L2 cache.
- Executive Summary
- Introduction
Intel's Manufacturing Capacity & Technology
Intel's Manufacturing Cost
- Methodology
Fab Model
Processor Model
Caveats and Uncertainties
- Manufacturing Capabilities
Manufacturing Strategy
Intel's Fabs
Fab Locations and Process Technology
Investments in Manufacturing and Process Technology
Manufacturing Capacity
Wafer Capacity
Chip Capacity
Process Transitions
Semiconductor Process Technology
Technology Summary
0.13µm Processes
90nm Process
65nm Process
45nm Process
32nm Process
300mm
Static Leakage Problems
- Manufacturing Cost
Cost Estimates
The Cost Model
Process Parameters
Processor Packaging
Yield Issues
Processor Cost Estimates
Cost Trends
Average Manufacturing Cost
Average Cost by Generation
Average Cost by Segment
Effect of On-die L2 Cache
Capacity Effects
Competition
- Summary
List of Tables
- Table 1. Current and Planned Intel Fabs
- Table 2. Current and Planned Intel Test & Assembly Sites
- Table 3. Intel Capital Expenditures and R&D (US$ Billions)
- Table 4. Intel Manufacturing Processes
- Table 5. Celeron Processor Power Specifications
- Table 6. Pentium Processor Power Specifications
- Table 7. Parameters of Present and Future Intel Processors
- Table 8. Manufacturing Cost Estimates by Processor (US$)
List of Figures
- Figure 1. Total Intel Fab Capacity in P4 (Willamette) (Units in Millions)
- Figure 2. Average Manufacturing Cost of All Intel Processors (US$)
- Figure 3. Increasing Transistor Counts per Chip and Allocation to Cache Memory
- Figure 4. Fab Costs vs. Manufacturing Costs
- Figure 5. Intel Wafer Capacity †
- Figure 6. Intel Wafer Capacity (logarithmic scale)
- Figure 7. Intel Capacity and Growth Rate in Pentium 4 (Willamette Using 0.13mm Process) (Units in Thousands, Growth Rate in Percent)
- Figure 8. Percent of Wafer Production by Process
- Figure 9. Ramp Rate of Intel Manufacturing Processes
- Figure 10. Theoretical Static Leakage Currents Relative to Design Geometries
- Figure 11. Estimated Cost at Maturity by Processor Generation (US$)
- Figure 12. Intel's Average Manufacturing Cost (US$) and Die Size (mm2) per Chip
- Figure 13. Average Manufacturing Cost by Processor Generation (US$)
- Figure 14. Average Manufacturing Cost by Segment (logarithmic scale) (US$)
- Figure 15. Projected Die Sizes for Processor Cores with Varying Amounts of L2 or L3 Cache (mm2)
Intel
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