|
|
 |
|
Viewing report
|
|
|
|
IC Packaging and Interconnection 2005-2010: Key Emerging Packaging and Interconnection Technologies
BPA Consulting, March 2006
Why is this study so important?
- This report summarises the major IC packaging, module and substrate trends. Rigid both, organic and ceramic, as well as and Flex substrate trends are included.
- The IC packaging and thin core substrate market is a major business opportunity for substrate manufacturers, IC packaging houses, material suppliers and chemical suppliers.
- This report presents a comprehensive review of the key technologies, applications and business opportunities for all companies in the interconnection and packaging supply chain.
The major questions that are answered by this report:
- What are the key systems requiring new and improved IC packaging and substrate technologies?
- What are the growth drivers for the use of IC packaging and substrates?
- What are the key emerging leading edge IC packaging and advanced substrate technologies?
- What are these new technologies strengths, weaknesses, opportunities and threats?
- What will be some the winning technology and market strategies for suppliers up to 2010?
- What are the differences in the technological approaches adopted by different suppliers in different world regions?
- How will the development of electronic systems impact upon future requirements for high-speed and advanced area array IC packages and PCBs?
- What are the current and forecasted worldwide market opportunities for IC packaging and substrates for suppliers?
- Which market sectors will experience the most growth in the next five years?
Study Background
This study presents an up to date current assessment and future forecast of how the dynamic market segment of electronics interconnection and packaging will evolve over the period 2005 to 2010 will evolve.
The research program involved interviewing substrate suppliers, end users, EMS and ODM companies, materials and process equipment developers. In addition proven and reliable forecasting techniques were used to predict the future structure and size of this exciting sector.
|
|
|
|
