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Semiconductor Component Configuration of 100 Mobile Phone Models in the Chinese Market, 2005-2006 (Chinese Version)
Research In China, March 2006, Pages: 80
This report provides a detailed list of semiconductor components for 100 mobile phone models in the Chinese market, including Processor, Power Management, Radio Frequency, Memory, Sound Source and the others. 90% of the selected phone models were launched in 2005, the rest are due to be launched in 2006.
Processor: including digital baseband, analog baseband, camera back-end IC, and application processor.
Power management: including main screen white light LED driver, sub-screen white light LED driver, keypad backlight LED driver, power management, DC/DC converter, flashlight driver
RF: including power magnifier, transceiver, RF front-part
Memory: including MCP memory, NAND memory, NOR memory
Sound source: Audio CODEC, Audio magnifier, Sound source (polyphony)
Others: Including FM radio IC, EMI filter IC, Bluetooth IC, touch screen IC, infrared transmission, simulation switch IC.
This report is also available in English - please search our website for further details
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