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Thin Layer Deposition Equipment - Global Strategic Business Report

Global Industry Analysts, Inc, Aug 2011, Pages: 355


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This report analyzes the worldwide markets for Thin Layer Deposition Equipment in US$ Million. Analytics provided in the report are for equipment incorporating two major deposition techniques – Physical Vapor Deposition (PVD), and Chemical Vapor Deposition (CVD). Market analysis is provided for each of these equipment types by their respective end-use sectors - Physical Vapor Deposition (PVD) Equipment (Microelectronics, Cutting Tools, Industrial & Energy, Specialty Packaging, Data Storage, Optics, & Medical), and Chemical Vapor Deposition (CVD) Equipment (Microelectronics, Cutting Tools, Industrial, & Medical). The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2009 through 2017. Also, a six-year historic analysis is provided for these markets.

The report profiles 77 companies including many key and niche players such as

AIXTRON, Applied Materials, Inc., ASM International N.V., Canon ANELVA Corporation, CHA Industries, CVD Equipment Corporation, Denton Vacuum, LLC, Edwards Limited, Ionbond AG, Jusung Engineering Co., Ltd., KDF Electronic & Vacuum Services, Inc., Kokusai Semiconductor Equipment Corporation, Novellus Systems, Inc., OC Oerlikon Corporation AG, OEM Group, RIBER SA, Seki Technotron USA, Silicon Genesis Corporation, Tecvac Limited, Ti-Coating, Inc., Tokyo Electron Limited, Ultramet, ULVAC Technologies, Inc., Vapor Technologies, Inc., and Veeco Instruments.

Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

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